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15 条记录 (耗时 0.026 秒)

    Modularized probe card with coaxial transmitters
    1.
    发明授权
    Modularized probe card with coaxial transmitters 失效
    带同轴发射器的模块化探头卡

    公开(公告)号：US06812720B1

    公开(公告)日：2004-11-02

    申请号：US10417263

    申请日：2003-04-17

    申请人： Shih-Jye Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Yao-Jung Lee

    发明人： Shih-Jye Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Yao-Jung Lee

    IPC分类号： G01R3102

    CPC分类号： G01R31/2889

    摘要： A modularized probe card with coaxial transmitter is disclosed. At least a coaxial transmitter is modularized and installed between a first printed circuit board and a second printed circuit board. The coaxial transmitter has a first connector and a second connector correspondingly connecting two ends of each coaxial cable of the coaxial transmitter for electrically connecting corresponding in location to first printed circuit board and second printed circuit board. A probe head is bonded on second printed circuit board. The second connector of the coaxial transmitter is connected with the second printed circuit board in a plug-in and pull-away type.

    摘要翻译： 公开了一种具有同轴发射机的模块化探头卡。 至少一个同轴发射器被模块化并安装在第一印刷电路板和第二印刷电路板之间。 同轴发射机具有第一连接器和第二连接器，其相应地连接同轴发射器的每个同轴电缆的两端，用于将相应的位置电连接到第一印刷电路板和第二印刷电路板。 探头位于第二印刷电路板上。 同轴发射机的第二连接器以插拔式连接第二印刷电路板。

    Modularized probe card with compressible electrical connection device
    2.
    发明授权
    Modularized probe card with compressible electrical connection device 有权
    带可压缩电气连接装置的模块化探头卡

    公开(公告)号：US06781392B1

    公开(公告)日：2004-08-24

    申请号：US10435560

    申请日：2003-05-12

    申请人： Shih-Jye Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Yao-Jung Lee

    发明人： Shih-Jye Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Yao-Jung Lee

    IPC分类号： G01R3102

    CPC分类号： G01R1/07378

    摘要： A modularized probe card comprising an interface board, a probe head and at least a compressible electrical connection device is disclosed. The compressible electrical connection device comprises an insulation layer with a plurality of circuits on one of its surface. Two ends of each circuit connect respectively to the first contacting pad and the second contacting pad which combine with elastic contact members. Each elastic contact member has a supporter combining with a conductive layer for electrical connections by pushing and compressing. While a probe head is modularized installed on an interface board, the elastic contact members of the compressible electrical connection device is elastically contacted and compressed the probe head and the interface board to acquire modularized electrical connection of the probe card.

    摘要翻译： 公开了一种包括接口板，探头和至少可压缩电连接装置的模块化探针卡。 可压缩电连接装置包括在其表面之一上具有多个电路的绝缘层。 每个电路的两端分别连接到与弹性接触构件组合的第一接触垫和第二接触垫。 每个弹性接触构件具有通过推压和压缩与电连接的导电层组合的支撑件。 当探头头被模块化安装在接口板上时，可压缩电连接装置的弹性接触件弹性接触并压缩探针头和接口板，以获得探针卡的模块化电连接。

    Probe card assembly
    3.
    发明授权
    Probe card assembly 有权
    探头卡组合

    公开(公告)号：US06853205B1

    公开(公告)日：2005-02-08

    申请号：US10620448

    申请日：2003-07-17

    申请人： Shih-Jye Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Yao-Jung Lee

    发明人： Shih-Jye Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Yao-Jung Lee

    IPC分类号： G01R1/073 ,  G01R1/18 ,  G01R31/28 ,  G01R31/02

    CPC分类号： G01R1/07342 ,  G01R1/06733 ,  G01R1/18 ,  G01R31/2889

    摘要： A probe card assembly is disclosed. The probe card assembly comprises a stiffener ring combining respectively with an upper printed circuit board and a lower printed circuit board. A plurality of coaxial transmitters are installed in the stiffener ring, and connect to the upper and lower printed circuit boards by cable connectors. The lower printed circuit board is assembled with a detachable probe head which comprises a silicon substrate with probing points and a probe head carrier. A downset is formed at the center of the probe head carrier. The standardized coaxial transmitters, printed circuit boards and probe heads are then assembled as a probe card assembly for testing all sorts of IC products.

    摘要翻译： 公开了一种探针卡组件。 探针卡组件包括分别与上印刷电路板和下印刷电路板组合的加强环。 多个同轴发射器安装在加强环中，并通过电缆连接器连接到上下印刷电路板。 下部印刷电路板组装有可拆卸的探针头，该探头包括具有探测点的硅衬底和探针头托架。 在探针头托架的中心处形成一个凹陷。 然后将标准化的同轴发射器，印刷电路板和探头组装成用于测试各种IC产品的探针卡组件。

    PROBE CARD ASSEMBLY
    5.
    发明申请
    PROBE CARD ASSEMBLY 有权
    探索卡大会

    公开(公告)号：US20050012513A1

    公开(公告)日：2005-01-20

    申请号：US10620448

    申请日：2003-07-17

    申请人： Shih-Jye Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Yao-Jung Lee

    发明人： Shih-Jye Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Yao-Jung Lee

    IPC分类号： G01R1/073 ,  G01R1/18 ,  G01R31/28 ,  G01R31/02

    CPC分类号： G01R1/07342 ,  G01R1/06733 ,  G01R1/18 ,  G01R31/2889

    摘要： A probe card assembly is disclosed. The probe card assembly comprises a stiffener ring combining respectively with an upper printed circuit board and a lower printed circuit board. A plurality of coaxial transmitters are installed in the stiffener ring, and connect to the upper and lower printed circuit boards by cable connectors. The lower printed circuit board is assembled with a detachable probe head which comprises a silicon substrate with probing points and a probe head carrier. A downset is formed at the center of the probe head carrier. The standardized coaxial transmitters, printed circuit boards and probe heads are then assembled as a probe card assembly for testing all sorts of IC products.

    摘要翻译： 公开了一种探针卡组件。 探针卡组件包括分别与上印刷电路板和下印刷电路板组合的加强环。 多个同轴发射器安装在加强环中，并通过电缆连接器连接到上下印刷电路板。 下部印刷电路板组装有可拆卸的探针头，该探头包括具有探测点的硅衬底和探针头托架。 在探针头托架的中心处形成一个凹陷。 然后将标准化的同轴发射器，印刷电路板和探头组装成用于测试各种IC产品的探针卡组件。

    Modular probe card assembly
    6.
    发明授权
    Modular probe card assembly 失效
    模块化探头卡组合

    公开(公告)号：US06621710B1

    公开(公告)日：2003-09-16

    申请号：US10198118

    申请日：2002-07-19

    申请人： Shih-Jye Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Yao-Jung Lee

    发明人： Shih-Jye Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Yao-Jung Lee

    IPC分类号： H01R900

    CPC分类号： H01R13/22 ,  H01R2201/20

    摘要： A modular probe card assembly comprises a silicon substrate with probes modularly assembled on a main board. At least a socket is installed around silicon substrate and electrically connects to probe needles by a flexible printed wiring film. A plurality of detachable coaxial wires electrically connect sockets with the main board for achieving variability of connecting paths during manufacturing. Thus, the probe card assembly has the effect of adjustable amendment and is suitable for high speed testing.

    摘要翻译： 模块化探针卡组件包括具有模块地组装在主板上的探针的硅衬底。 至少一个插座安装在硅衬底周围，并通过柔性印刷布线膜电连接到探针上。 多个可拆卸的同轴线将插座与主板电连接以实现制造期间的连接路径的变化。 因此，探针卡组件具有可调节的修正效果，适用于高速测试。

    Method for fabricating anisotropic conductive substrate
    7.
    发明申请
    Method for fabricating anisotropic conductive substrate 有权
    制造各向异性导电基板的方法

    公开(公告)号：US20050066521A1

    公开(公告)日：2005-03-31

    申请号：US10671735

    申请日：2003-09-29

    申请人： S. Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Y. Lee

    发明人： S. Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Y. Lee

    IPC分类号： H01R43/00

    CPC分类号： H01R43/007 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/4921 ,  Y10T428/24917

    摘要： A method for fabricating an anisotropic conductive substrate is disclosed. A back holder has metal pins on a surface thereof. A liquid compound is formed on the surface of the back holder with metal pins. The liquid compound is pressed to deform the metal pins into electrodes in the liquid compound. The thickness between upper surface and lower surface of the liquid compound is between 25 μm and 250 μm. The electrodes have upper ends and lower ends exposed from upper surface and lower surface of the liquid compound to provide electrical contact of anisotropic conduction.

    摘要翻译： 公开了一种用于制造各向异性导电衬底的方法。 后盖在其表面上具有金属销。 在后支架的表面上用金属销形成液体化合物。 液体化合物被压制以使金属销变形成液体化合物中的电极。 液体化合物的上表面和下表面之间的厚度在25μm和250μm之间。 电极具有从液体化合物的上表面和下表面暴露的上端和下端，以提供各向异性导电的电接触。

    Method for manufacturing probes of a probe card
    9.
    发明授权
    Method for manufacturing probes of a probe card 失效
    探针卡探头的制造方法

    公开(公告)号：US07005054B2

    公开(公告)日：2006-02-28

    申请号：US10223350

    申请日：2002-08-20

    申请人： S. J. Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Y. J. Lee

    发明人： S. J. Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Y. J. Lee

    IPC分类号： C25D5/02 ,  C25D5/54 ,  C25D5/56 ,  H05K3/00

    CPC分类号： C25D5/022 ,  C25D5/04 ,  G01R1/07342 ,  G01R3/00 ,  H05K3/241 ,  H05K3/4007 ,  H05K2201/0367

    摘要： A method to make probes of a probe card includes providing a blocking plate on an electroplating tank. The blocking plate has a plurality of openings according to the layout of contact pads on a probe head. There are bumps on the contact pads of the probe head. Continuous electroplating process can be executed after bumps (contact pads) contact electroplating solution in the electroplating tank through the openings of the blocking plate. By continuously moving the probe head according to the desired shape of probes, probes were formed by electroplating. These probes can be made into different shapes with good uniformity in elasticity and heights to increase the quality of electrical contact during wafer probing. Moreover, the process lead time and fabrication cost are saved.

    摘要翻译： 探针卡的探针的方法包括在电镀槽上设置阻挡板。 阻挡板根据探针头上的接触垫的布局具有多个开口。 探针头的接触垫上有凸块。 凸点（接触垫）可以通过阻挡板的开口接触电镀槽中的电镀溶液，进行连续电镀工艺。 通过根据所需形状的探针连续移动探头，通过电镀形成探针。 这些探针可以制成不同的形状，具有良好的弹性和高度均匀性，以增加晶片探测期间电接触的质量。 此外，节省了处理时间和制造成本。