公开(公告)号：US20110062471A1

公开(公告)日：2011-03-17

申请号：US12561617

申请日：2009-09-17

申请人： Serge J. BIERHUIZEN ,  Nanze Patrick WANG ,  Gregory W. ENG ,  Decai SUN ,  Yajun WEI

发明人： Serge J. BIERHUIZEN ,  Nanze Patrick WANG ,  Gregory W. ENG ,  Decai SUN ,  Yajun WEI

IPC分类号： H01L33/00 ,  H01L21/78

CPC分类号： H01L33/58 ,  H01L25/13 ,  H01L25/50 ,  H01L33/486 ,  H01L33/507 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01L2924/00

摘要： An array of housings with housing bodies and lenses is molded, or an array of housing bodies is molded and bonded with lenses to form an array of housings with housing bodies and lenses. Light-emitting diodes (LEDs) are attached to the housings in the array. An array of metal pads may be bonded to the back of the array or insert molded with the housing array to form bond pads on the back of the housings. The array is singulated to form individual LED modules.

摘要翻译： 模制具有壳体和透镜的壳体阵列，或者将壳体主体的阵列模制并与透镜结合以形成具有壳体和透镜的壳体阵列。 发光二极管（LED）连接到阵列中的外壳。 金属焊盘的阵列可以结合到阵列的背面或用壳体阵列模制的嵌件以在壳体的背面形成接合焊盘。 将阵列分割成单独的LED模块。

公开(公告)号：US20100252846A1

公开(公告)日：2010-10-07

申请号：US12417673

申请日：2009-04-03

申请人： Serge J. BIERHUIZEN ,  Gregory W. ENG

发明人： Serge J. BIERHUIZEN ,  Gregory W. ENG

IPC分类号： H01L33/00

CPC分类号： G02B6/0021 ,  G02B6/0018 ,  G02B6/0031

摘要： A light source such as a semiconductor light emitting diode is positioned in a first opening in a transparent member, which may function as a waveguide in a display. The transparent member surrounds the light source. No light source is positioned in a second opening in the transparent member. In some embodiments, the first opening is shaped to direct light into the transparent member. In some embodiments, a reflector is positioned over the light source. The reflector includes a flat portion and a shaped portion. The shaped portion extends from the flat portion toward the light source.

摘要翻译： 诸如半导体发光二极管的光源位于透明构件中的第一开口中，其可以用作显示器中的波导。 透明构件围绕光源。 没有光源位于透明构件的第二开口中。 在一些实施例中，第一开口被成形为将光引导到透明构件中。 在一些实施例中，反射器位于光源上方。 反射器包括平坦部分和成形部分。 成形部分从平坦部分朝向光源延伸。

公开(公告)号：US20110018017A1

公开(公告)日：2011-01-27

申请号：US12508238

申请日：2009-07-23

申请人： Serge J. BIERHUIZEN ,  Gregory W. ENG

发明人： Serge J. BIERHUIZEN ,  Gregory W. ENG

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/46 ,  H01L33/505 ,  H01L33/58 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2933/0025 ,  H01L2924/00

摘要： A submount wafer, having mounted on it an array of LEDs with a phosphor layer, is positioned with respect to a mold having an array of indentions. A mixture of silicone and 10%-50%, by weight, TiO2, is dispensed between the wafer and the indentions, creating a molded substantially reflective material. The molded mixture forms a reflective wall covering the sidewalls of the LED. The reflective material is then cured, and the submount wafer is separated from the mold such that the reflective material covering the sidewalls contains light emitted from the LED. The submount wafer is then diced. A piece (e.g., a reflector, support bracket, etc.) may then be affixed to the submount so the LED protrudes through a center hole in the piece. The inner edge of the piece is easily formed so that it is located at any height above or below the top surface of the LED.

摘要翻译： 安装在其上的具有磷光体层的LED阵列的底座晶片相对于具有凹陷阵列的模具定位。 硅胶和10％-50％（重量）TiO 2的混合物分配在晶片和凹痕之间，形成模制的基本上反射的材料。 模制混合物形成覆盖LED侧壁的反射壁。 然后将反射材料固化，并且将底座晶片与模具分离，使得覆盖侧壁的反射材料包含从LED发射的光。 然后将底座晶片切割。 然后可以将一件（例如，反射器，支撑支架等）固定到底座，使得LED突出穿过该件的中心孔。 该件的内边缘易于形成，使其位于LED顶部表面上方或下方的任何高度。