Die resistance-capacitance extraction and validation

    公开(公告)号:US10585996B2

    公开(公告)日:2020-03-10

    申请号:US15869542

    申请日:2018-01-12

    Abstract: Systems and methods for die resistance-capacitance (RC) extraction and validation are described. In one embodiment, the method includes generating a chip power model (CPM) based at least in part on single domain excitation to determine a die capacitance; and performing loop-based static IR drop analysis to determine a die resistance for each power domain of a die. In some cases, the generating of the chip power model (CPM) includes generating a separate CPM for each power domain of the die.

    CONTROLLER ARCHITECTURE FOR REDUCING ON-DIE CAPACITANCE

    公开(公告)号:US20190267069A1

    公开(公告)日:2019-08-29

    申请号:US15906998

    申请日:2018-02-27

    Abstract: The disclosed controller includes a DDR architecture that includes a dual-channel interface designed to include DQS IO ports configured to generate a first DQS signal that is a distance of substantially 0.125 times the period of a clock signal (ΔT denoting the 0.125 of the period of the clock signal) ahead of a rising edge of the clock signal and a second DQS signal that is a distance of substantially 0.125 times the period of the clock signal behind the rising edge of a clock signal. If ΔT is more than a tDQSS then ΔT is set to tDQSS, where tDQSS is a maximum allowable time between either DQS signal and the rising edge of the clock signal.

    Controller architecture for reducing on-die capacitance

    公开(公告)号:US10541020B2

    公开(公告)日:2020-01-21

    申请号:US15906998

    申请日:2018-02-27

    Abstract: The disclosed controller includes a DDR architecture that includes a dual-channel interface designed to include DQS IO ports configured to generate a first DQS signal that is a distance of substantially 0.125 times the period of a clock signal (ΔT denoting the 0.125 of the period of the clock signal) ahead of a rising edge of the clock signal and a second DQS signal that is a distance of substantially 0.125 times the period of the clock signal behind the rising edge of a clock signal. If ΔT is more than a tDQSS then ΔT is set to tDQSS, where tDQSS is a maximum allowable time between either DQS signal and the rising edge of the clock signal.

    POWER DELIVERY NETWORK ANALYSIS OF MEMORY UNIT I/O POWER DOMAIN

    公开(公告)号:US20180373302A1

    公开(公告)日:2018-12-27

    申请号:US15633026

    申请日:2017-06-26

    Abstract: The disclosed technology provides methods for performing a power delivery network analysis of the memory unit I/O power domain. The methods include performing a signal and power integrity analysis for a memory unit I/O power domain to extract characteristics of a current waveform, determining characteristics of an expected waveform based on a current response for the memory unit I/O power domain, and determining whether the characteristics of the current waveform and the characteristics of the expected waveform are within a tolerance limit. The method also includes various remedial operations and CPM regeneration which may iteratively occur until the waveform matches and final CPM is generated which is use for PDN analysis.

    CONTROLLER ARCHITECTURE FOR REDUCING ON-DIE CAPACITANCE

    公开(公告)号:US20200152254A1

    公开(公告)日:2020-05-14

    申请号:US16746365

    申请日:2020-01-17

    Abstract: The disclosed controller includes a DDR architecture that includes a dual-channel interface designed to include DQS IO ports configured to generate a first DQS signal that is a distance of substantially 0.125 times the period of a clock signal (ΔT denoting the 0.125 of the period of the clock signal) ahead of a rising edge of the clock signal and a second DQS signal that is a distance of substantially 0.125 times the period of the clock signal behind the rising edge of a clock signal. If ΔT is more than a tDQSS then ΔT is set to tDQSS, where tDQSS is a maximum allowable time between either DQS signal and the rising edge of the clock signal.

    Selection of die and package parasitic for IO power domain

    公开(公告)号:US10585999B2

    公开(公告)日:2020-03-10

    申请号:US15869484

    申请日:2018-01-12

    Abstract: Systems and methods for selecting die and package parasitic for an input-output (IO) power domain are described. In one embodiment, the method includes determining a minimum on-die decoupling capacitance based at least in part on a product of a number of simultaneously switching IOs of the die and a maximum instantaneous current of an IO; determining a maximum package inductance based at least in part on a maximum operating frequency of an IC and a target impedance of a power delivery network of the die, the IC package, and a printed circuit board (PCB); and determining a maximum die resistance based at least in part on preventing the maximum die resistance from exceeding a maximum static IR drop of the die.

    Controller architecture for reducing on-die capacitance

    公开(公告)号:US10896721B2

    公开(公告)日:2021-01-19

    申请号:US16746365

    申请日:2020-01-17

    Abstract: The disclosed controller includes a DDR architecture that includes a dual-channel interface designed to include DQS IO ports configured to generate a first DQS signal that is a distance of substantially 0.125 times the period of a clock signal (ΔT denoting the 0.125 of the period of the clock signal) ahead of a rising edge of the clock signal and a second DQS signal that is a distance of substantially 0.125 times the period of the clock signal behind the rising edge of a clock signal. If ΔT is more than a tDQSS then ΔT is set to tDQSS, where tDQSS is a maximum allowable time between either DQS signal and the rising edge of the clock signal.

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