摘要:
A bipolar transistor includes a Si single crystalline layer serving as a collector, a single crystalline Si/SiGeC layer and a polycrystalline Si/SiGeC layer which are formed on the Si single crystalline layer, an oxide film having an emitter opening portion, an emitter electrode, and an emitter layer. An intrinsic base layer is formed on the single crystalline Si/SiGeC layer, part of the single crystalline Si/SiGeC layer, the polycrystalline Si/SiGeC layer and the Co silicide layer together form an external base layer. The thickness of the emitter electrode is set so that boron ions implanted into the emitter electrode and diffused therein do not reach an emitter-base junction portion.
摘要:
A method of manufacturing a semiconductor device forms an intrinsic base layer by doping an impurity in the emitter polysilicon electrode into the intrinsic base region of the surface of a semiconductor substrate by heat treatment through the emitter lead-out part hole self-aligned to the base lead-out electrode. Thus, beneath the insulation film of the substrate surface between the base lead-out part hole and emitter lead-out part hole, the outer marginal part of the intrinsic base layer and the inner marginal part of the extrinsic base layer overlap uniformly. Still more, since the diffusion of the impurity by heat treatment is very fast in the polysilicon emitter electrode as compared with that in the silicon substrate, an extremely shallow intrinsic base layer may be formed.
摘要:
A bipolar transistor includes a Si single crystalline layer serving as a collector, a single crystalline Si/SiGeC layer and a polycrystalline Si/SiGeC layer which are formed on the Si single crystalline layer, an oxide film having an emitter opening portion, an emitter electrode, and an emitter layer. An intrinsic base layer is formed on the single crystalline Si/SiGeC layer, part of the single crystalline Si/SiGeC layer, the polycrystalline Si/SiGeC layer and the Co silicide layer together form an external base layer. The thickness of the emitter electrode is set so that boron ions implanted into the emitter electrode and diffused therein do not reach an emitter-base junction portion.
摘要:
In a semiconductor device functioning as a SiGeC-HBT, an emitter/base stacked portion 20 is formed on a Si epitaxially grown layer 2. The emitter/base stacked portion 20 includes: a SiGeC spacer layer 21; a SiGeC core base layer 22 containing boron at a high concentration, a SiGe cap layer 23; a Si cap layer 24, and an emitter layer 25 formed by introducing phosphorus into the Si cap layer 24 and the SiGe cap layer 23.
摘要:
A superhigh speed vertical transistor having an ultra thin base, a vertical NPN transistor having a reverse direction structure for composing an IIL, and a lateral PNP transistor similarly composing an injector of an IIL are integrated on a P-type silicon substrate. The emitter leading-out part opening of the superhigh speed vertical NPN transistor and the collector leading-out part opening of the vertical NPN transistor having a reverse direction structure are self-aligned to the base leading-out electrode. Since both the superhigh speed vertical NPN transistor having a reverse direction structure and the superhigh speed vertical NPN transistor are self-aligned, the superhigh speed vertical NPN transistor and the IIL device may be integrated on the same chip. In addition, the intrinsic base layer of the vertical NPN transistor having a reverse direction structure is deeper in junction than the base layer of the polysilicon emitter electrode for the superhigh speed NPN transistor of self-aligned type.
摘要:
By adding an iron salt, the sedimentation property, the concentration property, and the filtration property of sludge in an activated-sludge mixed liquor in a biological treatment tank are effectively improved and treated water of high quality is efficiently provided. When an iron salt such as ferrous chloride, ferric chloride, or polyferric sulfate is added to organic wastewater and the organic wastewater is biologically treated, the iron salt is added to the organic wastewater and mixing is conducted; and the water mixture is mixed with activated sludge and biologically treated. By mixing organic wastewater and an iron salt at a pH close to an optimum pH for ferric hydroxide in advance, the turbidity of the treated water due to the formation of iron oxide or ferrous carbonate is suppressed.
摘要:
A bipolar transistor includes a Si single crystalline layer serving as a collector, a single crystalline Si/SiGeC layer and a polycrystalline Si/SiGeC layer which are formed on the Si single crystalline layer, an oxide film having an emitter opening portion, an emitter electrode, and an emitter layer. An intrinsic base layer is formed on the single crystalline Si/SiGeC layer, part of the single crystalline Si/SiGeC layer, the polycrystalline Si/SiGeC layer and the Co silicide layer together form an external base layer. The thickness of the emitter electrode is set so that boron ions implanted into the emitter electrode and diffused therein do not reach an emitter-base junction portion.
摘要:
In a Bi-CMOS integrated circuit device, to reduce a collector-substrate junction capacitance in an NPN transistor and to reduce the step of forming an anti-punch-through layer of the N-channel MOS transistor. Using as a mask a resist pattern having windows made on an element isolation LOCOS film 113a, 113c and P-type well layer 106, impurities are ion-implanted to form a channel stopper layer 115a, 115b for element isolation of a NPN transistor and an anti-punch-through layer 115c for a N-channel MOS transistor. Thus, a sufficient element isolation withstand voltage can be assured while avoiding an increase in the collector-substrate capacitance of the NPN transistor which is due to the transverse diffusion of the channel stopper layer when an epitaxial layer, well layer and LOCOS film are formed. In addition, without increasing the number of steps, the drain-source withstand voltage of the N-channel type MOS transistor and the short channel durability can be improved.
摘要:
A spiral wound type membrane module for a water treating apparatus comprising:a water collection pipe having a hollow inside so as to form a water passage in which openings for communicating the hollow inside with the outside are perforated through the pipe walls;a separation membrane and a spacer wound around for several turns while being overlaid with each other to the outer circumferential surface of the water collection pipe, in which the separation membrane and the spacer are wound around such that the spacer is disposed between each of the layers of the separation membrane and, therefore, a channel for raw water to be processed and a channel for processed water after permeated through the separation membrane are alternately laminated between each of layers of the separation membrane; whereinthe spacer constituting the channel for the water to be processed has corrugating ridges extended in the axial direction of the water collection pipe and the corrugating ridges are extended in a zig-zag manner or, in another embodiment, have protrusions disposed on the inclined surface thereof such that the flow of raw water along the surface of the separation membrane is disturbed; andthe channel for the processed water is in communication with the water passage at the inside of the water collection pipe by way of the openings perforated through the pipe wall of the water collection pipe.
摘要:
In a semiconductor device acting as an HBT, an emitter/base laminate portion is provided on a Si epitaxially grown layer in the SiGeC-HBT. The emitter/base laminate portion includes a SiGeC spacer layer, a SiGeC core base layer containing the boron, a Si cap layer, and an emitter layer formed by introducing phosphorous into the Si cap layer. The C content of the SiGeC spacer layer is equal to or lower than that of the SiGeC core base layer.