公开(公告)号：US07200923B2

公开(公告)日：2007-04-10

申请号：US10746017

申请日：2003-12-23

申请人： Satoshi Matsumura ,  Tatsuo Ito ,  Yoshiyuki Toishi ,  Taishin Kameda

发明人： Satoshi Matsumura ,  Tatsuo Ito ,  Yoshiyuki Toishi ,  Taishin Kameda

IPC分类号： A41H37/06

CPC分类号： A44B19/62 ,  Y10T29/49782 ,  Y10T29/53291 ,  Y10T29/53296 ,  Y10T29/533

摘要： There are provided left and right gripper devices for holding left and right tip side portions of a slide fastener chain, transferring the fastener chain in a longitudinal direction (an X-axis direction) and opening and closing the left and right tip side portions in a Y-axis direction orthogonal to the X-axis direction based on a command sent from operation control means. There is provided an electric motor for controllably driving the left and right gripper devices in the X-Y axis direction based on a command sent from a numeric control section of the operation control means in the X-Y axis direction of the gripper devices. A slider can be automatically inserted by only a specified operation using a single device without preparing a special device for all types of fastener chains and sliders and requiring a time for a considerable reconstruction.

摘要翻译： 提供了用于保持拉链链条的左右两侧部分的左右夹持装置，在拉伸链条的纵向（X轴方向）上传送拉链链条，并将拉链链条的左右前端侧部分打开和关闭 基于从操作控制装置发送的命令与X轴方向正交的Y轴方向。 提供一种电动马达，用于基于从操作控制装置的数字控制部分沿着夹持装置的X-Y轴方向发送的命令可控地驱动左和右夹持装置在X-Y轴方向上。 只有使用单个设备的指定操作才能自动插入滑块，而无需为所有类型的紧固件链条和滑块准备特殊设备，并需要大量重建的时间。

公开(公告)号：US08437016B2

公开(公告)日：2013-05-07

申请号：US11685966

申请日：2007-03-14

申请人： Hisanori Takahashi ,  Tatsuo Ito

发明人： Hisanori Takahashi ,  Tatsuo Ito

IPC分类号： G06F3/12 ,  H04N1/00 ,  H04N1/32 ,  H04N1/04

CPC分类号： H04N1/32133 ,  H04N1/00968 ,  H04N2201/0094

摘要： A flow implementation system is disclosed. The flow implementation system implements a flow created by a user into an image processing apparatus having at least one of a plotter and a scanner. The system includes a tool providing unit that provides the user with a tool for creating the flow by combining plural operations executable by the image processing apparatus and a condition for switching a path among the operations, and a flow implementing unit that implements the flow created by the user into the image processing apparatus.

摘要翻译： 公开了一种流程实现系统。 流程实现系统将由用户创建的流程实现为具有绘图仪和扫描仪中的至少一个的图像处理设备。 该系统包括工具提供单元，其通过组合由图像处理装置执行的多个操作和用于切换操作之间的路径的条件来向用户提供用于创建流程的工具;以及流程实现单元，其实现由 用户进入图像处理装置。

公开(公告)号：US07535284B2

公开(公告)日：2009-05-19

申请号：US11959369

申请日：2007-12-18

申请人： Tatsuo Ito

发明人： Tatsuo Ito

IPC分类号： G05F1/10

CPC分类号： H03K17/16 ,  H02M3/156 ,  H03K17/165 ,  H03K17/28 ,  H03K17/284 ,  H03K17/6872

摘要： A switching control circuit, controlling a transistor, of a voltage generating circuit generating an output voltage of a target level from an input voltage applied to the transistor, comprising: an error amplifier circuit outputting an error voltage obtained by amplifying an error between a voltage according to the output voltage and a first reference voltage; a first comparison circuit comparing the error voltage with a second reference voltage to output a first control voltage; a second comparison circuit comparing the error voltage with a third reference voltage to output first and second voltages a charging and discharging circuit for charging and discharging a capacitor based on the first and second voltages; a third comparison circuit comparing a charged voltage of the capacitor with a fourth reference voltage; and a control circuit outputting a second control voltage for turning off the transistor according to a result of the third comparison circuit.

摘要翻译： 一种开关控制电路，用于控制从施加到晶体管的输入电压产生目标电平的输出电压的电压产生电路的晶体管，包括：误差放大器电路，输出通过放大电压之间的误差而获得的误差电压 到所述输出电压和第一参考电压; 将误差电压与第二参考电压进行比较以输出第一控制电压的第一比较电路; 第二比较电路，将误差电压与第三参考电压进行比较，以输出第一和第二电压，用于基于第一和第二电压对电容器进行充电和放电的充电和放电电路; 比较电容器的充电电压与第四参考电压的第三比较电路; 以及根据第三比较电路的结果输出用于截止晶体管的第二控制电压的控制电路。

公开(公告)号：US07342867B2

公开(公告)日：2008-03-11

申请号：US10509097

申请日：2003-12-02

申请人： Tatsuo Ito ,  Teruhiro Shiono ,  Hiroaki Yamamoto ,  Seiji Nishino

发明人： Tatsuo Ito ,  Teruhiro Shiono ,  Hiroaki Yamamoto ,  Seiji Nishino

IPC分类号： G11B7/135 ,  G11B7/00

CPC分类号： G11B7/13927 ,  G11B7/0948 ,  G11B7/1267 ,  G11B7/1369 ,  G11B7/1378 ,  G11B2007/0013 ,  G11B2007/13727

摘要： An object of the present invention is to acquire optimum recording characteristics of an optical recoding medium having multiple data layers, with respect to each of the multiple data layers without increasing learning time required for learning a relation between aberration amount and optimum recording compensation with respect to each of the multiple data layers. The present invention includes a wavefront converter which is driven in such a manner as to reduce the aberration amount detected by an aberration detector. An output controller holds learned data as to the relation between the driving amount of the wavefront converter and the output of a light source, and controls the output of the light source based on the driving amount of the wavefront converter and the learned data.

摘要翻译： 本发明的目的是为了获得关于多个数据层中的每一个的多个数据层的光学记录介质的最佳记录特性，而不增加学习像差量和最佳记录补偿之间的关系所需要的学习时间 每个多个数据层。 本发明包括以减少由像差检测器检测到的像差量的方式驱动的波前转换器。 输出控制器保持关于波前转换器的驱动量与光源的输出之间的关系的学习数据，并且基于波前转换器的驱动量和学习数据来控制光源的输出。

公开(公告)号：US07210152B2

公开(公告)日：2007-04-24

申请号：US10814187

申请日：2004-04-01

申请人： Eishin Mori ,  Tatsuo Ito

发明人： Eishin Mori ,  Tatsuo Ito

IPC分类号： G11B7/08

CPC分类号： G11B7/1376 ,  G11B7/22

摘要： Disclosed is an optical head, which comprises a semiconductor laser, a collimator lens for converting a beam emitted from the semiconductor laser light into parallel beam, a lens frame holding the collimator lens, a beam shaping prism for shaping the parallel beam passing through the collimator lens from an elliptic section into a circular section, an objective lens for converging the parallel beam passing through the beam shaping device on an optical recording medium formed with a track, and a photodetector for detecting a reflected light or transmitted light from an optical disk. The collimator lens is adhesively fixed to the lens frame at two positions opposed to one another along a radial direction corresponding to the minor axis direction of the cross section of the incoming parallel beam into the beam shaping prism. The optical head can suppress the displacement of detected-light spots in an photodetector caused by the displacement of an optical axis due to change in ambient temperature.

摘要翻译： 公开了一种光学头，其包括半导体激光器，用于将从半导体激光发射的光束转换为平行光束的准直透镜，保持准直透镜的透镜框，用于使通过准直器的平行光束成形的光束整形棱镜 透镜从椭圆形部分转换成圆形部分，用于将通过光束整形装置的平行光束会聚在形成有光道的光学记录介质上的物镜，以及用于检测来自光盘的反射光或透射光的光电检测器。 准直透镜沿对应于入射平行光束的横截面的短轴方向的光束整形棱镜的径向相对的两个位置被粘合地固定到透镜框架。 光头可以抑制由于环境温度的变化而导致的光轴位移引起的光检测器中的检测光斑的位移。

公开(公告)号：US07193955B2

公开(公告)日：2007-03-20

申请号：US10802464

申请日：2004-03-17

申请人： Tatsuo Ito ,  Teruhiro Shiono ,  Seiji Nishino ,  Hiroaki Yamamoto

发明人： Tatsuo Ito ,  Teruhiro Shiono ,  Seiji Nishino ,  Hiroaki Yamamoto

IPC分类号： G11B7/00

CPC分类号： G11B7/131 ,  G11B7/133 ,  G11B2007/0013

摘要： An optical head device includes: an optical element collecting light reflected from a reproduction information layer (a target information layer in an optical information recording medium) and light reflected from information layers adjacent to the reproduction information layer at different positions; a light receiving element obtaining a detection signal from the reflected light collected by this optical element; and arithmetic circuitry obtaining a reproduction signal from this detection signal. The light receiving element includes: a first light receiving portion detecting a first detection signal from light containing the light reflected from the reproduction information layer; a second light receiving portion detecting a second detection signal from light reflected from a first adjacent information layer located more distant from the condensing lens than the reproduction information layer; and a third light receiving portion detecting a third detection signal from light reflected from a second adjacent information layer located closer to the condensing lens than the reproduction information layer. The arithmetic circuitry uses constants K and L determined depending on spaces between the reproduction information layer and the adjacent information layers, so as to subtract the K-times second detection signal and the L-times third detection signal from the first detection signal.

摘要翻译： 光头装置包括：收集从再现信息层（光信息记录介质中的目标信息层）反射的光的光学元件和在不同位置处与再现信息层相邻的信息层反射的光; 光接收元件，从由该光学元件收集的反射光获得检测信号; 以及算术电路，从该检测信号获得再现信号。 光接收元件包括：第一光接收部分，从包含从再现信息层反射的光的光检测第一检测信号; 第二光接收部分，从与再现信息层相比位于比聚光透镜更远的第一相邻信息层反射的光中检测第二检测信号; 以及第三光接收部分，从与再现信息层相比更靠近聚光透镜的第二相邻信息层反射的光检测第三检测信号。 算术电路使用根据再现信息层和相邻信息层之间的空格确定的常数K和L，以便从第一检测信号中减去K倍的第二检测信号和L倍的第三检测信号。

公开(公告)号：US06962035B2

公开(公告)日：2005-11-08

申请号：US10695912

申请日：2003-10-30

申请人： Akira Yamamoto ,  Yoshio Iwasaki ,  Yukio Nakagawa ,  Yasushi Yamaguchi ,  Tatsuo Ito

发明人： Akira Yamamoto ,  Yoshio Iwasaki ,  Yukio Nakagawa ,  Yasushi Yamaguchi ,  Tatsuo Ito

IPC分类号： B65B9/10 ,  B65B15/04 ,  B65B61/00

CPC分类号： B65B61/28 ,  B65B9/2021 ,  B65B9/207 ,  B65B15/04 ,  B65B51/306 ,  B65B61/16

摘要： A bag manufacturing and packaging apparatus includes a bag manufacturing unit that tubularly forms a strip film and manufactures a bag filled with articles; a feed roller unit that feeds a strip, to which the bag manufactured by the bag manufacturing unit is mounted; and a mounting unit that mounts the bag to the strip fed by the feed roller unit. The strip is rectilinearly maintained between the feed roller unit and the mounting unit by imparting a bend on the strip in the transverse cross section that intersects a transport pathway of the strip. The object of the present invention is to provide a bag manufacturing and packaging apparatus that, even if the strip to which bags are mounted lacks rigidity, can smoothly feed the strip, automatically thread the strip to the mounting unit, and form appropriate slits in the strip.

摘要翻译： 袋制造和包装设备包括：袋制造单元，其管状地形成带状膜并制造填充有物品的袋; 馈送辊单元，其供给由袋制造单元制造的袋安装在其上的条; 以及将袋安装到由进给辊单元供给的带的安装单元。 通过在与条带的输送路径相交的横截面中在条带上施加弯曲，将带条直线地保持在进给辊单元和安装单元之间。 本发明的目的是提供一种制袋包装装置，即使安装有袋子的条带缺乏刚性，也能够平滑地进给条带，自动地将条带螺纹连接到安装单元上，并在其中形成合适的狭缝 跳闸。

公开(公告)号：US20050107290A1

公开(公告)日：2005-05-19

申请号：US10875382

申请日：2004-06-25

申请人： Tatsuo Ito ,  Toshifumi Ozaki ,  Mamoru Ouchida

发明人： Tatsuo Ito ,  Toshifumi Ozaki ,  Mamoru Ouchida

IPC分类号： A61K38/00 ,  A61K38/12 ,  A61P35/00 ,  C07K5/12

CPC分类号： A61K38/005 ,  A61K31/19 ,  A61K31/4406 ,  A61K38/12

摘要： The present invention relates to a therapeutic agent for soft tissue sarcoma (particularly synovial sarcoma), which contains a histone deacetylase inhibitor (particularly compound A) as an active ingredient.

摘要翻译： 本发明涉及含有组蛋白脱乙酰酶抑制剂（特别是化合物A）作为活性成分的软组织肉瘤（特别是滑膜肉瘤）治疗剂。

公开(公告)号：US5232870A

公开(公告)日：1993-08-03

申请号：US754767

申请日：1991-09-04

申请人： Tatsuo Ito ,  Yasuaki Nakazato

发明人： Tatsuo Ito ,  Yasuaki Nakazato

IPC分类号： H01L21/02 ,  H01L21/20 ,  H01L21/316 ,  H01L21/762 ,  H01L27/12

CPC分类号： H01L21/76251 ,  H01L21/2007 ,  H01L21/31654 ,  Y10S148/012 ,  Y10S438/974

摘要： A bonded wafer enjoying high strength of bonding of component wafers thereof is produced by a method which comprises causing the surfaces for mutual attachment of two semiconductor wafers to be irradiated with an ultraviolet light in an atmosphere of oxygen immediately before the two semiconductor wafers are joined to each other. One of the two semiconductor wafers to be used for the bonded wafer optionally has an oxide film formed on one surface thereof. One of the component wafers of the bonded wafer is optionally polished until the component wafer is reduced to a thin film.

公开(公告)号：US5152857A

公开(公告)日：1992-10-06

申请号：US672979

申请日：1991-03-21

申请人： Tatsuo Ito ,  Atsuo Uchiyama ,  Masao Fukami

发明人： Tatsuo Ito ,  Atsuo Uchiyama ,  Masao Fukami

IPC分类号： H01L21/02 ,  H01L21/20 ,  H01L21/304 ,  H01L21/762 ,  H01L27/12

CPC分类号： H01L21/304 ,  H01L21/2007 ,  H01L21/76251 ,  Y10S148/012 ,  Y10S148/135 ,  Y10T156/1064

摘要： In a method for preparing a substrate for semiconductor device, the substrate is prepared either by directly bonding a bonding wafer to a base wafer or by bonding the bonding wafer to the base wafer with an oxide film formed on at least the bonding surface of the bonding wafer or the bonding surface of the base wafer to make finished semiconductor devices with an SOI structure. Prior to the bonding operation, the bonding wafer and the base wafer are subjected to the steps of (1) making the diameter of the bonding wafer smaller than the diameter of the base wafer, (2) setting the beveling width of the back side (bonding side) of the bonding wafer at 50 microns or less, and (3) beveling the front side of said base wafer so that the bonding surface of the base wafer is equal in size to the bonding surface of the bonding wafer. When the bonding wafer, which has been bonded to the base wafer, is subjected to polishing into a thin film, the peripheral portions of the bonding wafer form a smooth surface of the base wafer. This prevents the peripheral portions from chipping off.