METHOD OF MANUFACTURING A SEMICONDUCTOR STRUCTURE
    1.
    发明申请
    METHOD OF MANUFACTURING A SEMICONDUCTOR STRUCTURE 有权
    制造半导体结构的方法

    公开(公告)号:US20120142142A1

    公开(公告)日:2012-06-07

    申请号:US13310342

    申请日:2011-12-02

    IPC分类号: H01L21/20

    摘要: A method of manufacturing a semiconductor structure is disclosed, which includes providing a substrate comprising a bottom surface and a growth surface opposite to the bottom surface; forming a buffer layer comprising a first surface which is not a C-plane substantially parallel with the bottom surface on the growth surface; forming a semiconductor structure on the buffer layer; forming at least one cavity in the buffer layer; extending the cavity along a main extending direction; separating the substrate and the semiconductor structure; wherein the main extending direction is substantially not parallel with the normal direction of the first surface.

    摘要翻译: 公开了一种制造半导体结构的方法,其包括提供包括底表面和与底表面相对的生长表面的基底; 形成缓冲层,所述缓冲层包括第一表面,所述第一表面不是与生长表面上的底表面基本平行的C平面; 在缓冲层上形成半导体结构; 在所述缓冲层中形成至少一个空腔; 沿着主延伸方向延伸空腔; 分离衬底和半导体结构; 其中所述主延伸方向基本上不与所述第一表面的法线方向平行。