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公开(公告)号：US20060243205A1
公开(公告)日：2006-11-02
申请号：US11455777
申请日：2006-06-20
申请人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motoshima , Akira Owatari , Naoki Daj
发明人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motoshima , Akira Owatari , Naoki Daj
CPC分类号： H01L21/67161 , C23C18/1628 , C23C18/1893 , C25D7/123 , C25D17/001 , C25D17/08 , H01L21/67051 , H01L21/67126 , H01L21/67173 , H01L21/6719 , H01L21/67196 , H01L21/6723 , H01L21/67742 , H01L21/67751 , H01L21/67766 , H01L21/67781 , H01L21/68707 , H01L21/68721 , Y10S134/902 , Y10T279/11
摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.
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公开(公告)号：US20060243204A1
公开(公告)日：2006-11-02
申请号：US11454790
申请日：2006-06-19
申请人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motoshima , Akira Owatari , Naoki Dai
发明人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motoshima , Akira Owatari , Naoki Dai
CPC分类号： H01L21/67161 , C23C18/1628 , C23C18/1893 , C25D7/123 , C25D17/001 , C25D17/08 , H01L21/67051 , H01L21/67126 , H01L21/67173 , H01L21/6719 , H01L21/67196 , H01L21/6723 , H01L21/67742 , H01L21/67751 , H01L21/67766 , H01L21/67781 , H01L21/68707 , H01L21/68721 , Y10S134/902 , Y10T279/11
摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.
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公开(公告)号：US20060236929A1
公开(公告)日：2006-10-26
申请号：US11455736
申请日：2006-06-20
申请人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motoshima , Akira Owatari , Naoki Dai
发明人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motoshima , Akira Owatari , Naoki Dai
IPC分类号： B05C3/02
CPC分类号： H01L21/67161 , C23C18/1628 , C23C18/1893 , C25D7/123 , C25D17/001 , C25D17/08 , H01L21/67051 , H01L21/67126 , H01L21/67173 , H01L21/6719 , H01L21/67196 , H01L21/6723 , H01L21/67742 , H01L21/67751 , H01L21/67766 , H01L21/67781 , H01L21/68707 , H01L21/68721 , Y10S134/902 , Y10T279/11
摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.
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公开(公告)号：US07575636B2
公开(公告)日：2009-08-18
申请号：US11455777
申请日：2006-06-20
申请人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motoshima , Akira Owatari , Naoki Dai
发明人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motoshima , Akira Owatari , Naoki Dai
IPC分类号： B05C3/02
CPC分类号： H01L21/67161 , C23C18/1628 , C23C18/1893 , C25D7/123 , C25D17/001 , C25D17/08 , H01L21/67051 , H01L21/67126 , H01L21/67173 , H01L21/6719 , H01L21/67196 , H01L21/6723 , H01L21/67742 , H01L21/67751 , H01L21/67766 , H01L21/67781 , H01L21/68707 , H01L21/68721 , Y10S134/902 , Y10T279/11
摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.
摘要翻译： 本发明涉及通过将基板浸渍在处理液中而用于电镀基板或加工基板的基板处理装置。 本发明的基板处理装置包括：用于搬入和取出基板的装载/卸载区域; 用于清洁衬底的清洁区域; 以及用于电镀基板的电镀区域。 装载/卸载区域设置有具有多个干用设计的手的基板传送机器人，安装有用于容纳基板的盒的装载端口和用于将基板从面朝上翻转的干式设计的反转机 面对下来
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公开(公告)号：US07087117B2
公开(公告)日：2006-08-08
申请号：US10712348
申请日：2003-11-14
申请人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motoshima , Akira Owatari , Naoki Dai
发明人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motoshima , Akira Owatari , Naoki Dai
CPC分类号： H01L21/67161 , C23C18/1628 , C23C18/1893 , C25D7/123 , C25D17/001 , C25D17/08 , H01L21/67051 , H01L21/67126 , H01L21/67173 , H01L21/6719 , H01L21/67196 , H01L21/6723 , H01L21/67742 , H01L21/67751 , H01L21/67766 , H01L21/67781 , H01L21/68707 , H01L21/68721 , Y10S134/902 , Y10T279/11
摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.
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公开(公告)号：US07442257B2
公开(公告)日：2008-10-28
申请号：US11455736
申请日：2006-06-20
申请人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motoshima , Akira Owatari , Naoki Dai
发明人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motoshima , Akira Owatari , Naoki Dai
IPC分类号： B05C13/00
CPC分类号： H01L21/67161 , C23C18/1628 , C23C18/1893 , C25D7/123 , C25D17/001 , C25D17/08 , H01L21/67051 , H01L21/67126 , H01L21/67173 , H01L21/6719 , H01L21/67196 , H01L21/6723 , H01L21/67742 , H01L21/67751 , H01L21/67766 , H01L21/67781 , H01L21/68707 , H01L21/68721 , Y10S134/902 , Y10T279/11
摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.
摘要翻译： 本发明涉及通过将基板浸渍在处理液中而用于电镀基板或加工基板的基板处理装置。 本发明的基板处理装置包括：用于搬入和取出基板的装载/卸载区域; 用于清洁衬底的清洁区域; 以及用于电镀基板的电镀区域。 装载/卸载区域设置有具有多个干用设计的手的基板传送机器人，安装有用于容纳基板的盒的装载端口和用于将基板从面朝上翻转的干式设计的反转机 面对下来
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公开(公告)号：US20050072358A1
公开(公告)日：2005-04-07
申请号：US10712348
申请日：2003-11-14
申请人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motoshima , Akira Owatari , Naoki Dai
发明人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motoshima , Akira Owatari , Naoki Dai
IPC分类号： C23C18/16 , C25D7/12 , C25D17/00 , H01L21/00 , H01L21/677 , H01L21/687 , C23C16/00
CPC分类号： H01L21/67161 , C23C18/1628 , C23C18/1893 , C25D7/123 , C25D17/001 , C25D17/08 , H01L21/67051 , H01L21/67126 , H01L21/67173 , H01L21/6719 , H01L21/67196 , H01L21/6723 , H01L21/67742 , H01L21/67751 , H01L21/67766 , H01L21/67781 , H01L21/68707 , H01L21/68721 , Y10S134/902 , Y10T279/11
摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate, wherein the loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.
摘要翻译： 本发明涉及通过将基板浸渍在处理液中而用于电镀基板或加工基板的基板处理装置。 本发明的基板处理装置包括：用于搬入和取出基板的装载/卸载区域; 用于清洁衬底的清洁区域; 以及用于电镀基板的电镀区域，其中装载/卸载区域设置有具有多个干用设计的手的基板传送机器人，安装有用于容纳基板的盒的装载端口和干燥的反转机器 - 用于将基板从正面朝下翻转的设计。
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公开(公告)号：US08225803B2
公开(公告)日：2012-07-24
申请号：US13100484
申请日：2011-05-04
申请人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motojima
发明人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motojima
IPC分类号： B08B13/00
CPC分类号： H01L21/68721 , C23C18/163 , C23C18/1632 , C23C18/1886 , C25D7/123 , C25D17/001 , H01L21/67126 , H01L21/67766 , Y10S134/901
摘要： A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.
摘要翻译： 基板处理方法和装置可以可靠地执行能够在基板的表面的必要区域中均匀镀覆的预镀处理。 基板处理方法对作为预镀处理的基板的表面进行清洗处理和催化剂赋予处理，然后在基板的赋予催化剂的表面上化学镀金属膜。 在通过催化剂赋予处理赋予催化剂的区域的基板的表面的更宽的区域中进行清洗处理。
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公开(公告)号：US20110203518A1
公开(公告)日：2011-08-25
申请号：US13100484
申请日：2011-05-04
申请人： Seiji KATSUOKA , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motojima
发明人： Seiji KATSUOKA , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motojima
IPC分类号： B05C11/00
CPC分类号： H01L21/68721 , C23C18/163 , C23C18/1632 , C23C18/1886 , C25D7/123 , C25D17/001 , H01L21/67126 , H01L21/67766 , Y10S134/901
摘要： A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.
摘要翻译： 基板处理方法和装置可以可靠地执行能够在基板的表面的必要区域中均匀镀覆的预镀处理。 基板处理方法对作为预镀处理的基板的表面进行清洗处理和催化剂赋予处理，然后在基板的赋予催化剂的表面上化学镀金属膜。 在通过催化剂赋予处理赋予催化剂的区域的基板的表面的更宽的区域中进行清洗处理。
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公开(公告)号：US20100221432A1
公开(公告)日：2010-09-02
申请号：US12771176
申请日：2010-04-30
申请人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motojima
发明人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motojima
IPC分类号： B05D3/10
CPC分类号： H01L21/68721 , C23C18/163 , C23C18/1632 , C23C18/1886 , C25D7/123 , C25D17/001 , H01L21/67126 , H01L21/67766 , Y10S134/901
摘要： A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.
摘要翻译： 基板处理方法和装置可以可靠地执行能够在基板的表面的必要区域中均匀镀覆的预镀处理。 基板处理方法对作为预镀处理的基板的表面进行清洗处理和催化剂赋予处理，然后在基板的赋予催化剂的表面上化学镀金属膜。 在通过催化剂赋予处理赋予催化剂的区域的基板的表面的更宽的区域中进行清洗处理。
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