摘要:
A micro electro mechanical system (MEMS) device is provided. The MEMS device includes: a stage which operates in a vibration mode; an axle which supports the stage and allows rotation of the stage; and a capacitive sensor which detects rotation of the stage. The capacitive sensor includes: a sensing arm which extends from the stage; driving combs which extend from the sensing arm and rotated together with the stage; fixed combs which are fixedly supported for engagement with the driving combs, the fixed combs including surfaces overlapping opposite surfaces of the driving combs in accordance with the rotation of the driving combs; and a capacitance sensing portion which detects a capacitance change of the driving combs and the fixed combs. Therefore, the MEMS device performs precise scanning by structurally preventing deformation of the stage having a light reflecting surface.
摘要:
A micro electro mechanical system (MEMS) device is provided. The MEMS device includes: a stage which operates in a vibration mode; an axle which supports the stage and allows rotation of the stage; and a capacitive sensor which detects rotation of the stage. The capacitive sensor includes: a sensing arm which extends from the stage; driving combs which extend from the sensing arm and rotated together with the stage; fixed combs which are fixedly supported for engagement with the driving combs, the fixed combs including surfaces overlapping opposite surfaces of the driving combs in accordance with the rotation of the driving combs; and a capacitance sensing portion which detects a capacitance change of the driving combs and the fixed combs. Therefore, the MEMS device performs precise scanning by structurally preventing deformation of the stage having a light reflecting surface.
摘要:
A micro-electro mechanical system (MEMS) switch having a single anchor is provided. The MEMS switch includes a substrate; grounding lines installed on the substrate to be distant away from each other; signal transmission lines positioned at predetermined intervals between the grounding lines; an anchor placed between the signal transmission lines; a driving electrode that encircles the anchor while not being in contact with the anchor, the signal transmission lines and the grounding lines; and a moving plate that is positioned on the driving electrode to be overlapped with portions of the signal transmission lines, and connected to the anchor elastically.
摘要:
A two-axis scanner includes: a base; a stage disposed on the base on an auxiliary frame; and a stage actuator between the base and the stage. The stage actuator includes: a first stationary part; a horizontally movable frame surrounded by the auxiliary frame; a first horizontal deformable torsion spring disposed between the first stationary part and the horizontally movable frame; and a horizontal driver actuating the horizontally movable frame. A first vertical deformable torsion spring is disposed between the horizontally movable frame and the auxiliary frame; a vertically movable frame surrounds the auxiliary frame, a second horizontal deformable torsion spring is disposed between the auxiliary frame and the vertically movable frame; wherein a second vertical deformable torsion spring is between the vertically movable frame and a second stationary part at sides of the vertically movable frame; and a vertical driver actuates the vertically movable frame.
摘要:
A method of forming a via hole through a glass wafer includes depositing a material layer on an outer surface of the glass wafer, the material layer having a selection ratio higher than that of the glass wafer, forming a via-patterned portion on one side of the material layer, performing a first etching in which the via-patterned portion is etched to form a preliminary via hole, eliminating any remaining patterning material used in the formation of the via-patterned portion, performing a second etching in which the preliminary via hole is etched to form a via hole having a smooth surface and extending through the glass wafer, and eliminating the material layer. The method according to the present invention is able to form a via hole through a glass wafer without allowing formation of an undercut or minute cracks, thereby increasing the yield and reliability of MEMS elements.
摘要:
A method of manufacturing a floating structure capable of providing increased device yield. The method includes: a) forming an insulation film, a predetermined area of which is removed, between a first substrate and a second substrate; and b) forming a floating structure in the removed predetermined area.
摘要:
Method for fabricating a gyroscope including: fabricating a SMS wafer where a first wafer, a metal film, and a second wafer are sequentially stacked; forming a cantilever or a bridge shaped-structure on the relevant portion of the first wafer through the photolithography process; attaching to the surface of the first wafer, a first cap made of glass and having a predetermined space for sealing the movable structure in a vacuum state; separating and removing the metal film and the second wafer from the first wafer; and attaching to the backside of the first wafer, the second cap which is structurally and materially symmetric to the first cap. The SMS wafer is fabricated by depositing the metal film on the second wafer and bonding the first wafer on the metal film using metal paste or material of polymer series. With lower material costs, improvements in performance and characteristics can be achieved.
摘要:
A method of manufacturing a floating structure capable of providing increased device yield. The method includes: a) forming an insulation film, a predetermined area of which is removed, between a first substrate and a second substrate; and b) forming a floating structure in the removed predetermined area.
摘要:
A method of manufacturing a coil for a micro-actuator. The method of manufacturing a coil for a micro-actuator includes preparing a substrate, forming a plurality of trenches for forming a coil on the substrate, covering portions on the substrate with a masking layer except for the plurality of trenches, electroplating the plurality of trenches with a conductive material, and forming a passivation layer on the substrate. Consistent with the method, variations in sections of a coil can be reduced by minimizing bending and warping of a wafer, and therefore a driving current applied to a coil and power consumption can be reduced.
摘要:
A method and apparatus for vacuum-mounting at least one micro electro mechanical system (MEMS) on a substrate includes a gas injecting section for injecting an inert gas into a vacuum chamber; a substrate aligning section for aligning a semiconductor substrate and a cover, the cover having a cavity formed therein and a getter attached to an interior surface of the cavity; a bonding section for bonding the semiconductor substrate and the cover together; and a controlling section for controlling the substrate aligning section to align the semiconductor and the cover, for controlling the gas injecting section to inject the inert gas into the vacuum chamber, and for controlling the bonding section to bond the semiconductor substrate and the cover together after the inert gas is injected.