Array substrate including vertical TFT, and manufacturing method thereof

    公开(公告)号:US10224406B2

    公开(公告)日:2019-03-05

    申请号:US15325985

    申请日:2016-10-12

    摘要: A TFT array substrate includes a glass substrate, a buffer layer on the glass substrate, a source electrode, a passivation layer on the buffer layer, a gate electrode on the passivation layer, a gate insulating layer on the passivation layer and the gate electrode, an active layer, and a pixel electrode on the gate insulating layer and the active layer. A first source hole is formed in the buffer layer. The source electrode is disposed in the first source hole. A second source hole is formed in the passivation layer and over the first source hole. The source electrode extends into the second source hole. An active layer mounting hole is formed in the gate insulating layer and over the second source hole. The active layer is in the active layer mounting hole.

    Manufacturing method of IPS array substrate and IPS array substrate

    公开(公告)号:US10120246B2

    公开(公告)日:2018-11-06

    申请号:US15328495

    申请日:2016-12-15

    发明人: Zhichao Zhou Hui Xia

    摘要: The present invention provides a manufacturing method of an IPS array substrate and an IPS array substrate. The manufacturing method of the IPS array substrate according to the present invention uses a half-tone mask to simultaneously form a common electrode and a pixel electrode that stagger in a longitudinal direction so that the common electrode is set inside a common electrode channel of an insulation protection layer while the pixel electrode is set on an upper surface of the insulation protection layer to provide an IPS array substrate, which, compared to a traditional IPS array substrate, allows the common electrode and the pixel electrode to generate therebetween a longitudinal component of an electric field whereby liquid crystal of a liquid crystal panel that is located above the pixel electrode can be driven and used, where the liquid crystal is allowed to rotate horizontally and also allowed to generate a predetermined longitudinal tilt angle the TFT substrate can be a TFT substrate provided for a traditional IPS array substrate, making it possible to save one mask and associated process, as compared to a traditional FFS array substrate, and thus saving manufacturing cost.

    Copper etchant solution additives and method for producing copper etchant solution

    公开(公告)号:US10246783B2

    公开(公告)日:2019-04-02

    申请号:US15123645

    申请日:2016-07-11

    IPC分类号: C23F1/18

    摘要: The present disclosure discloses a copper etchant solution additives and a method for producing copper etchant solution. The method includes: producing copper etchant solution additives, wherein the copper etchant solution additives is an inorganic solution with cupric ions (Cu2+), and deionized water is a solvent for the copper etchant solution additives and is electric neutrality; before wet-etching, the copper etchant solution additives is added in the copper etchant solution, and the copper etchant solution is with a cupric ions (Cu2+) concentration of 700-1000 ppm. Through the above method, the present disclosure can improve etchant property of copper etchant solution to increase etching rate and uniformity.

    Method for preparing electrode
    9.
    发明授权

    公开(公告)号:US09899221B2

    公开(公告)日:2018-02-20

    申请号:US15113432

    申请日:2016-06-29

    发明人: Zhichao Zhou Hui Xia

    摘要: The present disclosure discloses a method for preparing electrode including: providing a substrate; forming a buffer layer on the substrate; forming a patterned photoresist on the surface of the buffer layer away from the substrate, the photoresist has a bottom surface and a top surface disposed opposite and a side connected between the bottom surface and the top surface, the bottom surface is bonded to the buffer layer; by dry etching, the portions of the photoresist not covered by the buffer layer is removed to form a receiving area; depositing a conductive film, the conductive film layer includes a waste material forming on the top surface and an electrode filling in the receiving area; and stripping the waste material and the photoresist. The yields of the method for preparing electrode of the present disclosure is high.