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    LIGHT EMITTING DIODES INCLUDING TRANSPARENT OXIDE LAYERS
    3.
    发明申请
    LIGHT EMITTING DIODES INCLUDING TRANSPARENT OXIDE LAYERS 有权
    发光二极管，包括透明氧化层

    公开(公告)号：US20070284604A1

    公开(公告)日：2007-12-13

    申请号：US11842350

    申请日：2007-08-21

    申请人： David Slater ,  Robert Glass ,  Charles Swoboda ,  Bernd Keller ,  James Ibbetson ,  Brian Thibeault ,  Eric Tarsa

    发明人： David Slater ,  Robert Glass ,  Charles Swoboda ,  Bernd Keller ,  James Ibbetson ,  Brian Thibeault ,  Eric Tarsa

    IPC分类号： H01L33/00

    CPC分类号： H01L33/20 ,  H01L33/10 ,  H01L33/405 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32014 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Light emitting diodes include a substrate having first and second opposing faces and that is transparent to optical radiation in a predetermined wavelength range and that is patterned to define, in cross-section, a plurality of pedestals that extend into the substrate from the first face towards the second face. A diode region on the second face is configured to emit light in the predetermined wavelength range, into the substrate upon application of voltage across the diode region. A mounting support on the diode region, opposite the substrate is configured to support the diode region, such that the light that is emitted from the diode region into the substrate, is emitted from the first face upon application of voltage across the diode region. A reflector is provided between the mounting support and the diode region, that is configured to reflect light that is emitted from the diode region back into the diode region, through the substrate that is transparent to optical radiation in the predetermined wavelength range and from the plurality of pedestals, upon application of voltage across the diode region. A layer of Indium Tin Oxide (ITO) is provided between the reflector and the diode region.

    摘要翻译： 发光二极管包括具有第一和第二相对面并且对于预定波长范围内的光辐射透明的衬底，其被图案化以在横截面中限定多个基座，其从第一面朝向 第二张脸。 第二面上的二极管区域被配置为在施加二极管区域上的电压时将预定波长范围内的光发射到衬底中。 配置在与衬底相对的二极管区域上的安装支撑件被配置为支撑二极管区域，使得从二极管区域发射到衬底中的光在施加二极管区域上的电压时从第一面发射。 在安装支撑件和二极管区域之间提供反射器，其被配置为将从二极管区域发射的光反射回二极管区域，穿过对于预定波长范围内的光辐射透明的基板和从多个 在二极管区域施加电压时， 在反射器和二极管区域之间设置一层氧化铟锡（ITO）。

    High efficiency group III nitride-silicon carbide light emitting diode
    4.
    发明申请
    High efficiency group III nitride-silicon carbide light emitting diode 有权
    高效率III族氮化硅 - 碳化硅发光二极管

    公开(公告)号：US20060060877A1

    公开(公告)日：2006-03-23

    申请号：US10951042

    申请日：2004-09-22

    申请人： John Edmond ,  Jayesh Bharathan ,  David Slater

    发明人： John Edmond ,  Jayesh Bharathan ,  David Slater

    IPC分类号： H01L33/00

    CPC分类号： H01L33/36 ,  H01L33/007

    摘要： A method and resulting structures are disclosed for fabricating a high efficiency high extraction light emitting diode suitable for packaging. The method includes the steps of adding a light emitting active portion of wide-bandgap semiconductor material to a conductive silicon carbide substrate, joining the added active portion to a conductive sub-mounting structure, and removing a portion of the silicon carbide substrate opposite the added active portion to thereby reduce the overall thickness of the joined substrate, active portion and sub-mounting structure. The resulting the sub-mounting structure can be joined to a lead frame with the active portion positioned between the silicon carbide substrate and the sub-mounting structure to thereby use the sub-mounting structure to separate the active portion from the lead frame and avoid undesired electrical contact between the active portion and the lead frame.

    摘要翻译： 公开了一种制造适用于包装的高效率高抽提发光二极管的方法和结果。 该方法包括以下步骤：将宽带隙半导体材料的发光有源部分添加到导电碳化硅基板，将添加的有源部分接合到导电子安装结构，并且将与添加的相邻的碳化硅基板相对的一部分 从而减小接合的基板，有源部分和副安装结构的整体厚度。 所得到的子安装结构可以连接到引线框架，其中有源部分位于碳化硅基板和子安装结构之间，从而使用子安装结构将有源部分与引线框架分开，并避免不必要的 有源部分和引线框架之间的电接触。

    Vehicle compass system with continuous automatic calibration
    6.
    发明申请
    Vehicle compass system with continuous automatic calibration 有权

    公开(公告)号：US20070163132A1

    公开(公告)日：2007-07-19

    申请号：US11709602

    申请日：2007-02-22

    申请人： Jeffrey Parks ,  Thomas Olson ,  David Slater

    发明人： Jeffrey Parks ,  Thomas Olson ,  David Slater

    IPC分类号： G01C17/38

    CPC分类号： G01C17/38

    摘要： The compass system of the present invention utilizes an improved calibration routine in which a processing circuit of the compass recalibrates the compass each time three data points are obtained from a magnetic field sensor that meet predetermined criteria. One such criterion is that the three data points define corners of a triangle that is substantially non-obtuse. When three data points have been obtained that define a triangle meeting this criterion, the processing circuit calculates a center point for a circle upon which all three data points lie by solving the equation x2+y2+Ax+By+C=0 for A, B, and C, using the coordinate values (x,y) for the three data points and defining the center point as (−A/2, −B/2).

    Methods of processing semiconductor wafer backsides having light emitting devices (LEDS) thereon and leds so formed
    7.
    发明申请
    Methods of processing semiconductor wafer backsides having light emitting devices (LEDS) thereon and leds so formed 有权
    处理其上具有发光器件（LEDS）的半导体晶片背面和如此形成的LED的方法

    公开(公告)号：US20050151138A1

    公开(公告)日：2005-07-14

    申请号：US10987135

    申请日：2004-11-12

    申请人： David Slater ,  Matthew Donofrio

    发明人： David Slater ,  Matthew Donofrio

    IPC分类号： H01L21/78 ,  H01L33/00 ,  H01L33/20 ,  H01L21/00 ,  H01L27/15 ,  H01L29/26 ,  H01L31/12

    CPC分类号： H01L33/0095 ,  H01L21/78 ,  H01L33/20

    摘要： Processing a semiconductor wafer can include forming a plurality of Light Emitting Devices (LED) on a semiconductor wafer having a first thickness. The plurality of LEDs on the wafer are brought into contact with a surface of a carrier to couple the wafer to the carrier. The first thickness of the wafer is reduced to a second thickness that is less than the first thickness by processing the backside of the wafer. The carrier is separated from the plurality of LEDs on the wafer and the wafer is cut to separate the plurality of LEDs from one another. Related devices are also disclosed.

    摘要翻译： 处理半导体晶片可以包括在具有第一厚度的半导体晶片上形成多个发光器件（LED）。 使晶片上的多个LED与载体的表面接触以将晶片耦合到载体。 通过处理晶片的背面，将晶片的第一厚度减小到小于第一厚度的第二厚度。 载体与晶片上的多个LED分离，并且切割晶片以将多个LED彼此分离。 还公开了相关设备。

    VEHICLE COMPASS SYSTEM WITH CONTINUOUS AUTOMATIC CALIBRATION
    10.
    发明申请
    VEHICLE COMPASS SYSTEM WITH CONTINUOUS AUTOMATIC CALIBRATION 有权
    具有连续自动校准的车辆指导系统

    公开(公告)号：US20080120054A1

    公开(公告)日：2008-05-22

    申请号：US12022039

    申请日：2008-01-29

    申请人： Jeffrey Parks ,  Thomas Olson ,  David Slater

    发明人： Jeffrey Parks ,  Thomas Olson ,  David Slater

    IPC分类号： G01C17/38 ,  G01C17/02

    CPC分类号： G01C17/38

    摘要： The compass system of the present invention utilizes an improved calibration route in which a processing circuit of the compass recalibrates the compass each time three data points are obtained from a magnetic field sensor that meet predetermined criteria. One such criterion is that the three data points define corners of a triangle that is substantially non-obtuse. When three data points have been obtained that define a triangle meeting this criterion, the processing circuit calculates a center point for a circle upon which all three data points lie by solving the equation x2+y2+Ax+By+C=0 for A, B, and C, using the coordinate values (x,y) for the three data points and defining the center point as (−A/2, −B/2).

    摘要翻译： 本发明的罗盘系统利用改进的校准路线，其中每当从满足预定标准的磁场传感器获得三个数据点时，罗盘的处理电路重新校准罗盘。 一个这样的标准是三个数据点定义基本上不钝的三角形的角。 当获得定义满足该标准的三角形的三个数据点时，处理电路通过求解方程式来计算所有三个数据点所在的圆的中心点， 对于A，B和C，使用三个数据点的坐标值（x，y）并将中心点定义为（-A / 2，-B / 2）。