Method of manufacturing a semiconductor device by irradiating with a laser beam
    1.
    发明授权
    Method of manufacturing a semiconductor device by irradiating with a laser beam 有权
    通过照射激光来制造半导体器件的方法

    公开(公告)号:US07087504B2

    公开(公告)日:2006-08-08

    申请号:US10133588

    申请日:2002-04-29

    IPC分类号: H01L21/20

    摘要: A technique for manufacturing TFTs having little dispersion in their electrical characteristics is provided. Contamination of a semiconductor film is reduced by performing oxidation processing having an organic matter removing effect, forming a clean oxide film, after removing a natural oxide film formed on a semiconductor film surface. TFTs having little dispersion in their electrical characteristics can be obtained by using the semiconductor film thus obtained in active layers of the TFTs, and the electrical properties can be improved. In addition, deterioration in productivity and throughput can be reduced to a minimum by using a semiconductor manufacturing apparatus of the present invention.

    摘要翻译: 提供了一种用于制造其电特性几乎没有偏差的TFT的技术。 在除去形成在半导体膜表面上的自然氧化物膜之后,通过进行具有有机物去除效果的氧化处理,形成清洁的氧化物膜来减少半导体膜的污染。 通过使用在TFT的有源层中获得的半导体膜,可以获得其电特性几乎没有色散的TFT,并且可以提高电性能。 此外,通过使用本发明的半导体制造装置,可以将生产率和生产量的劣化降低到最小。

    Method of manufacturing a semiconductor device and semiconductor manufacturing apparatus
    3.
    发明授权
    Method of manufacturing a semiconductor device and semiconductor manufacturing apparatus 有权
    半导体装置及半导体制造装置的制造方法

    公开(公告)号:US07217952B2

    公开(公告)日:2007-05-15

    申请号:US11221773

    申请日:2005-09-09

    IPC分类号: H01L29/04

    摘要: A technique for manufacturing TFTs having little dispersion in their electrical characteristics is provided. Contamination of a semiconductor film is reduced by performing oxidation processing having an organic matter removing effect, forming a clean oxide film, after removing a natural oxide film formed on a semiconductor film surface. TFTs having little dispersion in their electrical characteristics can be obtained by using the semiconductor film thus obtained in active layers of the TFTs, and the electrical properties can be improved. In addition, deterioration in productivity and throughput can be reduced to a minimum by using a semiconductor manufacturing apparatus of the present invention.

    摘要翻译: 提供了一种用于制造其电特性几乎没有偏差的TFT的技术。 在除去形成在半导体膜表面上的自然氧化物膜之后,通过进行具有有机物去除效果的氧化处理,形成清洁的氧化物膜来减少半导体膜的污染。 通过使用在TFT的有源层中获得的半导体膜,可以获得其电特性几乎没有色散的TFT,并且可以提高电性能。 此外,通过使用本发明的半导体制造装置,可以将生产率和生产量的劣化降低到最小。

    Semiconductor film, semiconductor device, and method of manufacturing the same including adding metallic element to the amorphous semiconductor film and introducing oxygen after crystallization
    4.
    发明授权
    Semiconductor film, semiconductor device, and method of manufacturing the same including adding metallic element to the amorphous semiconductor film and introducing oxygen after crystallization 有权
    半导体膜,半导体器件及其制造方法,包括在非晶半导体膜中添加金属元素并在结晶后引入氧

    公开(公告)号:US07015079B2

    公开(公告)日:2006-03-21

    申请号:US10771404

    申请日:2004-02-05

    摘要: By adding a novel improvement to the technique disclosed in JP 8-78329 A, a manufacturing method in which film characteristics of a semiconductor film having a crystalline structure are improved is provided. In addition, a TFT having superior TFT characteristics, such as field effect mobility, which uses the semiconductor film as an active layer, and a method of manufacturing the TFT, are also provided. A metallic element which promotes the crystallization of silicon is added to a semiconductor film having an amorphous structure and an oxygen concentration within the film of less than 5×1018/cm3. The semiconductor film having an amorphous structure is then heat-treated, forming a semiconductor film having a crystalline structure. Subsequently, an oxide film on the surface is removed. Oxygen is introduced to the semiconductor film having a crystalline structure, and processing is performed such that the concentration of oxygen within the film is from 5×1018/cm3 to 1×1021/cm3. After removing an oxide film on the surface of the semiconductor film, the semiconductor film surface is leveled by irradiating laser light under an inert gas atmosphere or in a vacuum.

    摘要翻译: 通过添加对JP 8-78329A中公开的技术的新颖改进,提供了具有改善晶体结构的半导体膜的膜特性的制造方法。 此外,还提供了具有优异TFT特性的TFT,例如使用半导体膜作为有源层的场效应迁移率,以及TFT的制造方法。 将促进硅结晶的金属元素添加到半导体膜中,半导体膜具有薄膜内的非晶结构和氧浓度小于5×10 18 / cm 3。 然后对具有非晶结构的半导体膜进行热处理,形成具有晶体结构的半导体膜。 随后,除去表面上的氧化物膜。 将氧气引入到具有晶体结构的半导体膜中,并且进行处理,使得膜内的氧浓度为5×10 18 / cm 3至1×10 6 > 21 3/3。 在去除半导体膜表面上的氧化物膜之后,通过在惰性气体气氛或真空中照射激光来平整半导体膜表面。

    Irregular semiconductor film, having ridges of convex portion
    5.
    发明授权
    Irregular semiconductor film, having ridges of convex portion 有权
    不规则的半导体膜,具有凸部的凸脊

    公开(公告)号:US06777713B2

    公开(公告)日:2004-08-17

    申请号:US10265634

    申请日:2002-10-08

    IPC分类号: H01L2900

    摘要: By adding a novel improvement to the technique disclosed in JP 8-78329 A, a manufacturing method in which film characteristics of a semiconductor film having a crystalline structure are improved is provided. In addition, a TFT having superior TFT characteristics, such as field effect mobility, which uses the semiconductor film as an active layer, and a method of manufacturing the TFT, are also provided. A metallic element which promotes the crystallization of silicon is added to a semiconductor film having an amorphous structure and an oxygen concentration within the film of less than 5×1018/cm3. The semiconductor film having an amorphous structure is then heat-treated, forming a semiconductor film having a crystalline structure. Subsequently, an oxide film on the surface is removed. Oxygen is introduced to the semiconductor film having a crystalline structure, and processing is performed such that the concentration of oxygen within the film is from 5×1018/cm3 to 1×1021/cm3. After removing an oxide film on the surface of the semiconductor film, the semiconductor film surface is leveled by irradiating laser light under an inert gas atmosphere or in a vacuum.

    摘要翻译: 通过添加对JP 8-78329A中公开的技术的新颖改进,提供了具有改善晶体结构的半导体膜的膜特性的制造方法。 此外,还提供了具有优异TFT特性的TFT,例如使用半导体膜作为有源层的场效应迁移率,以及TFT的制造方法。 将促进硅结晶的金属元素加入到膜内的非晶结构和氧浓度小于5×10 18 / cm 3的半导体膜中。 然后对具有非晶结构的半导体膜进行热处理,形成具有晶体结构的半导体膜。 随后,除去表面上的氧化物膜。 将氧气引入具有晶体结构的半导体膜,并且进行处理,使得膜内的氧浓度为5×10 18 / cm 3至1×10 21 / cm 3。 在去除半导体膜表面上的氧化物膜之后,通过在惰性气体气氛或真空中照射激光来平整半导体膜表面。

    Method of manufacturing a TFT using a catalytic element to promote crystallization of a semiconductor film and gettering the catalytic element
    6.
    发明授权
    Method of manufacturing a TFT using a catalytic element to promote crystallization of a semiconductor film and gettering the catalytic element 失效
    使用催化元件制造TFT以促进半导体膜的结晶并吸收催化元素的方法

    公开(公告)号:US06727124B2

    公开(公告)日:2004-04-27

    申请号:US10000238

    申请日:2001-11-02

    IPC分类号: H01L2184

    摘要: A catalytic element for promoting crystallization of an amorphous silicon film is efficiently gettered to provide a highly reliable TFT, and an electro-optical device using the TFT and a method of manufacturing the electro-optical device are provided. The electro-optical device has an n-channel TFT and a p-channel TFT. A semiconductor layer of the p-channel TFT has a channel forming region (13), a region (11) containing an n-type impurity element and a p-type impurity element, and a region (12) containing only a p-type impurity element. In the p-channel TFT, a wiring line for electrically connecting the TFTs is connected to the region (12) containing only a p-type impurity element. The region containing an n-type impurity element in the p-channel TFT is narrower than a region doped with an n-type impurity element in a semiconductor layer of the n-channel TFT.

    摘要翻译: 提供了一种用于促进非晶硅膜的结晶的催化元件,以提供高度可靠的TFT,并且提供了使用该TFT的电光器件和制造该电光器件的方法。 电光装置具有n沟道TFT和p沟道TFT。 p沟道TFT的半导体层具有沟道形成区域(13),包含n型杂质元素和p型杂质元素的区域(11)和仅包含p型杂质元素的区域(12) 杂质元素。 在p沟道TFT中,用于电连接TFT的布线与仅包含p型杂质元素的区域(12)连接。 在p沟道TFT中含有n型杂质元素的区域比n沟道TFT的半导体层中掺杂有n型杂质元素的区域窄。

    Semiconductor device and method of manufacturing the same
    8.
    发明申请
    Semiconductor device and method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US20050170573A1

    公开(公告)日:2005-08-04

    申请号:US11088888

    申请日:2005-03-25

    摘要: Problems in prior art regarding an n-channel TFT in the source/drain gettering method are solved. In the n-channel TFT, its source/drain regions contain only an n-type impurity. Therefore, compared to a p-channel TFT whose source/drain regions contain an n-type impurity and a higher concentration of p-type impurity, the gettering efficiency is inferior in a channel region of the n-channel transistor. Accordingly, the problem of inferior gettering efficiency in the n-channel TFT can be solved by providing at an end of its source/drain regions a highly efficient gettering region that contains an n-type impurity and a p-type impurity both with the concentration of the p-type impurity set higher than the concentration of the n-type impurity.

    摘要翻译: 解决了在源极/漏极吸杂方法中关于n沟道TFT的现有技术中的问题。 在n沟道TFT中,其源极/漏极区仅包含n型杂质。 因此,与源极/漏极区域包含n型杂质和较高浓度的p型杂质的p沟道TFT相比,n沟道晶体管的沟道区域的吸杂效率较差。 因此,可以通过在其源极/漏极区域的末端设置包含n型杂质的高效吸气区域和浓度为p型的p型杂质来解决n沟道TFT的吸杂效率差的问题 的p型杂质的浓度高于n型杂质浓度。

    Semiconductor device and method of manufacturing the same
    9.
    发明授权
    Semiconductor device and method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US07625786B2

    公开(公告)日:2009-12-01

    申请号:US11088888

    申请日:2005-03-25

    IPC分类号: H01L21/84

    摘要: Problems in prior art regarding an n-channel TFT in the source/drain gettering method are solved. In the n-channel TFT, its source/drain regions contain only an n-type impurity. Therefore, compared to a p-channel TFT whose source/drain regions contain an n-type impurity and a higher concentration of p-type impurity, the gettering efficiency is inferior in a channel region of the n-channel transistor. Accordingly, the problem of inferior gettering efficiency in the n-channel TFT can be solved by providing at an end of its source/drain regions a highly efficient gettering region that contains an n-type impurity and a p-type impurity both with the concentration of the p-type impurity set higher than the concentration of the n-type impurity.

    摘要翻译: 解决了在源极/漏极吸杂方法中关于n沟道TFT的现有技术中的问题。 在n沟道TFT中,其源极/漏极区仅包含n型杂质。 因此,与源极/漏极区域包含n型杂质和较高浓度的p型杂质的p沟道TFT相比,n沟道晶体管的沟道区域的吸杂效率较差。 因此,可以通过在其源极/漏极区域的末端设置包含n型杂质的高效吸气区域和浓度为p型的p型杂质来解决n沟道TFT的吸杂效率差的问题 的p型杂质的浓度高于n型杂质浓度。

    Thin film transistor semiconductor device
    10.
    发明授权
    Thin film transistor semiconductor device 有权
    薄膜晶体管半导体器件

    公开(公告)号:US07141823B2

    公开(公告)日:2006-11-28

    申请号:US10254670

    申请日:2002-09-26

    IPC分类号: H01L31/072

    摘要: In a TFT with a GOLD structure, there is provided a structure which is able to improve an operating characteristic and reliability and reduce an off current value in order to reduce power consumption of a semiconductor device. The surface of LDD region (4) overlapped with a portion (7a) of a gate electrode through a gate insulating film (6) interposed therebetween is extremely flattened. Thus, it is possible to obtain a TFT structure which is capable of reducing a parasitic capacitance in the LDD region of the TFT with the GOLD structure, reducing an off current value, improving reliability, and enabling high speed operation.

    摘要翻译: 在具有GOLD结构的TFT中,提供了能够提高工作特性和可靠性并降低截止电流值以降低半导体器件的功耗的结构。 通过栅绝缘膜(6)与栅电极的部分(7a)重叠的LDD区(4)的表面极其平坦化。 因此,可以获得能够降低具有GOLD结构的TFT的LDD区域中的寄生电容的TFT结构,从而降低截止电流值,提高可靠性并实现高速运行。