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公开(公告)号：US20100052006A1
公开(公告)日：2010-03-04
申请号：US12585058
申请日：2009-09-02
IPC分类号： H01L33/00
CPC分类号： H01L33/508 , H01L33/507 , H01L33/54 , H01L2924/0002 , H01L2924/00
摘要： A light emitting semiconductor device includes a base substrate; a light emitting semiconductor element including a crystal growth basis and provided on the base substrate so that the crystal growth basis faces in opposite direction to the base substrate; a first transparent sealing medium which seals the light emitting semiconductor on the base substrate; and a second transparent sealing medium which seals the light emitting semiconductor over the first transparent sealing medium and contains phosphor. A thickness of the second sealing medium in a portion with high emission intensity is larger than that of the other portion of the first sealing medium; and the portion with high emission intensity is defined as a portion where light emission intensity from the light emitting semiconductor element is maximum.
摘要翻译： 发光半导体器件包括：基底; 包括晶体生长基础的发光半导体元件，并且设置在所述基底基板上，使得所述晶体生长基底面向与所述基底基板相反的方向; 密封基底基板上的发光半导体的第一透明密封介质; 以及第二透明密封介质，其密封所述第一透明密封介质上的所述发光半导体并且包含磷光体。 发光强度高的部分的第二密封介质的厚度大于第一密封介质的其他部分的厚度; 并且具有高发光强度的部分被定义为来自发光半导体元件的发光强度最大的部分。
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公开(公告)号：US08232578B2
公开(公告)日：2012-07-31
申请号：US12585058
申请日：2009-09-02
IPC分类号： H01L33/00
CPC分类号： H01L33/508 , H01L33/507 , H01L33/54 , H01L2924/0002 , H01L2924/00
摘要： A light emitting semiconductor device includes a base substrate; a light emitting semiconductor element including a crystal growth basis and provided on the base substrate so that the crystal growth basis faces in opposite direction to the base substrate; a first transparent sealing medium which seals the light emitting semiconductor on the base substrate; and a second transparent sealing medium which seals the light emitting semiconductor over the first transparent sealing medium and contains phosphor. A thickness of the second sealing medium in a portion with high emission intensity is larger than that of the other portion of the first sealing medium; and the portion with high emission intensity is defined as a portion where light emission intensity from the light emitting semiconductor element is maximum.
摘要翻译： 发光半导体器件包括：基底; 包括晶体生长基础的发光半导体元件，并且设置在所述基底基板上，使得所述晶体生长基底面向与所述基底基板相反的方向; 密封基底基板上的发光半导体的第一透明密封介质; 以及第二透明密封介质，其密封所述第一透明密封介质上的所述发光半导体并且包含磷光体。 发光强度高的部分的第二密封介质的厚度大于第一密封介质的其他部分的厚度; 并且具有高发光强度的部分被定义为来自发光半导体元件的发光强度最大的部分。
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公开(公告)号：US20080296608A1
公开(公告)日：2008-12-04
申请号：US12155061
申请日：2008-05-29
申请人： Hiroyuki Tajima , Shigeo Takeda , Yukihiro Demukai
发明人： Hiroyuki Tajima , Shigeo Takeda , Yukihiro Demukai
IPC分类号： H01L33/00
CPC分类号： H01L33/56 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting element 10 is fixed on a lead frame 20 with a die-bonding member 13. The light-emitting element 10 is sealed with a silicone resin 22 and further sealed with an epoxy resin 24 from above the silicone resin 22. The die-bonding member 13 is obtainable by dispersing titanium oxide into an alicyclic epoxy resin obtained by curing an alicyclic epoxy compound with a curing agent.
摘要翻译： 发光元件10用芯片接合部件13固定在引线框架20上。发光元件10用有机硅树脂22密封，并从硅树脂22上方用环氧树脂24进一步密封。 芯片接合部件13可以通过将氧化钛分散在通过用固化剂固化脂环族环氧化合物而获得的脂环式环氧树脂中。
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公开(公告)号：US20130049061A1
公开(公告)日：2013-02-28
申请号：US13489357
申请日：2012-06-05
CPC分类号： H01L33/486 , H01L2224/48091 , H01L2224/48247 , H01L2224/49107 , H01L2224/92247 , H01L2933/0033 , H01L2924/00014
摘要： A light-emitting device includes an element mounting substrate, a light-emitting element on the element mounting substrate, a case formed around the light-emitting element and having an opening on a light extraction side of the light-emitting device, and a sealing material filled in the opening of the case to seal the light-emitting element. The element mounting substrate includes an uneven portion configured to firmly attach the element mounting substrate to the case or the sealing material.
摘要翻译： 发光装置包括元件安装基板，元件安装基板上的发光元件，形成在发光元件周围并在发光元件的光提取侧具有开口的壳体，以及密封 填充在壳体的开口中的材料以密封发光元件。 元件安装基板包括构造成将元件安装基板牢固地附接到壳体或密封材料的不平坦部分。
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公开(公告)号：USD676003S1
公开(公告)日：2013-02-12
申请号：US29413940
申请日：2012-02-22
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公开(公告)号：US09039475B2
公开(公告)日：2015-05-26
申请号：US13527445
申请日：2012-06-19
CPC分类号： H01L24/97 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48464 , H01L2224/49107 , H01L2224/92247 , H01L2924/07802 , H01L2924/12041 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A manufacturing method of light emitting devices, comprises a substrate-forming step of forming a planar-shaped substrate, a frame-forming step of forming a closed frame on the substrate, an element-mounting step of mounting multiple light emitting elements in an inside of the frame, a sealing step of injecting a liquid material that is to be a sealing member to the inside of the frame so as to seal the multiple light emitting elements, and a dividing step of dividing the multiple light emitting elements together with the substrate and the sealing member so as to obtain multiple light emitting devices with the sealing member exposed from a side surface thereof.
摘要翻译： 一种发光器件的制造方法，包括形成平面状基板的基板形成工序，在基板上形成封闭框架的框架形成工序，将多个发光元件安装在内部的元件安装工序 框架的密封步骤，将作为密封构件的液体材料注入到框架的内部以密封多个发光元件的密封步骤，以及将多个发光元件与基板分开的分割步骤 和密封构件，以便获得多个发光装置，其密封构件从其侧表面露出。
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公开(公告)号：US08823040B2
公开(公告)日：2014-09-02
申请号：US13489357
申请日：2012-06-05
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L2224/48091 , H01L2224/48247 , H01L2224/49107 , H01L2224/92247 , H01L2933/0033 , H01L2924/00014
摘要： A light-emitting device includes an element mounting substrate, a light-emitting element on the element mounting substrate, a case formed around the light-emitting element and having an opening on a light extraction side of the light-emitting device, and a sealing material filled in the opening of the case to seal the light-emitting element. The element mounting substrate includes an uneven portion configured to firmly attach the element mounting substrate to the case or the sealing material.
摘要翻译： 发光装置包括元件安装基板，元件安装基板上的发光元件，形成在发光元件周围并在发光元件的光提取侧具有开口的壳体，以及密封 填充在壳体的开口中的材料以密封发光元件。 元件安装基板包括构造成将元件安装基板牢固地附接到壳体或密封材料的不平坦部分。
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公开(公告)号：US08586391B2
公开(公告)日：2013-11-19
申请号：US13489866
申请日：2012-06-06
IPC分类号： H01L33/48
CPC分类号： H01L33/486 , H01L24/97 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49107 , H01L2224/97 , H01L2924/07802 , H01L2924/12041 , H01L2933/0033 , H01L2933/005 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： A method of manufacturing a light-emitting device includes providing a plate-shaped substrate, forming a lattice frame on a light-emitting element mounting surface of the plate-shaped substrate, mounting a light-emitting device in an opening of the lattice frame on the light-emitting element mounting surface, sealing the light-emitting element by supplying a sealing material into the opening of the lattice frame, and cutting the lattice frame and the plate-shaped substrate so as to split the lattice flame to obtain a plurality of light-emitting devices with a sidewall.
摘要翻译： 一种发光装置的制造方法，其特征在于，在所述板状基板的发光元件安装面上形成板状基板，形成格子框，将发光元件安装在格子框架的开口部 发光元件安装面，通过向网格框架的开口供给密封材料来密封发光元件，并且切割格子框架和板状基板以分离格子火焰以获得多个 具有侧壁的发光器件。
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