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公开(公告)号:US20080138934A1
公开(公告)日:2008-06-12
申请号:US12019439
申请日:2008-01-24
申请人: Se-Nyun KIM , Heung-Kyu KWON , Ki-Myung YOON
发明人: Se-Nyun KIM , Heung-Kyu KWON , Ki-Myung YOON
IPC分类号: H01L21/60
CPC分类号: H01L25/50 , H01L23/49816 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01079 , H01L2924/14 , H01L2924/1461 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H05K3/3436 , H05K3/3484 , H05K2201/035 , H05K2201/10515 , Y02P70/613 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A method of manufacturing a multi-stack package that ensures easy application of a solder paste or a flux. The method includes forming a first package comprising a first substrate on which bumps are arranged and a second package comprising a second substrate on which electrode pads corresponding to the bumps are arranged, applying a solder paste on the bumps of the first package, and electrically connecting the bumps of the first package and the electrode pads of the second package.
摘要翻译: 一种制造多层封装的方法,其确保容易地应用焊膏或焊剂。 该方法包括形成第一封装,其包括布置有凸块的第一基板和包括第二基板的第二封装,第二基板上布置有与凸块对应的电极焊盘,在第一封装的凸块上施加焊膏, 第一封装的凸块和第二封装的电极焊盘。