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公开(公告)号：US20150163897A1
公开(公告)日：2015-06-11
申请号：US14181412
申请日：2014-02-14
申请人： LOTES CO., LTD
发明人： Ted Ju
CPC分类号： H05K3/32 , H01L23/49811 , H01L23/49827 , H01L23/49883 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/13111 , H01L2224/16235 , H01L2224/81101 , H01L2224/81405 , H01L2224/81411 , H01L2224/81494 , H01L2224/81505 , H01L2224/81594 , H01L2224/81691 , H01L2224/81711 , H01L2224/819 , H01R13/035 , H01R13/2414 , H05K2201/0314 , H05K2201/10378 , H05K2201/10674 , H05K2201/10962 , H01L2924/00012 , H01L2924/00014 , H01L2924/01049 , H01L2924/0105 , H01L2924/0715
摘要： An electrical connector for electrically connecting a first electronic element to a second electronic element includes an insulating body and multiple conductors. The insulating body has multiple accommodating holes. Each conductor is accommodated in a corresponding accommodating hole. Each conductor has an elastic insulator and low melting point liquid metal wrapping a surface of the elastic insulator, such that a continuous conducting path is formed by the liquid metal between the first electronic element and the second electronic element.
摘要翻译： 用于将第一电子元件电连接到第二电子元件的电连接器包括绝缘体和多个导体。 绝缘体具有多个容纳孔。 每个导体容纳在相应的容纳孔中。 每个导体具有包裹弹性绝缘体的表面的弹性绝缘体和低熔点液体金属，使得在第一电子元件和第二电子元件之间由液态金属形成连续导电路径。
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公开(公告)号：US20130105993A1
公开(公告)日：2013-05-02
申请号：US13284314
申请日：2011-10-28
申请人： Raj BAHADUR , David SHADDOCK , Binoy SHAH
发明人： Raj BAHADUR , David SHADDOCK , Binoy SHAH
CPC分类号： H01L23/49811 , H01L21/563 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L2224/03829 , H01L2224/0401 , H01L2224/11003 , H01L2224/111 , H01L2224/11334 , H01L2224/1134 , H01L2224/1145 , H01L2224/115 , H01L2224/11901 , H01L2224/13017 , H01L2224/13018 , H01L2224/131 , H01L2224/13147 , H01L2224/14051 , H01L2224/14135 , H01L2224/14163 , H01L2224/14166 , H01L2224/14179 , H01L2224/14505 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/81191 , H01L2224/81193 , H01L2224/81801 , H01L2224/819 , H01L2224/81902 , H01L2225/06506 , H01L2924/10253 , H01L2924/15747 , H01L2924/351 , H01L2924/00012 , H01L2224/114 , H01L2924/00014 , H01L2924/014 , H01L2924/00
摘要： There is set forth herein a semiconductor assembly including an integrated circuit and a set of springs extending from the integrated circuit that can be adapted for connection to an external article. The external article can be e.g. an integrated circuit or a printed circuit board. On connection of the semiconductor assembly to an external article there can be defined a semiconductor assembly comprising the integrated circuit the set of springs and the external article. The set of springs can be metal nanospring array can formed by GLAD (Glancing angle deposition) process. In one embodiment, the nanospring array can be GLAD formed on a substrate and then applied to the integrated circuit. In one embodiment, the nanospring array can be GLAD formed on the integrated circuit.
摘要翻译： 这里提出了包括集成电路和从集成电路延伸的一组弹簧的半导体组件，其可以适于连接到外部制品。 外部物品可以是例如。 集成电路或印刷电路板。 在将半导体组件连接到外部制品上时，可以限定一个半导体组件，该半导体组件包括该组弹簧和外部制品的集成电路。 该组弹簧可以是通过GLAD（Glancing Angle Deposition）工艺形成的金属纳米螺旋阵列。 在一个实施例中，纳米螺旋阵列可以是形成在衬底上的GLAD，然后施加到集成电路。 在一个实施例中，纳米螺旋阵列可以是形成在集成电路上的GLAD。
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3.发明授权Contacting system for bipolar electronic circuit elements, more particularly semiconductor circuit elements 失效双极电子电路元件的接触系统，更具体地说是半导体电路元件
公开(公告)号：US4862248A
公开(公告)日：1989-08-29
申请号：US694187
申请日：1985-01-23
申请人： Henrich Zeile , Heinz Sauermann
发明人： Henrich Zeile , Heinz Sauermann
IPC分类号： H01L21/60 , H01L21/331 , H01L23/48 , H01L23/485 , H01L29/73
CPC分类号： H01L24/72 , H01L24/13 , H01L24/14 , H01L2224/13 , H01L2224/13018 , H01L2224/13139 , H01L2224/13564 , H01L2224/13611 , H01L2224/14181 , H01L2224/81191 , H01L2224/819 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12043
摘要： In a contacting system for bipolar electronic circuit elements, more particularly semiconductor circuit elements, in which a circuit element body provided on at least one of two major surfaces located opposite each other with a thick, pressure-contact layer is held under pressure between two contact bodies interconnected by a housing, more particularly a soft glass housing. The risk of contact interruptions with frequent temperature variations in a range of from 0.degree. to 300.degree. C. is eliminated in that the thick pressure contact layers are subdivided into several contact blocks, preferably three or four, which are mutually separated and arranged beside each other.The surface of the contact blocks facing the contact bodies may be coated with a connection layer, which serves to establish during sealing into a soft glass envelope a connection by soldering or diffusion welding between the contact blocks and the contact bodies.
摘要翻译： 在用于双极电子电路元件的接触系统中，更具体地说，半导体电路元件，其中设置在彼此相对的两个主表面中的至少一个具有厚的压接层的电路元件主体被保持在两个触点 通过壳体互连的身体，更具体地说是软玻璃外壳。 消除了在0℃至300℃的范围内频繁温度变化的接触中断的风险，因为厚的压力接触层被细分为几个接触块，优选三个或四个，这两个接触块相互分离并布置在每个 其他。 面对接触体的接触块的表面可以涂覆有连接层，其用于在通过在接触块和接触体之间的焊接或扩散焊接将密封成软玻璃外壳的连接处建立连接层。
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4.发明授权Semiconductor device having a switch that expands and contracts by temperature change 有权具有通过温度变化而膨胀和收缩的开关的半导体装置公开(公告)号：US09287210B2
公开(公告)日：2016-03-15
申请号：US14561751
申请日：2014-12-05
申请人： FUJITSU LIMITED
发明人： Hajime Kubota
IPC分类号： H01L23/12 , H01L23/48 , H01L23/52 , H01L29/40 , H01L23/525 , H01L23/34 , H01L25/065 , H01L23/00
CPC分类号： H01L23/525 , H01L23/345 , H01L23/52 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/98 , H01L25/0655 , H01L25/0657 , H01L2224/0401 , H01L2224/0557 , H01L2224/1012 , H01L2224/13005 , H01L2224/13016 , H01L2224/13017 , H01L2224/13025 , H01L2224/13083 , H01L2224/131 , H01L2224/13111 , H01L2224/13187 , H01L2224/1319 , H01L2224/13191 , H01L2224/13561 , H01L2224/13565 , H01L2224/13578 , H01L2224/13582 , H01L2224/13583 , H01L2224/13647 , H01L2224/1369 , H01L2224/1601 , H01L2224/16057 , H01L2224/16058 , H01L2224/16113 , H01L2224/16145 , H01L2224/81007 , H01L2224/811 , H01L2224/81815 , H01L2224/819 , H01L2224/81902 , H01L2225/06513 , H01L2225/06541 , H01L2225/06589 , H01L2924/00012 , H01L2924/0715 , H01L2924/0497 , H01L2924/01025 , H01L2924/0549 , H01L2924/05342 , H01L2924/0536 , H01L2924/01074 , H01L2924/014 , H01L2924/01047 , H01L2924/01029 , H01L2924/00014
摘要： A semiconductor device includes: a first semiconductor-chip including a first electrode; a second semiconductor-chip including a second electrode; and a switch including a core element configured to contract and expand by a temperature change, a heat generation unit configured to heat the core element, a first metal element configured to cover the core element and connected to the first electrode, and a second metal element configured to cover the core element and connected to the second electrode, wherein, when the core element contracts, the first metal element and the second metal element come in contact with each other so that the first semiconductor-chip and the second semiconductor-chip are electrically connected with each other, and when the core element expands, the first metal element and the second metal element become in non-contact with each other so that the first semiconductor-chip and the second semiconductor-chip are electrically separated from each other.
摘要翻译： 一种半导体器件包括：包括第一电极的第一半导体芯片; 包括第二电极的第二半导体芯片; 以及包括被构造成通过温度变化而收缩和膨胀的芯体元件的开关，被配置为加热所述芯元件的发热单元，被配置为覆盖所述芯元件并连接到所述第一电极的第一金属元件，以及第二金属元件 被配置为覆盖所述芯体并连接到所述第二电极，其中，当所述芯体收缩时，所述第一金属元件和所述第二金属元件彼此接触，使得所述第一半导体芯片和所述第二半导体芯片是 彼此电连接，并且当芯元件膨胀时，第一金属元件和第二金属元件彼此不接触，使得第一半导体芯片和第二半导体芯片彼此电分离。
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公开(公告)号：US09209165B2
公开(公告)日：2015-12-08
申请号：US14059302
申请日：2013-10-21
IPC分类号： H01L25/065 , H01L25/00 , H01L23/544 , H01L23/00
CPC分类号： H01L25/50 , H01L23/544 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/72 , H01L24/75 , H01L24/81 , H01L25/0652 , H01L25/0657 , H01L2223/54426 , H01L2224/0401 , H01L2224/05555 , H01L2224/0557 , H01L2224/10135 , H01L2224/10165 , H01L2224/131 , H01L2224/1329 , H01L2224/133 , H01L2224/1601 , H01L2224/16105 , H01L2224/16135 , H01L2224/16151 , H01L2224/1703 , H01L2224/2919 , H01L2224/29193 , H01L2224/32145 , H01L2224/73103 , H01L2224/73203 , H01L2224/73257 , H01L2224/75705 , H01L2224/7598 , H01L2224/81007 , H01L2224/81129 , H01L2224/81141 , H01L2224/81815 , H01L2224/8185 , H01L2224/81898 , H01L2224/819 , H01L2224/8313 , H01L2224/83132 , H01L2224/83136 , H01L2224/83193 , H01L2224/8385 , H01L2224/92143 , H01L2225/06517 , H01L2225/06531 , H01L2225/06551 , H01L2225/06555 , H01L2225/06562 , H01L2225/06589 , H01L2924/10253 , H01L2924/1431 , H01L2924/1434 , H01L2924/1436 , H01L2924/37001
摘要： An assembly component and a technique for assembling a chip package using the assembly component are described. This chip package includes a set of semiconductor dies that are arranged in a stack in a vertical direction, which are offset from each other in a horizontal direction to define a stepped terrace at one side of the vertical stack. Moreover, the chip package may be assembled using the assembly component. In particular, the assembly component may include a pair of stepped terraces that approximately mirror the stepped terrace of the chip package and which provide vertical position references for an assembly tool that positions the set of semiconductor dies in the vertical stack during assembly of the chip package.
摘要翻译： 描述了使用组装部件组装芯片封装的组装部件和技术。 该芯片封装包括沿垂直方向布置成堆叠的一组半导体管芯，它们在水平方向彼此偏移以在垂直堆叠的一侧限定阶梯式台阶。 此外，可以使用组件部件组装芯片封装。 特别地，组装部件可以包括一对阶梯式台阶，其大致镜像芯片封装的阶梯式台阶，并且为组装工具提供垂直位置参考，该组装工具在组装芯片封装期间将该组半导体管芯定位在垂直堆叠中 。
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6.发明申请公开(公告)号：US20120068331A1
公开(公告)日：2012-03-22
申请号：US12887775
申请日：2010-09-22
申请人： Eugene M. Chow , Eric Peeters
发明人： Eugene M. Chow , Eric Peeters
CPC分类号： H05K3/32 , G01R1/06727 , H01L21/56 , H01L21/6835 , H01L23/3157 , H01L23/48 , H01L23/49811 , H01L24/13 , H01L24/16 , H01L2221/68331 , H01L2221/68377 , H01L2221/68381 , H01L2224/1161 , H01L2224/1182 , H01L2224/1191 , H01L2224/13008 , H01L2224/13012 , H01L2224/13016 , H01L2224/13022 , H01L2224/13026 , H01L2224/131 , H01L2224/1355 , H01L2224/13564 , H01L2224/136 , H01L2224/16225 , H01L2224/81192 , H01L2224/81801 , H01L2224/819 , H01L2924/0001 , H01L2924/01006 , H01L2924/01012 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01074 , H01L2924/01082 , H01L2924/01093 , H01L2924/014 , H01L2924/14 , Y10T29/49147 , H01L2224/13099 , H01L2924/00
摘要： At least one microspring has applied thereover a laminate structure to provide: mechanical protection during handling and wafer processing, a spring spacer layer, strengthening of the anchor between spring and substrate, provision of a gap stop during spring deflection, and moisture and contaminant protection. A fully-formed laminate structure may be applied over the microspring structure or a partly-formed laminate structure may be applied over the microspring structure then cured or hardened. The tip portion of the microspring may protrude through the laminate structure and be exposed for contact or may be buried within the contact structure. The laminate structure may remain in place in the final microspring structure or be removed in whole or in part. The laminate structure may be photolithographically patternable material, patterned and etched to remove some or all of the structure, forming for example additional structural elements such as a gap stop for the microspring.
摘要翻译： 至少一个微小弹簧已经施加在层压结构之上，以提供：在处理和晶片加工期间的机械保护，弹簧间隔层，弹簧和基底之间的锚固件的加强，在弹簧偏转期间提供间隙止挡，以及水分和污染物保护。 可以将完全成型的层压结构施加在微小弹簧结构上，或者可以将部分形成的层压结构施加到微弹体结构上，然后固化或硬化。 微小弹簧的尖端部分可以突出穿过层压结构并暴露以进行接触或者可以埋在接触结构内。 层压结构可以保留在最终微型结构中的适当位置或全部或部分去除。 层压结构可以是光刻图案化的材料，图案化和蚀刻以除去部分或全部结构，形成例如附加的结构元件，例如用于微弹簧的间隙止动件。
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公开(公告)号：US20090035959A1
公开(公告)日：2009-02-05
申请号：US12251217
申请日：2008-10-14
IPC分类号： H01R12/00
CPC分类号： G01R1/06727 , G01R1/07342 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/72 , H01L2224/02311 , H01L2224/02313 , H01L2224/02335 , H01L2224/0235 , H01L2224/0239 , H01L2224/0345 , H01L2224/03472 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05008 , H01L2224/0502 , H01L2224/05027 , H01L2224/05552 , H01L2224/05563 , H01L2224/056 , H01L2224/10122 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/11472 , H01L2224/13012 , H01L2224/13016 , H01L2224/13023 , H01L2224/13026 , H01L2224/13082 , H01L2224/131 , H01L2224/13144 , H01L2224/13155 , H01L2224/13164 , H01L2224/13173 , H01L2224/1379 , H01L2224/138 , H01L2224/1412 , H01L2224/1413 , H01L2224/16057 , H01L2224/81007 , H01L2224/81191 , H01L2224/81801 , H01L2224/8185 , H01L2224/819 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01R13/03 , H01L2924/01027 , H01L2924/00014 , H01L2924/00012
摘要： Interconnect assemblies having resilient contact elements and methods for making these assemblies. In one aspect, the interconnect assembly includes a substrate and a resilient electrical contact element disposed on the substrate. A first portion of the resilient contact structure is disposed on the substrate and a second portion extends away from the substrate and is capable of moving from a first position to a second position under the application of a force. A stop structure is disposed on the surface of the substrate and on a surface of the first portion of the resilient contact structure. According to another aspect of the present invention, a beam portion of the resilient contact structure has a substantially triangular shape.
摘要翻译： 具有弹性接触元件的互连组件和用于制造这些组件的方法。 在一个方面，互连组件包括衬底和设置在衬底上的弹性电接触元件。 弹性接触结构的第一部分设置在基底上，第二部分远离基底延伸并且能够在施加力的情况下从第一位置移动到第二位置。 止动结构设置在基板的表面上和弹性接触结构的第一部分的表面上。 根据本发明的另一方面，弹性接触结构的梁部分具有基本上三角形的形状。
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公开(公告)号：US07435108B1
公开(公告)日：2008-10-14
申请号：US09364788
申请日：1999-07-30
IPC分类号： H05K1/00
CPC分类号： G01R1/06727 , G01R1/07342 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/72 , H01L2224/02311 , H01L2224/02313 , H01L2224/02335 , H01L2224/0235 , H01L2224/0239 , H01L2224/0345 , H01L2224/03472 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05008 , H01L2224/0502 , H01L2224/05027 , H01L2224/05552 , H01L2224/05563 , H01L2224/056 , H01L2224/10122 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/11472 , H01L2224/13012 , H01L2224/13016 , H01L2224/13023 , H01L2224/13026 , H01L2224/13082 , H01L2224/131 , H01L2224/13144 , H01L2224/13155 , H01L2224/13164 , H01L2224/13173 , H01L2224/1379 , H01L2224/138 , H01L2224/1412 , H01L2224/1413 , H01L2224/16057 , H01L2224/81007 , H01L2224/81191 , H01L2224/81801 , H01L2224/8185 , H01L2224/819 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01R13/03 , H01L2924/01027 , H01L2924/00014 , H01L2924/00012
摘要： Interconnect assemblies having resilient contact elements and methods for making these assemblies. In one aspect, the interconnect assembly includes a substrate and a resilient electrical contact element disposed on the substrate. A first portion of the resilient contact structure is disposed on the substrate and a second portion extends away from the substrate and is capable of moving from a first position to a second position under the application of a force. A stop structure is disposed on the surface of the substrate and on a surface of the first portion of the resilient contact structure. According to another aspect of the present invention, a beam portion of the resilient contact structure has a substantially triangular shape.
摘要翻译： 具有弹性接触元件的互连组件和用于制造这些组件的方法。 在一个方面，互连组件包括衬底和设置在衬底上的弹性电接触元件。 弹性接触结构的第一部分设置在基底上，第二部分远离基底延伸并且能够在施加力的情况下从第一位置移动到第二位置。 止动结构设置在基板的表面上和弹性接触结构的第一部分的表面上。 根据本发明的另一方面，弹性接触结构的梁部分具有基本上三角形的形状。
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9.发明申请Multi-chip programmable logic device having configurable logic circuitry and configuration data storage on different dice 有权具有可配置的逻辑电路和不同骰子上的配置数据存储的多芯片可编程逻辑器件公开(公告)号：US20040178819A1
公开(公告)日：2004-09-16
申请号：US10387622
申请日：2003-03-12
申请人： Xilinx, Inc.
发明人： Bernard J. New
IPC分类号： H03K019/177
CPC分类号： H01L24/11 , H01L23/3171 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/18 , H01L25/50 , H01L27/0207 , H01L27/11803 , H01L27/11898 , H01L2224/114 , H01L2224/1147 , H01L2224/11616 , H01L2224/13082 , H01L2224/13099 , H01L2224/131 , H01L2224/13147 , H01L2224/1412 , H01L2224/16148 , H01L2224/81141 , H01L2224/81193 , H01L2224/81203 , H01L2224/81801 , H01L2224/81898 , H01L2224/819 , H01L2225/06513 , H01L2225/06527 , H01L2225/06541 , H01L2225/06593 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01073 , H01L2924/014 , H01L2924/14 , H01L2924/00
摘要： The circuitry of a programmable logic device (for example, an FPGA) includes a configurable logic portion and a configuration memory. The configuration memory stores configuration data that configures the configurable logic portion to realize a user-defined circuit. The configurable logic portion is disposed on a first die whereas the configuration memory is disposed on a second die. The second die is bonded to the first die in stacked relation. Each bit of configuration data passes from the second die to the first die through a pair of micropads. One micropad of the pair is disposed on the first die and the other micropad of the pair is disposed on the second die. When the first die and second die are brought together in face-to-face relation, the two micropads form an electrical connection through which the configuration data bit passes from the second die to the first die.
摘要翻译： 可编程逻辑器件（例如，FPGA）的电路包括可配置逻辑部分和配置存储器。 配置存储器存储配置可配置逻辑部分以实现用户定义电路的配置数据。 可配置逻辑部分设置在第一管芯上，而配置存储器设置在第二管芯上。 第二模具以堆叠关系结合到第一模具。 配置数据的每一位通过一对微阵列从第二管芯传递到第一管芯。 该对的一个微突片设置在第一裸片上，另一个微突片设置在第二裸片上。 当第一裸片和第二裸片以面对面的关系被组合在一起时，两个微结构形成电连接，配置数据位通过该电连接从第二裸片传递到第一裸片。
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公开(公告)号：US5830782A
公开(公告)日：1998-11-03
申请号：US678808
申请日：1996-07-12
申请人： John W. Smith , Thomas H. Distefano
发明人： John W. Smith , Thomas H. Distefano
CPC分类号： H01L21/4839 , H01L21/561 , H01L21/6836 , H01L23/22 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L23/544 , H01L23/642 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/94 , H01L24/97 , H05K3/4084 , H01L2221/68327 , H01L2223/54426 , H01L2224/0401 , H01L2224/05644 , H01L2224/13016 , H01L2224/13018 , H01L2224/13026 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13582 , H01L2224/13611 , H01L2224/13617 , H01L2224/13638 , H01L2224/13644 , H01L2224/1412 , H01L2224/16057 , H01L2224/16225 , H01L2224/17104 , H01L2224/29191 , H01L2224/45124 , H01L2224/48744 , H01L2224/73204 , H01L2224/7525 , H01L2224/753 , H01L2224/75701 , H01L2224/75702 , H01L2224/75744 , H01L2224/75745 , H01L2224/75802 , H01L2224/75804 , H01L2224/75822 , H01L2224/75824 , H01L2224/81007 , H01L2224/81091 , H01L2224/8113 , H01L2224/81132 , H01L2224/81192 , H01L2224/81203 , H01L2224/81207 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/81457 , H01L2224/81464 , H01L2224/81469 , H01L2224/81825 , H01L2224/8183 , H01L2224/819 , H01L2224/83005 , H01L2224/83104 , H01L2224/8385 , H01L2224/83855 , H01L2224/83862 , H01L2224/95001 , H01L2224/97 , H01L24/05 , H01L24/29 , H01L24/75 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01066 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15174 , H01L2924/19043 , H01L2924/351 , H05K1/118 , H05K2201/0133 , H05K2201/0394 , H05K2201/0397 , H05K2201/09081 , H05K2201/091 , H05K2203/063 , H05K3/361
摘要： A method of making a microelectronic assembly includes bonding a plurality of lead connection sections arranged in a row to contacts of a microelectronic element such as a semiconductor chip having contacts in rows at the periphery of the chip. The leads have terminal sections secured to a dielectric support structure, and horizontally curved sections between the terminal regions and bond regions. After bonding, the dielectric support structure is lifted upwardly relative to the chip, so as to bend the leads into a vertically-extensive orientation. Partial straightening of the original horizontal curvature allows each lead to stretch and accommodate the vertical movement.
摘要翻译： 制造微电子组件的方法包括将布置成行的多个引线连接部分接合到微电子元件的触点，例如在芯片周边具有行的触点的半导体芯片。 引线具有固定到电介质支撑结构的端子部分，以及端子区域和接合区域之间的水平弯曲部分。 在接合之后，电介质支撑结构相对于芯片向上提升，以便将引线弯曲成垂直方向。 原始水平曲率的部分矫直允许每个导线拉伸并适应垂直运动。
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