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公开(公告)号：US07855691B2
公开(公告)日：2010-12-21
申请号：US12187429
申请日：2008-08-07
CPC分类号： H01Q19/062 , H01Q15/0086 , H01Q15/08 , H01Q19/13
摘要： An example apparatus comprises an electromagnetic source, such as an antenna, a metamaterial lens, and a reflector. The antenna is located proximate the metamaterial lens, for example supported by the metamaterial lens, and the antenna is operable to generate radiation when the antenna is energized. The reflector is positioned so as to reflect the radiation through the metamaterial lens. The reflector may have a generally concave reflective surface, for example having a parabolic or spherical cross-section. The metamaterial lens may have an area similar to that of the aperture of the reflector. In some examples, the antenna is located proximate a focal point of the reflector, so that a generally parallel beam is obtained after reflection from the reflector.
摘要翻译： 示例性装置包括电磁源，例如天线，超材料透镜和反射器。 天线位于超材料透镜附近，例如由超材料透镜支撑，并且天线可操作以在天线通电时产生辐射。 反射器被定位以便通过超材料透镜反射辐射。 反射器可以具有大致凹入的反射表面，例如具有抛物面或球形横截面。 超材料透镜可以具有与反射器的孔的面积相似的面积。 在一些示例中，天线位于反射器的焦点附近，使得在从反射器反射之后获得大致平行的光束。
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公开(公告)号：US20100033389A1
公开(公告)日：2010-02-11
申请号：US12187429
申请日：2008-08-07
CPC分类号： H01Q19/062 , H01Q15/0086 , H01Q15/08 , H01Q19/13
摘要： An example apparatus comprises an electromagnetic source, such as an antenna, a metamaterial lens, and a reflector. The antenna is located proximate the metamaterial lens, for example supported by the metamaterial lens, and the antenna is operable to generate radiation when the antenna is energized. The reflector is positioned so as to reflect the radiation through the metamaterial lens. The reflector may have a generally concave reflective surface, for example having a parabolic or spherical cross-section. The metamaterial lens may have an area similar to that of the aperture of the reflector. In some examples, the antenna is located proximate a focal point of the reflector, so that a generally parallel beam is obtained after reflection from the reflector.
摘要翻译： 示例性装置包括电磁源，例如天线，超材料透镜和反射器。 天线位于超材料透镜附近，例如由超材料透镜支撑，并且天线可操作以在天线通电时产生辐射。 反射器被定位以便通过超材料透镜反射辐射。 反射器可以具有大致凹入的反射表面，例如具有抛物面或球形横截面。 超材料透镜可以具有与反射器的孔的面积相似的面积。 在一些示例中，天线位于反射器的焦点附近，使得在从反射器反射之后获得大致平行的光束。
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公开(公告)号：US07797817B2
公开(公告)日：2010-09-21
申请号：US12212733
申请日：2008-09-18
CPC分类号： B32B38/1808 , B32B38/105 , B32B38/145 , B32B2457/00 , H01Q15/0013 , Y10T29/49016 , Y10T156/1049
摘要： A microwave component having an elongated flexible sheet made of a liquid crystal polymer. A first microwave pattern is printed on one side of the sheet while a second microwave pattern is printed on the other side of the sheet. The first and second patterns are mirror images of each other so that, with the first and second portions of the sheet folded over so that the first portion overlies the second portion, the patterns are aligned with each other and bond together. A margin area of the sheet in between the first and second patterns is then removed to form the microwave component.
摘要翻译： 一种具有由液晶聚合物制成的细长柔性片的微波部件。 第一微波图案被印刷在纸张的一侧上，而第二微波图案被印刷在纸张的另一面上。 第一和第二图案是彼此的镜像，使得在片材的第一和第二部分折叠使得第一部分覆盖第二部分时，图案彼此对准并结合在一起。 然后去除第一和第二图案之间的片材的边缘区域以形成微波部件。
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公开(公告)号：US20100066638A1
公开(公告)日：2010-03-18
申请号：US12212733
申请日：2008-09-18
CPC分类号： B32B38/1808 , B32B38/105 , B32B38/145 , B32B2457/00 , H01Q15/0013 , Y10T29/49016 , Y10T156/1049
摘要： A microwave component having an elongated flexible sheet made of a liquid crystal polymer. A first microwave pattern is printed on one side of the sheet while a second microwave pattern is printed on the other side of the sheet. The first and second patterns are mirror images of each other so that with the first and second portions of the sheet folded over so that the first portion overlies the second portion, the patterns are aligned with each other and bond together. A margin area of the sheet in between the first and second patterns is then removed to form the microwave component.
摘要翻译： 一种具有由液晶聚合物制成的细长柔性片的微波部件。 第一微波图案被印刷在纸张的一侧上，而第二微波图案被印刷在纸张的另一面上。 第一和第二图案是彼此的镜像，使得当片材的第一和第二部分折叠，使得第一部分覆盖第二部分时，图案彼此对准并且结合在一起。 然后去除第一和第二图案之间的片材的边缘区域以形成微波部件。
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5.发明申请COMPLIANT SPRING INTERPOSER FOR WAFER LEVEL THREE DIMENSIONAL (3D) INTEGRATION AND METHOD OF MANUFACTURING 失效适用于水平三级（3D）集成和制造方法的弹簧间隔器公开(公告)号：US20120193776A1
公开(公告)日：2012-08-02
申请号：US13442546
申请日：2012-04-09
申请人： Sang Won Yoon , Koji Shiozaki
发明人： Sang Won Yoon , Koji Shiozaki
IPC分类号： H01L23/04
CPC分类号： H01L23/49827 , H01L23/04 , H01L23/055 , H01L23/10 , H01L23/13 , H01L23/147 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L25/0655 , H01L2224/11849 , H01L2224/13111 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/819 , H01L2924/01029 , H01L2924/15153 , H01L2924/15165 , H01L2924/351 , H01L2924/00 , H01L2924/00012
摘要： The present invention is an apparatus for integrating multiple devices. The apparatus includes a substrate having a first via and a second via, a semiconductor chip positioned on a top portion of the substrate and positioned between the first via and the second via, first and second bumps positioned on the semiconductor chip, and an interposer wafer having a first interposer spring assembly and a second interposer spring assembly, the first interposer spring assembly having a first interposer spring and a first electrical connection attached to the first interposer spring, and the second interposer spring assembly having a second interposer spring and a second electrical connection attached to the second interposer spring.
摘要翻译： 本发明是用于集成多个装置的装置。 该装置包括具有第一通孔和第二通孔的基板，位于基板的顶部并且位于第一通孔和第二通孔之间的半导体芯片，位于半导体芯片上的第一和第二凸块以及插入件晶片 具有第一插入件弹簧组件和第二插入件弹簧组件，所述第一插入件弹簧组件具有第一插入件弹簧和连接到第一插入件弹簧的第一电连接件，第二插入件弹簧组件具有第二插入件弹簧和第二插入件弹簧 连接到第二插入件弹簧。
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公开(公告)号：US20140070994A1
公开(公告)日：2014-03-13
申请号：US13613111
申请日：2012-09-13
IPC分类号： H01Q3/30
CPC分类号： H01Q3/30 , G01S7/032 , H01Q1/3233
摘要： A radar microchip for short range detection with phased array radar uses phase shifters along with an antenna array to steer the transmitted and received radar beams along orthogonal axes to achieve a 3D scan. Individual phase shifters connected to antenna cells that transmit and receive the radar beams steer the radar along two orthogonal axes by controlling the phase of the radar. The radar then detects where the two beams overlap. The antenna cells are further aligned along these orthogonal axes. An isolation barrier between the phase shifters of the transmitted and received signals reduces cross coupling on the radar microchip.
摘要翻译： 用于具有相控阵雷达的短距离检测的雷达微芯片使用移相器以及天线阵列来引导沿着正交轴的发射和接收的雷达波束以实现3D扫描。 连接到发射和接收雷达光束的天线单元的单独移相器通过控制雷达的相位沿着两个正交轴引导雷达。 雷达然后检测两个波束重叠的位置。 天线电池进一步沿这些正交轴对准。 发射和接收信号的移相器之间的隔离屏障减少了雷达微芯片上的交叉耦合。
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公开(公告)号：US20130270326A1
公开(公告)日：2013-10-17
申请号：US13448632
申请日：2012-04-17
申请人： Sang Won Yoon , Koji Shiozaki
发明人： Sang Won Yoon , Koji Shiozaki
CPC分类号： B23K20/02 , B23K20/16 , B23K2101/36 , H01L24/83 , H01L2224/83 , H01L2224/83825 , H01L2224/8383
摘要： A bonding structure enabling fast and reliable methods to fabricate a substantially homogeneous bondline with reduced dependency of a thickness limitation is disclosed. Also, this system creates a bondline targeted for performance in power electronics. This system is highly adaptable as various structures and fabrication options may be implemented. This enables diverse fabrication selection and creates less dependency on outside conditions. The disclosed system is at least applicable to wafer-to-wafer, die-to-wafer, die-to-substrate, or die-to-die bonding.
摘要翻译： 公开了一种能够快速且可靠地制造基本上均匀的粘合线的接合结构，其具有减小的厚度限制的依赖性。 此外，该系统还创建了一个针对电力电子产品性能的粘合线。 该系统是高度适应性的，因为可以实现各种结构和制造选项。 这使得能够进行多样化的制造选择并且对外部条件产生较少的依赖性。 所公开的系统至少适用于晶片到晶片，晶片到晶片，管芯到衬底或管芯到管芯的接合。
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公开(公告)号：US10058951B2
公开(公告)日：2018-08-28
申请号：US13448632
申请日：2012-04-17
申请人： Sang Won Yoon , Koji Shiozaki
发明人： Sang Won Yoon , Koji Shiozaki
IPC分类号： B23K20/02 , B23K20/16 , H01L23/00 , B23K101/36
CPC分类号： B23K20/02 , B23K20/16 , B23K2101/36 , H01L24/83 , H01L2224/83 , H01L2224/83825 , H01L2224/8383
摘要： A bonding structure enabling fast and reliable methods to fabricate a substantially homogeneous bondline with reduced dependency of a thickness limitation is disclosed. Also, this system creates a bondline targeted for performance in power electronics. This system is highly adaptable as various structures and fabrication options may be implemented. This enables diverse fabrication selection and creates less dependency on outside conditions. The disclosed system is at least applicable to wafer-to-wafer, die-to-wafer, die-to-substrate, or die-to-die bonding.
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公开(公告)号：US08803001B2
公开(公告)日：2014-08-12
申请号：US13165660
申请日：2011-06-21
申请人： Sang Won Yoon , Satoshi Yasuda , Koji Shiozaki
发明人： Sang Won Yoon , Satoshi Yasuda , Koji Shiozaki
CPC分类号： B23K35/262 , H01L21/4846 , H01L23/3735 , H01L23/49811 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2224/26175 , H01L2224/27013 , H01L2224/29109 , H01L2224/29111 , H01L2224/32145 , H01L2224/32225 , H01L2224/83193 , H01L2224/83825 , H01L2224/94 , H01L2924/01029 , H01L2924/0132 , H01L2924/12042 , H01L2924/1461 , H01L2924/1579 , Y10T428/12222 , H01L2924/0105 , H01L2924/01006 , H01L2924/01014 , H01L2924/00014 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01028 , H01L2924/00 , H01L2224/83
摘要： Devices, methods and systems are disclosed herein to describe the wettability characteristics of the material forming a bonding area, a non-bonding area, and a melted bonding material. The melted bonding material may have a high degree of cohesion and may result in a very high contact angle (e.g., between 90°- 180°) in the non-bonding area thereby preventing or limiting the flow of a melted material into the non-bonding area, which often results when the melted bonding material forms a low contact angle (e.g., between 0°-90°) in the bonding area. In other words, by choosing a material for the non-bonding area to have low wettability characteristics when compared to the melted materials of the bonding area or by treating the material forming the non-bonding area to have much lower wettability characteristics, the melted materials of the bonding area may be prevented from flowing into the non-bonding area.
摘要翻译： 本文公开的装置，方法和系统用于描述形成接合区域，非结合区域和熔融粘合材料的材料的润湿性能。 熔融的粘合材料可能具有高度的内聚力，并且可能导致非接合区域中的非常高的接触角（例如，在90°至180°之间），从而防止或限制熔融材料流入非接触区域， 粘结区域，这通常在熔融粘合材料在粘合区域中形成低接触角（例如0°-90°）时产生。 换句话说，通过选择与接合区域的熔融材料相比具有低润湿性特性的非粘结区域的材料或通过处理形成非粘合区域的材料具有低得多的润湿性，熔融材料 可以防止粘合区域流入非接合区域。
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10.发明授权Compliant spring interposer for wafer level three dimensional (3D) integration and method of manufacturing 失效适用于晶圆级三维（3D）集成和制造方法的弹簧插入器公开(公告)号：US08564117B2
公开(公告)日：2013-10-22
申请号：US13442546
申请日：2012-04-09
申请人： Sang Won Yoon , Koji Shiozaki
发明人： Sang Won Yoon , Koji Shiozaki
IPC分类号： H01L23/045
CPC分类号： H01L23/49827 , H01L23/04 , H01L23/055 , H01L23/10 , H01L23/13 , H01L23/147 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L25/0655 , H01L2224/11849 , H01L2224/13111 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/819 , H01L2924/01029 , H01L2924/15153 , H01L2924/15165 , H01L2924/351 , H01L2924/00 , H01L2924/00012
摘要： The present invention is an apparatus for integrating multiple devices. The apparatus includes a substrate having a first via and a second via, a semiconductor chip positioned on a top portion of the substrate and positioned between the first via and the second via, first and second bumps positioned on the semiconductor chip, and an interposer wafer having a first interposer spring assembly and a second interposer spring assembly, the first interposer spring assembly having a first interposer spring and a first electrical connection attached to the first interposer spring, and the second interposer spring assembly having a second interposer spring and a second electrical connection attached to the second interposer spring.
摘要翻译： 本发明是用于集成多个装置的装置。 该装置包括具有第一通孔和第二通孔的基板，位于基板的顶部并且位于第一通孔和第二通孔之间的半导体芯片，位于半导体芯片上的第一和第二凸块以及插入件晶片 具有第一插入件弹簧组件和第二插入件弹簧组件，所述第一插入件弹簧组件具有第一插入件弹簧和连接到第一插入件弹簧的第一电连接件，并且第二插入件弹簧组件具有第二插入件弹簧和第二插入件弹簧 连接到第二插入件弹簧。
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