摘要:
A magnetic disk drive, comprising: a slider, which is provided at a position facing to a disk surface; an arm, which is configured to conduct rocking motion around a pivot; a base, which is configured to support a motor thereon, which rotates the disk; a semiconductor laser module, which is configured to be fixed on the arm and stores a semiconductor laser element therein; a light irradiation portion upon the disk surface; and a wave guide, which is configured to build up an optical path between the light irradiation portion and the semiconductor laser module, wherein the semiconductor laser module and a portion of the base are connected therebetween by a flexible heat-conductive member having a predetermined curvature.
摘要:
A magnetic disk drive, comprising: a slider, which is provided at a position facing to a disk surface; an arm, which is configured to conduct rocking motion around a pivot; a base, which is configured to support a motor thereon, which rotates the disk; a semiconductor laser module, which is configured to be fixed on the arm and stores a semiconductor laser element therein; a light irradiation portion upon the disk surface; and a wave guide, which is configured to build up an optical path between the light irradiation portion and the semiconductor laser module, wherein the semiconductor laser module and a portion of the base are connected therebetween by a flexible heat-conductive member having a predetermined curvature.
摘要:
If a forced convection is generated by a cooling fan, there is generated a problem that a natural convection is prevented and a cooling effect in a region of the natural convection is lowered. The invention provides a structure in which an air flow generated by a forced convection does not come into contact with an air flow generated by a natural convection, by setting a partition all between a forced convection path in which the air flows on the basis of a forced convection generated by a cooling fan, and a natural convection path in which the air flows on the basis of a natural convection. Further, the partition wall is not provided near an upper end so as to draw in the air flowing through the natural convection path to a side of the forced convection path, thereby promoting the natural convection of the natural convection path.
摘要:
If a forced convection is generated by a cooling fan, there is generated a problem that a natural convection is prevented and a cooling effect in a region of the natural convection is lowered. The invention provides a structure in which an air flow generated by a forced convection does not come into contact with an air flow generated by a natural convection, by setting a partition all between a forced convection path in which the air flows on the basis of a forced convection generated by a cooling fan, and a natural convection path in which the air flows on the basis of a natural convection. Further, the partition wall is not provided near an upper end so as to draw in the air flowing through the natural convection path to a side of the forced convection path, thereby promoting the natural convection of the natural convection path.
摘要:
An electronic equipment includes a cooling system using boiling and condensation of a refrigerant, especially stabilizes the cooling performance, and reduces the influence which vibration accompanying phase change of boiling and condensation gives to the electronic equipment. Electronic equipment includes a cooling system including a cooling part which cools heat generating from a heat generator such as a heat generating component by using boiling of a refrigerant and is thermally connected to the heat generator such as the heat generating element, a heat radiation part which radiates heat absorbed by the refrigerant in the cooling part by condensation, a refrigerant drive part for delivering the condensed refrigerant to the cooling part again, and piping which fluidly connects them, and the electronic equipment includes preliminary heating means for heating the refrigerant, which flows to the cooling part from the refrigerant drive part, between the refrigerant drive part and the cooling part.
摘要:
Provided is a liquid crystal display apparatus capable of avoiding heat radiation hindrance caused from blocking of a heat radiation path by electric wiring and from interference of the electric wiring with a radiating portion for heat generated from circuit boards, in which a heat diffusion member and the circuit boards including an LED driver substrate are arranged in a plane at the rear of a frame in a housing while being isolated from one another, and LED light sources mounted on metal blocks are connected to the LED substrate through a flexible cable which is led from the outsides of the metal blocks and the heat diffusion member and is then led between the heat diffusion member and a rear case.
摘要:
There is provided a slim liquid crystal display unit having a large screen by providing a slim structure capable of sufficiently radiating the heat from a light source. The liquid crystal display unit according to the present invention includes: a liquid crystal panel; an optical guiding board installed on a rear face thereof; a pair of light source-mounted substrate disposed, opposing right and left side faces thereof; a light source mounted on the light source-mounted substrate; a metal frame connected on the opposite side to the optical guiding board of the light source-mounted substrate; a chassis member for supporting the optical guiding board and a reflection sheet group; and a thermal diffusion member fixed onto the metal frame along with the chassis member. The chassis member has a stepped portion in the vicinity of the light source. Between the stepped portion and the reflection sheet group, a thermal insulation member is attached.
摘要:
There is provided a slim liquid crystal display unit having a large screen by providing a slim structure capable of sufficiently radiating the heat from a light source. The liquid crystal display unit according to the present invention includes: a liquid crystal panel; an optical guiding board installed on a rear face thereof; a pair of light source-mounted substrate disposed, opposing right and left side faces thereof; a light source mounted on the light source-mounted substrate; a metal frame connected on the opposite side to the optical guiding board of the light source-mounted substrate; a chassis member for supporting the optical guiding board and a reflection sheet group; and a thermal diffusion member fixed onto the metal frame along with the chassis member. The chassis member has a stepped portion in the vicinity of the light source. Between the stepped portion and the reflection sheet group, a thermal insulation member is attached.
摘要:
A semiconductor cooling unit for directly jetting a cooling medium against surfaces of semiconductor devices for use in a high-speed computer or the like to effectively remove heat from the semiconductor devices, in which partition members for partitioning a space into regions where semiconductor devices are placed. Each partitioned region has an opening at its ceiling side, and a pipe for supplying or discharging the cooling medium through the opening is disposed so as to project toward a central portion of the back surface of each semiconductor device. This pipe is utilized to also section a cooling medium supply header or a cooling medium return header so that bubbles generated from the semiconductor device surfaces can be smoothly removed, and so that the cooling medium can flow smoothly onto the semiconductor devices.
摘要:
A semiconductor device comprises a mounting substrate, a semiconductor element provided above said mounting substrate, a package substrate provided above said mounting substrate with said semiconductor element therebetween and electrically connected to said semiconductor element via a primary connecting bump, a liquid cooling module cooling said semiconductor element by a liquid refrigerant, in which a heat receiving section of the liquid cooling module is disposed between said semiconductor element and said mounting substrate, and a plurality of secondary connecting bumps provided between said package substrate and said mounting substrate.