Chemically-etched nanostructures and related devices
    4.
    发明授权
    Chemically-etched nanostructures and related devices 有权
    化学蚀刻的纳米结构和相关器件

    公开(公告)号:US08569739B2

    公开(公告)日:2013-10-29

    申请号:US13314688

    申请日:2011-12-08

    IPC分类号: H01L29/06 H01L31/00

    摘要: A method of etching active quantum nanostructures provides the step of laterally etching of an intermediate active quantum nanostructure layer interposed between cladding layers. The lateral etching can be carried out on at least one side of the intermediate active quantum nanostructure layer selectively, with respect to the cladding layers to define at least one lateral recess or spacing in the intermediate active quantum nanostructure layer and respective lateral protrusions of cladding layers protruding with respect to the intermediate active quantum nanostructure layer. This method can be applied to create devices including active quantum nanostructures such as, for example, three-dimensional photonic crystals, a photonic crystal double-slab and a photonic crystal laser.

    摘要翻译: 蚀刻活性量子纳米结构的方法提供了横向蚀刻介于包层之间的中间活性量子纳米结构层的步骤。 横向蚀刻可以相对于包层选择性地在中间活性量子纳米结构层的至少一侧进行,以限定中间有源量子纳米结构层中的至少一个横向凹槽或间隔,并且包覆层的相应侧向突起 相对于中间活性量子纳米结构层突出。 该方法可以应用于产生包括有源量子纳米结构的器件,例如三维光子晶体,光子晶体双板和光子晶体激光器。