公开(公告)号：US20210408344A1

公开(公告)日：2021-12-30

申请号：US17363227

申请日：2021-06-30

Applicant: SCHOTT AG

Inventor： Frank Gindele ,  Christian Rakobrandt ,  Alexander Neumeier ,  Robert Hettler

IPC: H01L33/56 ,  H01L33/64 ,  H01L33/32

Abstract: A stable, hermetically sealed, partially optically transparent package for use to protect optoelectronic components is provided. The package has good cooling for the installed circuit elements and is as stable in relation to temperature and UV. The package has a cap with a frame made of a nitride ceramic and a glass element. The frame has an opening and the glass element hermetically closes the opening. The glass is fused onto the nitride ceramic and is fixed in contact with the nitride ceramic of the frame.

公开(公告)号：US09069107B2

公开(公告)日：2015-06-30

申请号：US13940333

申请日：2013-07-12

Applicant: Schott AG

Inventor： Robert Hettler ,  Frank Gindele ,  Edgar Pawlowski

IPC: G02B27/10 ,  G02B3/00

CPC classification number: G02B3/0018 ,  G02B3/00 ,  G02B3/0068 ,  G02B3/0087

Abstract: A rod lens and methods for producing such a rod lens are disclosed. The rod lens and methods include a sealing glass and holder glass or a metallic holder that are heated so that only the sealing glass melts and forms a spherical cap to define a lens element joined to a light guiding element. A plurality of rod lenses may form an array arrangement.

Abstract translation: 公开了棒状透镜及其制造方法。 棒状透镜和方法包括密封玻璃和保持器玻璃或金属保持器，其被加热，使得仅密封玻璃熔化并形成球形帽以限定连接到导光元件的透镜元件。 多个棒状透镜可以形成阵列布置。

公开(公告)号：US11560993B2

公开(公告)日：2023-01-24

申请号：US16989656

申请日：2020-08-10

Applicant: SCHOTT AG

Inventor： Frank Gindele ,  Edgar Pawlowski ,  Christian Rakobrandt ,  Christoph Stangl

IPC: F21S41/176 ,  F21S41/16 ,  F21S45/47 ,  F21S41/20

Abstract: Lighting devices for providing a secondary light with high luminance are provided. The lighting devices include a light conversion element and a light emitting unit with a light source that emits a primary light. The light conversion element has a front side illuminated with the primary light and, in response to the primary light, to emit a secondary light from the front side. The secondary light has a larger wavelength than the primary light.

公开(公告)号：US20210041084A1

公开(公告)日：2021-02-11

申请号：US16989680

申请日：2020-08-10

Applicant: SCHOTT AG

Inventor： Frank Gindele ,  Edgar Pawlowski ,  Christian Rakobrandt ,  Christoph Stangl

IPC: F21V9/32 ,  F21V8/00 ,  F21V29/70 ,  F21V29/502

Abstract: A lighting device is provided that includes light emitting unit that emits primary light and a light conversion element that is illuminated with the primary light and emits secondary light of another wavelength. The light conversion element has a front side defining a primary light receiving surface that received the primary light and a secondary light emitting surface that emits the secondary light. The light conversion element has a variable thickness at the primary light receiving surface and/or in the secondary light emitting surface.

公开(公告)号：US10890318B2

公开(公告)日：2021-01-12

申请号：US15060866

申请日：2016-03-04

Applicant: SCHOTT AG

Inventor： Frank Gindele ,  Christian Rakobrandt

IPC: F21V33/00 ,  H01L25/16 ,  F21K9/20 ,  A61B1/06 ,  A61C1/08 ,  A61C3/02 ,  F21K9/90 ,  F21V3/00 ,  F21V17/10 ,  F21V31/00 ,  F21Y101/00 ,  F21W131/20

Abstract: A hermetically sealed LED light is provided that includes a ceramic base with a plurality of LEDs and a metal cap soldered thereto and a channel for introducing an electrical, optical, or mechanical component.

公开(公告)号：US12084374B2

公开(公告)日：2024-09-10

申请号：US17161278

申请日：2021-01-28

Applicant: SCHOTT AG

Inventor： Frank Gindele ,  Christian Rakobrandt ,  Kazuhito Miyawaki ,  Robert Hettler ,  Takahisa Uchida

IPC: C03B23/02 ,  C03B23/203 ,  C25D3/12 ,  H01L33/00 ,  H01L33/56

CPC classification number: C03B23/203 ,  C03B23/02 ,  C25D3/12 ,  H01L33/0095 ,  H01L33/56 ,  C03B2215/41 ,  C03B2215/46

Abstract: A method is provided for producing a patterned glass wafer for packaging electronic devices in a wafer assembly. The method includes placing a glass sheet between two mold halves and heating until the glass sheet softens, while the mold halves are pressed against one another so that the glass sheet is reshaped and forms a patterned glass wafer. The first mold half has an array of projections and the second mold half has an array of recesses. The mold halves are arranged and shaped so that the recesses and projections oppose each other. The projections introduce cavities into the glass sheet during the reshaping and with the glass flowing into the recesses of the second mold half during the reshaping. The recesses are deep enough for the glass to at least partially not come in contact therewith and to form a convexly shaped glass surface in each recess.

公开(公告)号：US11933485B2

公开(公告)日：2024-03-19

申请号：US17103217

申请日：2020-11-24

Applicant: SCHOTT AG

Inventor： Frank Gindele ,  Christian Rakobrandt

IPC: F21V33/00 ,  A61B1/06 ,  A61C1/08 ,  A61C3/02 ,  F21K9/20 ,  F21K9/90 ,  F21V3/00 ,  F21V17/10 ,  F21V31/00 ,  H01L25/16 ,  H01L33/00 ,  F21W131/20 ,  F21Y101/00

CPC classification number: F21V33/0068 ,  A61B1/0684 ,  A61C1/088 ,  A61C3/02 ,  F21K9/20 ,  F21K9/90 ,  F21V3/00 ,  F21V17/101 ,  F21V31/00 ,  H01L25/167 ,  H01L33/005 ,  F21W2131/20 ,  F21Y2101/00 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A hermetically sealed LED light is provided that includes a ceramic base with a plurality of LEDs and a metal cap soldered thereto and a channel for introducing an electrical, optical, or mechanical component.

公开(公告)号：US20210384384A1

公开(公告)日：2021-12-09

申请号：US17341228

申请日：2021-06-07

Applicant: SCHOTT AG

Inventor： Frank Gindele ,  Christian Rakobrandt ,  Alexander Neumeier ,  Robert Hettler

IPC: H01L33/48 ,  H01L33/62

Abstract: An optoelectronic module is provided that has a carrier element, an optoelectronic element on the carrier element, a cover, and a cavity. The cover has a frame surrounding the optoelectronic element and connected to the carrier element. A glass element is on the frame lying substantially opposite the carrier element for the input and/or output of electromagnetic radiation. The cavity is inside a volume that is delimited by an inner surface of the cover and a surface of the carrier element. The optoelectronic element is arranged in the cavity and enclosed by the cover hermetically and/or in an autoclavable fashion. A filler material is in the cavity to compensate for an expansion of a volume occupied by the filler material and has a first deformable compensation volume, which is arranged adjacent to a subregion of the cover and/or of the carrier element.

公开(公告)号：US20210230041A1

公开(公告)日：2021-07-29

申请号：US17161278

申请日：2021-01-28

Applicant: SCHOTT AG

Inventor： Frank Gindele ,  Christian Rakobrandt ,  Kazuhito Miyawaki ,  Robert Hettler ,  Takahisa Uchida

IPC: C03B23/203 ,  C03B23/02 ,  C25D3/12 ,  H01L33/00 ,  H01L33/56

Abstract: A method is provided for producing a patterned glass wafer for packaging electronic devices in a wafer assembly. The method includes placing a glass sheet between two mold halves and heating until the glass sheet softens, while the mold halves are pressed against one another so that the glass sheet is reshaped and forms a patterned glass wafer. The first mold half has an array of projections and the second mold half has an array of recesses. The mold halves are arranged and shaped so that the recesses and projections oppose each other. The projections introduce cavities into the glass sheet during the reshaping and with the glass flowing into the recesses of the second mold half during the reshaping. The recesses are deep enough for the glass to at least partially not come in contact therewith and to form a convexly shaped glass surface in each recess.

公开(公告)号：US20210044073A1

公开(公告)日：2021-02-11

申请号：US16989690

申请日：2020-08-10

Applicant: SCHOTT AG

Inventor： Frank Gindele ,  Edgar Pawlowski ,  Christian Rakobrandt ,  Christoph Stangl

IPC: H01S3/04 ,  H01S3/067

Abstract: A light conversion device is provided that includes a main body and a light conversion arrangement. The main body includes heatsink and is on a back side of the light conversion arrangement. The light conversion arrangement has a front side with light conversion elements separated from one another at least regionally by a trench. The light conversion elements, when irradiated with primary light on the front side, are configured to emit secondary light having a different wavelength from the front side.