摘要:
In a power on reset (POR) circuit, when power is turned on, an output signal of an inverter attains an H level and an N channel MOS transistor is rendered conductive. The potential of an input node of the inverter becomes a potential of a power supply voltage divided by a conductive resistance value R1 of a P channel MOS transistor and a conductive resistance value R2 of an N channel MOS transistor. Assuming that the threshold voltage of the inverter is 0.8 V and R1:R2=2:3, then the power supply voltage Vres at the time when signal POR# inverts its level becomes 1.33 V. Thus, this POR circuit can reliably be utilized even in a product designed to operate with 1.5 V incorporating a MOS transistor having a threshold voltage of 0.8 V.
摘要:
In a power on reset (POR) circuit, when power is turned on, an output signal of an inverter attains an H level and an N channel MOS transistor is rendered conductive. The potential of an input node of the inverter becomes a potential of a power supply voltage divided by a conductive resistance value R1 of a P channel MOS transistor and a conductive resistance value R2 of an N channel MOS transistor. Assuming that the threshold voltage of the inverter is 0.8 V and R1:R2=2:3, then the power supply voltage Vres at the time when signal POR# inverts its level becomes 1.33 V. Thus, this POR circuit can reliably be utilized even in a product designed to operate with 1.5 V incorporating a MOS transistor having a threshold voltage of 0.8 V.
摘要:
In a power on reset (POR) circuit, when power is turned on, an output signal of an inverter attains an H level and an N channel MOS transistor is rendered conductive. The potential of an input node of the inverter becomes a potential of a power supply voltage divided by a conductive resistance value R1 of a P channel MOS transistor and a conductive resistance value R2 of an N channel MOS transistor. Assuming that the threshold voltage of the inverter is 0.8 V and R1:R2=2:3, then the power supply voltage Vres at the time when signal POR# inverts its level becomes 1.33 V. Thus, this POR circuit can reliably be utilized even in a product designed to operate with 1.5 V incorporating a MOS transistor having a threshold voltage of 0.8 V.
摘要:
A semiconductor storage device includes a memory cell array, a plurality of word lines, a plurality of bit lines, a first gate wiring element 3a, 3b, a second gate wiring element 3c, 3d, a first connector 5a, 5b, and a second connector 5c, 5d. Each memory cell 10 has first and second sets having a driver transistor 11, a load transistor 12, and an access transistor 13. The word lines are arranged in parallel to each other along a first direction. The bit lines are arranged in parallel to each other along a second direction perpendicular to the first direction. The first gate wiring element comprises a gate electrode of the first driver transistor and the first load transistor, and has a rectangular shape having straight line on opposite sides. The second gate wiring element comprises a gate electrode of the access transistor and has a rectangular shape having straight line on opposite sides.
摘要:
A supply instruction signal attains the H-level before data is written into a plurality of memory cells. A P-channel MOS transistor is arranged between a power supply node and an input node. The P-channel MOS transistor is turned off to open the input node according to the supply instruction signal. In this case, a write driver discharges electric charges accumulated on the input node and electric charges accumulated on a bit line pair. However, a through-current does not flow from the power supply node to a ground node so that flow of the through-current to a CMOS inverter circuit forming each memory cell can be prevented. Accordingly, such a static semiconductor memory device can be provided that can prevent the flow of the through-current to the CMOS inverter circuit forming each memory cell when simultaneously writing data into the plurality of memory cells.
摘要:
A control circuit generates burn-in test signals and a signal on the basis of an address for causing transition of a semiconductor memory device to a burn-in test mode to output the signals to a predecoder. The predecoder outputs signals for selecting even-numbered word lines and signals for causing odd-numbered word lines to be in a non-selected state on the basis of the burn-in test signals at H level and further outputs signals for causing even-numbered word lines to be in a non-selected state and signals for selecting odd-numbered word lines on the basis of the burn-in test signals at H level. As a result, stresses can be effectively applied by the burn-in test.
摘要:
A semiconductor integrated circuit according to the present invention comprises a memory array, an input circuit for writing data in the memory array and reading data from the memory array, an output circuit and a package, including 100 pins, storing the memory array, the input circuit and the output circuit. A fourth pin, an eleventh pin, a twentieth pin, a twenty-seventh pin, a fifty-fourth pin, a sixty-first pin, a seventieth pin and a seventy-seventh pin are supplied with the same voltage. The input circuit and the output circuit receive a power supply voltage from different ones of these pins. Thus, a semiconductor integrated circuit resistant against noise and capable of responding to a high operating frequency is provided.
摘要:
To obtain a semiconductor memory device capable of keeping the internal circuit in active state at all times, without increasing the power consumption during normal operation, and not increasing the number of pins. A burn-in clock generating circuit (1) receives an external clock CLK, a mode signal MODE, and an internal clock INTCLK to output a burn-in clock BICLK to a decoder (5). The burn-in clock BICLK becomes a signal equivalent to the internal clock INTCLK when the mode signal MODE is a fixed signal of H or L indicating normal operation, and becomes a fixed signal of H for indicating activation at all times when the mode signal MODE is a clock at half frequency of the external clock CLK.
摘要:
A power on reset circuit includes a transistor connected between a power supply node and a first node, a first capacitor connected between a ground node and a first node, a resistance element connected parallel to the first capacitor, a first CMOS inverter circuit having an input node connected to the first node and an output node connected to the second node, and a second CMOS inverter circuit having an input node connected to the second node and an output node connected to the first node. Preferably, the power on reset circuit further includes a second capacitor connected between the power supply node and the second node. In the power on reset circuit, when the power is turned off, the first capacitor is fully discharged by the resistance element. Therefore, a reset signal for initializing internal circuitry can be surely generated even when the power is again turned on.
摘要:
A delay circuit delays an internal write control signal by a prescribed time to a global write driver. The global write driver is enabled in response to the delayed write control signal received from the delay circuit, to drive a global write data bus in accordance with internal write data from an input buffer. A block write driver is enabled in response to an internal write control signal and a block selection signal, to drive a local write data bus in response to data on the global write data bus. A write gate connects a bit line to the local write data bus in response to a column selection signal. The delay circuit sets the output of the block write driver at a low level for a prescribed period, whereby a precharge potential of the bit line is reduced to reduce the potential amplitude of the bit line in data writing. An SRAM which operates at a high speed with an enlarged write recovery time margin is provided. SRAM also includes various arrangement for improving operating characteristics and reliability.