公开(公告)号：US20140203820A1

公开(公告)日：2014-07-24

申请号：US14223405

申请日：2014-03-24

Applicant: SENTINEL CONNECTOR SYSTEMS, INC.

Inventor： Brett D. ROBINSON

IPC: H04L1/24

CPC classification number: H04L1/24 ,  G01R1/0416 ,  H01R13/6469 ,  H01R13/6474 ,  H01R24/64 ,  H05K1/0228 ,  H05K1/025 ,  H05K2201/09027 ,  H05K2201/09236 ,  H05K2201/10189

Abstract: A testing unit including a substrate, a plurality of vias located in the substrate, a plurality of pin traces having a height and a width and each extending from a respective via towards an edge of the substrate and terminating at an end point, a plurality of termination points adjacent to the end points of the pin traces, a plurality of end traces having a height and a width with each end trace extending from an end point of a respective pin trace towards to a corresponding termination point near to the pin trace, a plurality of traces extending from the end of a respective end point or termination point to the edge of the substrate, where the end points of each pin trace are adjacent to each other and the termination points are adjacent to one another such that the pair of adjacent end traces and the pair of adjacent termination points are each adjacent to different traces.

Abstract translation: 一种测试单元，包括基板，位于基板中的多个通孔，具有高度和宽度的多个引脚迹线，并且各自从相应的通孔延伸到基板的边缘并终止于端点，多个 终端点与引脚迹线的端点相邻，多个端部迹线具有高度和宽度，每个端部迹线从相应的引脚迹线的端点延伸到靠近引脚迹线的相应端接点， 多个迹线从相应的终点或终止点的端部延伸到基板的边缘，其中每个引脚迹线的端点彼此相邻并且终止点彼此相邻，使得该对相邻的 末端迹线和一对相邻终止点各自与不同的迹线相邻。

公开(公告)号：US20160248206A1

公开(公告)日：2016-08-25

申请号：US15146008

申请日：2016-05-04

Applicant: Sentinel Connector Systems, Inc.

Inventor： Brett D. ROBINSON

IPC: H01R24/64 ,  H01R13/6474 ,  H05K1/09 ,  H05K1/02 ,  H05K1/11 ,  H05K1/16 ,  H01R13/66 ,  H01R43/20

CPC classification number: H01R24/64 ,  H01R13/6474 ,  H01R13/6581 ,  H01R13/6625 ,  H01R13/6658 ,  H01R43/205 ,  H01R2107/00 ,  H05K1/0218 ,  H05K1/0228 ,  H05K1/09 ,  H05K1/115 ,  H05K1/162 ,  Y10T29/49165

Abstract: A circuit board for a high speed communication jack including a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.

Abstract translation: 一种用于高速通信插座的电路板，包括在壳体中具有基板的刚性电路板，延伸穿过基板的多个通孔，每个通孔被配置为容纳壳体上的销，中间层上的多个迹线 在基板中，每个迹线从多个通孔中的相应一个延伸，在基板中的中间层的第一侧上的第一屏蔽层，在基板中的中间层的第二侧上的第二屏蔽层， 以及与第二屏蔽层相邻的第三屏蔽层。

公开(公告)号：US20140204788A1

公开(公告)日：2014-07-24

申请号：US14223364

申请日：2014-03-24

Applicant: SENTINEL CONNECTOR SYSTEMS, INC.

Inventor： Brett D. ROBINSON

IPC: H04L1/24 ,  H04B17/00

CPC classification number: H04L1/24 ,  G01R1/0416 ,  H01R13/6469 ,  H01R13/6474 ,  H01R24/64 ,  H04B17/00 ,  H05K1/025 ,  H05K1/0268 ,  H05K1/0366 ,  H05K2201/09027 ,  H05K2201/10189

Abstract: A testing unit including a substrate, a plurality of vias located in the substrate, a plurality of pin traces having a height and a width and each extending from a respective via towards an edge of the substrate, a plurality of end traces having a height and a width with each end trace extending from an end of a respective pin trace towards the edge of the substrate, a plurality of branch traces having a height and a width and each extending from a side of a respective pin trace, a plurality of traces extending from the end of a respective end trace, branch trace or pin trace to the edge of the substrate, where each end trace is adjacent to a respective branch trace, each end trace is adjacent to a respective branch trace on one side and a pin trace on the opposite side, and each pin trace is adjacent to another pin trace on one side.

Abstract translation: 一种测试单元，包括基板，位于基板中的多个通孔，具有高度和宽度的多个引脚迹线，并且各自从相应的通孔延伸到基板的边缘，多个端部迹线具有高度和 每个端部迹线的宽度从相应的引脚迹线的端部延伸到衬底的边缘;多个分支迹线，具有高度和宽度，并且各自从相应的引脚迹线的一侧延伸，多个迹线延伸 从相应末端迹线的末端，分支迹线或引脚迹线到基板的边缘，其中每个端部迹线与相应的分支迹线相邻，每个端部迹线与一侧上相应的分支迹线相邻，并且引脚迹线 在另一侧，每个引脚迹线与一侧的另一个引脚迹线相邻。

公开(公告)号：US20170229818A1

公开(公告)日：2017-08-10

申请号：US15484294

申请日：2017-04-11

Applicant: Sentinel Connector Systems, Inc.

Inventor： Brett D. ROBINSON ,  Justin Wagner

IPC: H01R13/6599 ,  H01R43/16 ,  H01R24/64 ,  H01R13/6585

CPC classification number: H01R13/6599 ,  H01R13/6466 ,  H01R13/6585 ,  H01R24/64 ,  H01R43/16 ,  H01R2107/00 ,  H05K1/0218 ,  H05K1/0228 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/028

Abstract: A high speed communication jack including a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug, a shielding case surrounding the housing, a circuit board in the housing having a substrate, a plurality of first vias extending through the substrate with each first via being configured to accommodate a pin on the housing, a plurality of second vias extending through the substrate with each second via being configured to accommodate a pin on the housing, a first set of traces on a top layer of the substrate that connects at least one first via with at least one corresponding second via; and a second set of traces on a side of the substrate opposite the top layer that connects at least one first via with at least one second via.

公开(公告)号：US20160248205A1

公开(公告)日：2016-08-25

申请号：US15146019

申请日：2016-05-04

Applicant: Sentinel Connector Systems, Inc.

Inventor： Brett D. ROBINSON ,  Justin Wagner

IPC: H01R24/60 ,  H01R13/6599 ,  H01R43/16 ,  H01R13/6581

CPC classification number: H01R13/6581 ,  H01R13/6474 ,  H01R13/6658 ,  H01R24/64 ,  H01R2107/00 ,  Y10T29/49165

Abstract: A method of manufacturing a high speed jack, the method including the steps of forming a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug, forming a shielding case surrounding the housing, forming a top layer of a substrate, a first shielding layer on a first side of the top layer in the substrate, a second shielding layer adjacent the first shielding layer in the substrate, and forming a bottom layer adjacent to the second shielding layer, forming a plurality of first vias extending through the substrate with each first via being configured to accommodate a pin on the housing, forming a plurality of second vias extending through the substrate with each second via being configured to accommodate a pin on the housing.

Abstract translation: 一种制造高速千斤顶的方法，所述方法包括以下步骤：形成包括用于接收插头的端口的壳体，所述端口包括多个引脚，每个引脚各自连接到插头中的相应信号线，形成围绕所述插头的屏蔽壳 形成衬底的顶层，在衬底顶层的第一侧的第一屏蔽层，与衬底中的第一屏蔽层相邻的第二屏蔽层，以及形成与第二屏蔽层相邻的底层 形成延伸穿过所述基板的多个第一通孔，每个第一通孔被配置为容纳所述壳体上的销，形成延伸穿过所述基板的多个第二通孔，每个第二通孔被配置成容纳所述壳体上的销。

公开(公告)号：US20130210277A1

公开(公告)日：2013-08-15

申请号：US13739214

申请日：2013-01-11

Applicant: Sentinel Connector Systems, Inc.

Inventor： Brett D. ROBINSON

IPC: H01R13/646 ,  H01R43/20

CPC classification number: H01R13/646 ,  H01R13/6474 ,  H01R13/7195 ,  H01R24/64 ,  H01R43/205 ,  Y10T29/49218

Abstract: A high speed communication jack including a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug and a shielding case surrounding the housing. A flexible circuit board between the shielding case and the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a first side of the substrate, with each trace extending from a corresponding one of the plurality of vias, and a shielding plane on a second side of the substrate opposite the first side of the substrate.