摘要:
An antireflection substrate comprising a substrate which is transparent to ultraviolet and vacuum ultraviolet rays in the wavelength region from 155 nm to 200 nm and a mono-, bi- or tri-layer antireflection film formed on at least one side of the substrate, wherein the refractive index and the physical thickness of the antireflection film at the center wavelength &lgr;0 of the wavelength region of ultraviolet or vacuum ultraviolet light which needs antireflection satisfy particular conditions, and an optical component for a semiconductor manufacturing apparatus and a substrate for a low-reflection pellicle which is the ultraviolet and vacuum ultraviolet antireflection substrate.
摘要:
An antireflection substrate comprising a substrate which is transparent to ultraviolet and vacuum ultraviolet rays in the wavelength region from 155 nm to 200 nm and a mono-, bi- or tri-layer antireflection film formed on at least one side of the substrate, wherein the refractive index and the physical thickness of the antireflection film at the center wavelength &lgr;0 of the wavelength region of ultraviolet or vacuum ultraviolet light which needs antireflection satisfy particular conditions, and an optical component for a semiconductor manufacturing apparatus and a substrate for a low-reflection pellicle which is the ultraviolet and vacuum ultraviolet antireflection substrate
摘要:
A structure for attaching a pellicle to a photomask, the pellicle comprising a pellicle frame and a pellicle sheet attached to an opening portion formed in the pellicle frame, wherein at least a portion of the pellicle frame surface in contact with the photo-mask has a direct contact with the photo-mask without interposing an adhesive.
摘要:
A pellicle comprising a box-shaped pellicle frame having top and bottom openings, and a pellicle sheet bonded to the pellicle frame to cover one of the openings of the pellicle frame, wherein the pellicle frame is made of quartz glass, a plurality of vent holes are formed as distributed on opposing side walls of the pellicle frame, and the size of the vent holes in the direction of the height of the pellicle frame is at most ⅗ of the height of the pellicle frame.
摘要:
It is characterized by having a pellicle sheet made of a synthetic quartz glass having an OH group concentration of at most 100 ppm and containing substantially no oxygen deficient defect. It is particularly preferred that the OH group concentration is at most 10 ppm, and the internal transmittance is at least 80%/cm at a wavelength of 157 nm.
摘要翻译:其特征在于,具有由OH基浓度为100ppm以下且基本上不含缺氧缺陷的合成石英玻璃制成的防护薄片。 特别优选OH基浓度为10ppm以下,内部透射率为157nm以上至少80%/ cm 3。
摘要:
The present invention provides a mask blank which comprises a substrate made of a synthetic quartz glass and a light-shielding film laminated on a surface of the substrate and is for use in a semiconductor device production technique employing an exposure light wavelength of 200 nm or shorter, wherein the mask blank has a birefringence, as measured at a wavelength of 193 nm, of 1 nm or less per substrate thickness. According to the present invention, mask blanks suitable for use in the immersion exposure technique and the polarized illumination technique are provided.
摘要:
The present invention provides a mask blank which comprises a substrate made of a synthetic quartz glass and a light-shielding film laminated on a surface of the substrate and is for use in a semiconductor device production technique employing an exposure light wavelength of 200 nm or shorter, wherein the mask blank has a birefringence, as measured at a wavelength of 193 nm, of 1 nm or less per substrate thickness. According to the present invention, mask blanks suitable for use in the immersion exposure technique and the polarized illumination technique are provided.
摘要:
The present invention provides a TiO2—SiO2 glass whose coefficient of linear thermal expansion in the range of the time of irradiation with EUV light is substantially zero when used as an optical member of an exposure tool for EUVL and which has extremely high surface smoothness. The present invention relates to a TiO2-containing silica glass having a TiO2 content of from 7.5 to 12% by mass, a temperature at which a coefficient of linear thermal expansion is 0 ppb/° C., falling within the range of from 40 to 110° C., and a standard deviation (σ) of a stress level of striae of 0.03 MPa or lower within an area of 30 mm×30 mm in at least one plane.
摘要:
The present invention provides a TiO2—SiO2 glass whose coefficient of linear thermal expansion in the range of the time of irradiation with EUV light is substantially zero when used as an optical member of an exposure tool for EUVL and which has extremely high surface smoothness. The present invention relates to a TiO2-containing silica glass having a TiO2 content of from 7.5 to 12% by mass, a temperature at which a coefficient of linear thermal expansion is 0 ppb/° C., falling within the range of from 40 to 110° C., and a standard deviation (σ) of a stress level of striae of 0.03 MPa or lower within an area of 30 mm×30 mm in at least one plane.
摘要:
The present invention is to provide a TiO2—SiO2 glass whose coefficient of linear thermal expansion at the time of irradiating with high EUV energy light becomes substantially zero when used as an optical member of an exposure tool for EUVL. The present invention relates to a TiO2-containing silica glass, having a fictive temperature of 1,000° C. or lower, a OH concentration of 600 ppm or higher, a temperature at which the coefficient of linear thermal expansion becomes 0 ppb/° C. of from 40 to 110° C., and an average coefficient of linear thermal expansion in the temperature range of 20 to 100° C., of 50 ppb/° C. or lower.