ZnO compound semiconductor light emitting element
    1.
    发明授权
    ZnO compound semiconductor light emitting element 失效
    ZnO化合物半导体发光元件

    公开(公告)号:US06674098B1

    公开(公告)日:2004-01-06

    申请号:US10031931

    申请日:2002-01-25

    IPC分类号: H01L2715

    摘要: A light emitting device includes a silicon substrate (1), a silicon nitride film (2) formed on the surface of the silicon substrate (1), at least an n-type layer (3), (4) and a p-type layer (6), (7) which are formed on the silicon nitride film (2) and also which are made of a ZnO based compound semiconductor, and a semiconductor layer lamination (11) in which layers are laminated to form a light emitting layer. Preferably this silicon nitride film (2) is formed by thermal treatment conducted in an atmosphere containing nitrogen such as an ammonium gas. Also, in another embodiment, a light emitting device is formed by growing a ZnO based compound semiconductor layer on a main face of a sapphire substrate, the main face being perpendicular to the C-face thereof. As a result, it is possible to obtain a device using a ZnO based compound with high properties such as an LED very excellent in crystallinity and having a high light emitting efficiency.

    摘要翻译: 发光器件包括:硅衬底(1),形成在硅衬底(1)的表面上的氮化硅膜(2),至少n型层(3),(4)和p型 形成在氮化硅膜(2)上并且由ZnO基化合物半导体制成的层(6),(7)和层叠层以形成发光层的半导体层层叠体 。 优选地,该氮化硅膜(2)通过在含氮气体的气氛中进行热处理而形成。 此外,在另一实施例中,通过在蓝宝石衬底的主面上生长ZnO基化合物半导体层,主面垂直于其C面而形成发光器件。 结果,可以获得使用具有高性能的ZnO基化合物的器件,例如非常优异的结晶度并且具有高发光效率的LED。

    ZnO based compound semiconductor light emitting device and method for manufacturing the same
    2.
    发明授权
    ZnO based compound semiconductor light emitting device and method for manufacturing the same 失效
    ZnO系化合物半导体发光元件及其制造方法

    公开(公告)号:US07605012B2

    公开(公告)日:2009-10-20

    申请号:US11166254

    申请日:2005-06-27

    IPC分类号: H01L21/00

    摘要: A light emitting device includes a silicon substrate (1), a silicon nitride film (2) formed on the surface of the silicon substrate (1), at least an n-type layer (3), (4) and a p-type layer (6), (7) which are formed on the silicon nitride film (2) and also which are made of a ZnO based compound semiconductor, and a semiconductor layer lamination (11) in which layers are laminated to form a light emitting layer. Preferably this silicon nitride film (2) is formed by thermal treatment conducted in an atmosphere containing nitrogen such as an ammonium gas. Also, in another embodiment, a light emitting device is formed by growing a ZnO based compound semiconductor layer on a main face of a sapphire substrate, the main face being perpendicular to the C-face thereof. As a result, it is possible to obtain a device using a ZnO based compound with high properties such as an LED very excellent in crystallinity and having a high light emitting efficiency.

    摘要翻译: 发光器件包括:硅衬底(1),形成在硅衬底(1)的表面上的氮化硅膜(2),至少n型层(3),(4)和p型 形成在氮化硅膜(2)上并且由ZnO基化合物半导体制成的层(6),(7)和层叠层以形成发光层的半导体层层叠体 。 优选地,该氮化硅膜(2)通过在含氮气体的气氛中进行热处理而形成。 此外,在另一实施例中,通过在蓝宝石衬底的主面上生长ZnO基化合物半导体层,主面垂直于其C面而形成发光器件。 结果,可以获得使用具有高性能的ZnO基化合物的器件,例如非常优异的结晶度并且具有高发光效率的LED。

    ZnO based compound semiconductor light emitting device and method for manufacturing the same
    3.
    发明授权
    ZnO based compound semiconductor light emitting device and method for manufacturing the same 失效
    ZnO系化合物半导体发光元件及其制造方法

    公开(公告)号:US06987029B2

    公开(公告)日:2006-01-17

    申请号:US10713205

    申请日:2003-11-17

    IPC分类号: H01L21/00

    摘要: A light emitting device includes a silicon substrate (1), a silicon nitride film (2) formed on the surface of the silicon substrate (1), at least an n-type layer (3), (4) and a p-type layer (6), (7) which are formed on the silicon nitride film (2) and also which are made of a ZnO based compound semiconductor, and a semiconductor layer lamination (11) in which layers are laminated to form a light emitting layer. Preferably this silicon nitride film (2) is formed by thermal treatment conducted in an atmosphere containing nitrogen such as an ammonium gas. Also, in another embodiment, a light emitting device is formed by growing a ZnO based compound semiconductor layer on a main face of a sapphire substrate, the main face being perpendicular to the C-face thereof. As a result, it is possible to obtain a device using a ZnO based compound with high properties such as an LED very excellent in crystallinity and having a high light emitting efficiency.

    摘要翻译: 发光器件包括:硅衬底(1),形成在硅衬底(1)的表面上的氮化硅膜(2),至少n型层(3),(4)和p型 形成在氮化硅膜(2)上并且由ZnO基化合物半导体制成的层(6),(7)和层叠层以形成发光层的半导体层层叠体 。 优选地,该氮化硅膜(2)通过在含氮气体的气氛中进行热处理而形成。 此外,在另一实施例中,通过在蓝宝石衬底的主面上生长ZnO基化合物半导体层,主面垂直于其C面而形成发光器件。 结果,可以获得使用具有高性能的ZnO基化合物的器件,例如非常优异的结晶度并且具有高发光效率的LED。

    ZnO based compound semiconductor light emitting device and method for manufacturing the same
    4.
    发明申请
    ZnO based compound semiconductor light emitting device and method for manufacturing the same 失效
    ZnO系化合物半导体发光元件及其制造方法

    公开(公告)号:US20050247954A1

    公开(公告)日:2005-11-10

    申请号:US11166254

    申请日:2005-06-27

    摘要: A light emitting device includes a silicon substrate (1), a silicon nitride film (2) formed on the surface of the silicon substrate (1), at least an n-type layer (3), (4) and a p-type layer (6), (7) which are formed on the silicon nitride film (2) and also which are made of a ZnO based compound semiconductor, and a semiconductor layer lamination (11) in which layers are laminated to form a light emitting layer. Preferably this silicon nitride film (2) is formed by thermal treatment conducted in an atmosphere containing nitrogen such as an ammonium gas. Also, in another embodiment, a light emitting device is formed by growing a ZnO based compound semiconductor layer on a main face of a sapphire substrate, the main face being perpendicular to the C-face thereof. As a result, it is possible to obtain a device using a ZnO based compound with high properties such as an LED very excellent in crystallinity and having a high light emitting efficiency.

    摘要翻译: 发光器件包括:硅衬底(1),形成在硅衬底(1)的表面上的氮化硅膜(2),至少n型层(3),(4)和p型 形成在氮化硅膜(2)上并且由ZnO基化合物半导体制成的层(6),(7)和层叠层以形成发光层的半导体层层叠体 。 优选地,该氮化硅膜(2)通过在含氮气体的气氛中进行热处理而形成。 此外,在另一实施例中,通过在蓝宝石衬底的主面上生长ZnO基化合物半导体层,主面垂直于其C面而形成发光器件。 结果,可以获得使用具有高性能的ZnO基化合物的器件,例如非常优异的结晶度并且具有高发光效率的LED。

    Radical cell device and method for manufacturing groups II-VI compound semiconductor device
    6.
    发明授权
    Radical cell device and method for manufacturing groups II-VI compound semiconductor device 有权
    激光电池器件及其制造方法II-VI族化合物半导体器件

    公开(公告)号:US06472241B2

    公开(公告)日:2002-10-29

    申请号:US09939719

    申请日:2001-08-28

    IPC分类号: H01L2100

    CPC分类号: C30B23/06 H01L33/0087

    摘要: The closing plates (61b), (61c) are provided on the both end portions of the cylindrical insulator body (61a), the gas introduction tube for introducing a gaseous substance is inserted into one plate (61b) of the closing plates of the plasma chamber (61) for making the gaseous substance plasmatic within it, and on the other plate (61c), the plasma radiation outlet (61d) is provided. Then, nearby the plasma jet (63) outgoing from the radiation outlet, the electrode (64) for applying a high electric field of an ion trapper is provided so as to be opposed to the grounded electrode (65) interposed the plasma jet between them. This electrode for applying a high electric field is fixed on the grounded metal plate (61e) provided on the other plate (61c) via the insulation porcelain (66) made of MgO or quartz. As a result, a radical cell device which does not blow-off and mix up Al into the layer epitaxially grown is obtained ,and a Groups II-VI compound semiconductor device because undoped Al is not contained in the semiconductor layers.

    摘要翻译: 封闭板(61b),(61c)设置在圆筒形绝缘体(61a)的两端部,将用于引入气态物质的气体导入管插入等离子体的封闭板的一个板(61b) 用于在其内制备气态物质的室(61),在另一个板(61c)上设置有等离子体辐射出口(61d)。 然后,在从辐射出口排出的等离子体射流(63)附近,设置用于施加离子捕获器的高电场的电极(64),以与插入其间的等离子体射流的接地电极(65)相对 。 用于施加高电场的电极经由由MgO或石英制成的绝缘瓷(66)固定在设置在另一板(61c)上的接地金属板(61e)上。 结果,可以获得不将Al吹出和外延生长的层的自由基电池器件,由于在半导体层中不含有未掺杂的Al的II-VI族化合物半导体器件。

    Method of producing Cu (In, Ga) (Se, S) 2 semiconductor film
    10.
    发明授权
    Method of producing Cu (In, Ga) (Se, S) 2 semiconductor film 失效
    制造Cu(In,Ga)(Se,S)2半导体膜的方法

    公开(公告)号:US06566162B2

    公开(公告)日:2003-05-20

    申请号:US10096668

    申请日:2002-03-14

    IPC分类号: H01L2120

    摘要: A method of producing a semiconductor film of Cu(MIII)(MVI)2 wherein MIII represents In1-xGax where x is between 0 and 1 and MVI represents SeyS1-y where y is between 0.5 and 1, including the steps of: (a) depositing on a substrate a precursor Cu(MIII)(MVI)2 film having a molar ratio of Cu:MIII of less than 1.0:1.0 but not less than 1.0:1.4 and (b) annealing the precursor film at a temperature of 400-500° C. in an oxygen-containing atmosphere to form a buffer layer of indium oxide and/or gallium oxide and a Cu(In1-xGax)(SeyS1-y)2 film interposed between the substrate and the buffer layer. The buffer layer may be removed by etching with an acid.

    摘要翻译: 一种制备Cu(MIII)(MVI)2的半导体膜的方法,其中MIII表示In1-xGax,其中x在0和1之间,MVI表示SeyS1-y,其中y在0.5和1之间,包括以下步骤: )在基底上沉积具有小于1.0:1.0但不小于1.0:1.4的Cu:MIII摩尔比的前体Cu(MIII)(MVI)2膜;和(b)在400℃的温度下退火前体膜 -500℃,形成氧化铟和/或氧化镓的缓冲层,以及置于衬底和缓冲层之间的Cu(In1-xGax)(SeyS1-y)2膜。 缓冲层可以用酸蚀刻除去。