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1.发明授权Display apparatus utilizing a thermally color reversible display medium which has a hysteresis effect 失效利用具有滞后效应的热色可逆显示介质的显示装置
公开(公告)号：US4442429A
公开(公告)日：1984-04-10
申请号：US301598
申请日：1981-09-14
申请人： Shintaro Kotani , Ichimatsu Abiko , Takashi Arae , Mio Chiba , Tomoo Araki , Hiromasa Kanno
发明人： Shintaro Kotani , Ichimatsu Abiko , Takashi Arae , Mio Chiba , Tomoo Araki , Hiromasa Kanno
CPC分类号： G09G3/008
摘要： Disclosed is an erasable display apparatus including a heat-sensitive medium 1 having a hysteresis effect relative to temperature change. This display apparatus comprises an endless broad-width heat-sensitive display medium 1, driving means 2 for rotating and transferring the heat-sensitive display medium 1, a first heating member 3 for thermally recording information to be displayed on the heat sensitive display medium 1, a plane transparent panel heater 4 disposed on the back of the display surface contiguously to the heat-sensitive display medium 1, lighting means 5 disposed on the back of the transparent heat-insulating member 4 to illuminate the display surface, a color filter 6 disposed in front of the display surface and cooling means 7 for erasing the information recorded on the heat-sensitive display medium 1 after display. By this display apparatus, a display can be accomplished at a high density and the displayed picture quality can be enhanced. This display apparatus can be used repeatedly at a high frequency.
摘要翻译： 公开了一种可擦除显示装置，其包括相对于温度变化具有滞后效应的热敏介质1。 该显示装置包括环形宽幅热敏显示介质1，用于旋转和传送热敏显示介质1的驱动装置2，用于热记录在热敏显示介质1上显示的信息的第一加热构件3 设置在与感热显示介质1相邻的显示面的背面上的平面透明面板加热器4，设置在透明绝热构件4背面以照明显示面的点亮装置5，彩色滤光片6 设置在显示面前方，冷却装置7用于在显示器之后擦除记录在热敏显示介质1上的信息。 通过该显示装置，可以以高密度实现显示，并且可以提高显示的图像质量。 该显示装置可以以高频重复使用。
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2.发明授权Light-emitting and light-sensing diode array device, and light-emitting and light-sensing diode with improved sensitivity 失效发光和感光二极管阵列器件，以及灵敏度提高的发光和感光二极管
公开(公告)号：US5600157A
公开(公告)日：1997-02-04
申请号：US654756
申请日：1996-05-29
申请人： Ichimatsu Abiko , Yukio Nakamura , Katsuzo Kaminishi , Takatoku Shimizu , Kazuo Tokura , Yasuo Iguti , Hiroshi Furuya , Mituhiko Ogihara , Masumi Taninaka , Mio Chiba
发明人： Ichimatsu Abiko , Yukio Nakamura , Katsuzo Kaminishi , Takatoku Shimizu , Kazuo Tokura , Yasuo Iguti , Hiroshi Furuya , Mituhiko Ogihara , Masumi Taninaka , Mio Chiba
IPC分类号： H01L31/0352 , H01L31/103 , H01L33/00 , H01L33/24 , H01L27/15 , H01L31/12 , H01L31/153
CPC分类号： H01L33/24 , H01L31/03529 , H01L31/1035 , H01L33/0008 , H01L2924/01015 , H01L2924/01031 , H01L2924/10329 , Y02E10/50
摘要： According to a first aspect of the invention, a light-emitting and light-sensing diode has a doped region with a depth not exceeding 2 .mu.m, for adequate sensitivity, and an impurity concentration of at least 5.times.10.sup.20 atoms/cm.sup.-3, for adequate emission. According to a second aspect of the invention, a light-emitting and light-sensing diode has a doped region with a deep part and a shallow part, and the area of the shallow part is increased to enhance the sensitivity of the diode. This may be done by providing the doped region with a meandering edge, or with one or more interior islands, or by forming the deep and shallow parts separately.
摘要翻译： 根据本发明的第一方面，发光和感光二极管具有深度不超过2μm的掺杂区域，以获得足够的灵敏度，并且杂质浓度至少为5×10 20原子/ cm -3，用于 充分排放 根据本发明的第二方面，发光和感光二极管具有具有深部分和浅部分的掺杂区域，并且浅部分的面积增加以增强二极管的灵敏度。 这可以通过为掺杂区域提供曲折边缘，或者与一个或多个内部岛屿，或通过分开形成深部和浅部来实现。
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公开(公告)号：US4318597A
公开(公告)日：1982-03-09
申请号：US178528
申请日：1980-08-15
申请人： Shintaro Kotani , Ichimatsu Abiko , Rikuo Takano , Yasushi Hoshino , Yukio Tokunaga , Kazuyoshi Tateishi
发明人： Shintaro Kotani , Ichimatsu Abiko , Rikuo Takano , Yasushi Hoshino , Yukio Tokunaga , Kazuyoshi Tateishi
IPC分类号： B41J2/44 , B41J2/447 , B41J2/45 , B41J2/455 , G02B6/06 , G02B27/00 , G03G15/32 , G06K15/12 , H04N1/036 , H04N1/195 , B41B13/00 , G03B27/00
CPC分类号： H04N1/19505 , B41J2/447 , B41J2/451 , G03G15/04054 , G03G15/04072 , G03G15/326 , H04N1/036 , H04N1/19515 , H04N1/19584 , G02B6/06
摘要： An optical printing device includes a photosensitive means having a photosensitive surface and an optical print head. The optical print head has a plurality of arrays of a plurality of light emitting devices selectively energized and an optical means to form light images from the light emitting devices on the photosensitive surface.A plurality of the light emitting device arrays are arranged in a plurality of rows, with the light emitting devices aligned in a common direction with the arrays.The optical means comprises a plurality of graded index optical fiber arrays of which the optical axes are directed perpendicularly to the aforesaid photosensitive surface.
摘要翻译： 光学打印装置包括具有光敏表面的光敏装置和光学打印头。 光学打印头具有选择性地通电的多个发光器件的多个阵列和用于从光敏表面上的发光器件形成光图像的光学装置。 多个发光器件阵列布置成多行，其中发光器件与阵列在共同的方向上对准。 光学装置包括多个渐变折射率光纤阵列，其中光轴垂直于前述感光表面。
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4.发明授权Optical print head with graded index fiber arrays for optical printing devices 失效具有用于光学打印设备的分级折射率光纤阵列的光学打印头
公开(公告)号：US4376282A
公开(公告)日：1983-03-08
申请号：US178540
申请日：1980-08-15
摘要： An optical printing device includes a photosensitive means having a photosensitive surface and an optical print head. The optical print head has a plurality of arrays of a plurality of light emitting devices selectively energized and an optical means to form light images from the light emitting devices on the photosensitive surface.A plurality of the light emitting device arrays are arranged in a plurality of rows, with the light emitting devices aligned in a common direction with the arrays.The optical means comprises a plurality of graded index optical fiber arrays causing light images from the light emitting devices to be formed in a single line on the photosensitive surface.
摘要翻译： 光学打印装置包括具有光敏表面的光敏装置和光学打印头。 光学打印头具有选择性地通电的多个发光器件的多个阵列和用于从光敏表面上的发光器件形成光图像的光学装置。 多个发光器件阵列布置成多行，其中发光器件与阵列在共同的方向上对准。 光学装置包括多个渐变折射率光纤阵列，其使来自发光器件的光图像形成在感光表面上的单行中。
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公开(公告)号：US08664668B2
公开(公告)日：2014-03-04
申请号：US12654486
申请日：2009-12-22
IPC分类号： H01L27/15
CPC分类号： H01L25/167 , B41J2/45 , H01L27/153 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A combined semiconductor apparatus includes a semiconductor substrate having an integrated circuit, a planarized region formed in a surface of the semiconductor substrate, and a semiconductor thin film including at least one semiconductor device and bonded on the planarized region. A surface of the semiconductor thin film, in which the semiconductor device is formed, is disposed on a side of the planarized region. The apparatus may further include a planarized film disposed between the planarized region and the semiconductor thin film.
摘要翻译： 组合半导体装置包括具有集成电路的半导体衬底，形成在半导体衬底的表面中的平坦化区域，以及包含至少一个半导体器件并结合在平坦化区域上的半导体薄膜。 其中形成有半导体器件的半导体薄膜的表面设置在平坦化区域的一侧。 该装置还可以包括设置在平坦化区域和半导体薄膜之间的平坦化膜。
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公开(公告)号：US08395159B2
公开(公告)日：2013-03-12
申请号：US12591475
申请日：2009-11-20
CPC分类号： G03G15/043 , B41J2/45 , H01L27/153 , H01L33/62 , H01L2224/48137
摘要： A semiconductor apparatus includes a substrate having at least one terminal, a thin semiconductor film including at least one semiconductor device, the thin semiconductor film being disposed and bonded on the substrate; and an individual interconnecting line formed as a thin conductive film extending from the semiconductor device in the thin semiconductor film to the terminal in the substrate, electrically connecting the semiconductor device to the terminal. Compared with conventional semiconductor apparatus, the invented apparatus is smaller and has a reduced material cost.
摘要翻译： 半导体装置包括具有至少一个端子的基板，包括至少一个半导体器件的薄半导体膜，所述薄半导体膜设置并接合在所述基板上; 以及形成为从薄半导体膜中的半导体器件延伸到衬底中的端子的薄导电膜的单独互连线，将半导体器件电连接到端子。 与传统的半导体装置相比，本发明的装置更小，材料成本降低。
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公开(公告)号：US20070235883A1
公开(公告)日：2007-10-11
申请号：US11806145
申请日：2007-05-30
CPC分类号： B41J2/451 , B41J2/45 , H01L27/153 , H01L33/0079 , H01L2224/48091 , H01L2224/48137 , H01L2224/49175 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor apparatus includes two thin semiconductor films bonded to a substrate, and a thin-film interconnecting line electrically connecting a semiconductor device in the first thin semiconductor film to an integrated circuit in the second thin semiconductor film. The two thin semiconductor films are formed separately from the substrate. The first thin semiconductor film may include an array of semiconductor devices. The first and second thin semiconductor films may be replicated as arrays bonded to the same substrate.
摘要翻译： 半导体器件包括两个结合到衬底的薄的半导体膜，以及将第一薄膜半导体膜中的半导体器件与第二薄膜半导体膜中的集成电路电连接的薄膜互连线。 两个薄的半导体膜与衬底分开形成。 第一薄膜半导体膜可以包括半导体器件阵列。 第一和第二薄的半导体膜可以被复制为与同一衬底结合的阵列。
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8.发明申请公开(公告)号：US20050057641A1
公开(公告)日：2005-03-17
申请号：US10936515
申请日：2004-09-09
CPC分类号： B41J2/45 , H01L25/0753 , H01L25/167 , H01L2224/48137 , H01L2924/01322 , H01L2924/3025 , H01L2924/00
摘要： A combined semiconductor apparatus has a substrate, a thin semiconductor film attached directly or indirectly to one major surface of the substrate, and a lens attached to the opposite surface of the substrate. The thin semiconductor film includes a light-emitting element that emits light through the substrate. After passing through the substrate, the emitted light is focused by the lens. The substrate functions as a spacing element, assuring that the lens is positioned at the correct distance from the light-emitting element without the need for separate alignment. The substrate also holds the lens without the need for a separate lens holder. Driving circuitry may also be formed on the substrate.
摘要翻译： 组合半导体装置具有基板，直接或间接附着到基板的一个主表面的薄半导体膜，以及附接到基板的相对表面的透镜。 薄型半导体膜包括通过基板发光的发光元件。 通过基板后，发射的光被透镜聚焦。 基板用作间隔元件，确保透镜位于与发光元件正确的距离处，而不需要单独对准。 基板也保持透镜而不需要单独的透镜支架。 也可以在衬底上形成驱动电路。
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公开(公告)号：US07871834B2
公开(公告)日：2011-01-18
申请号：US12320511
申请日：2009-01-28
IPC分类号： H01L21/50
CPC分类号： B41J2/451 , B41J2/45 , H01L27/153 , H01L33/0079 , H01L2224/48091 , H01L2224/48137 , H01L2224/49175 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor apparatus includes two thin semiconductor films bonded to a substrate, and a thin-film interconnecting line electrically connecting a semiconductor device such as a light-emitting device in the first thin semiconductor film to an integrated circuit in the second thin semiconductor film. Typically, the integrated circuit drives the semiconductor device. The two thin semiconductor films are formed separately from the substrate. The first thin semiconductor film may include an array of semiconductor devices. The first and second thin semiconductor films may be replicated as arrays bonded to the same substrate. Compared with conventional semiconductor apparatus comprising an array chip and a separate driver chip, the invented apparatus is smaller and has a reduced material cost.
摘要翻译： 半导体装置包括两个结合到基板的薄的半导体膜，以及将第一薄膜半导体膜中的诸如发光器件的半导体器件电连接到第二薄半导体膜中的集成电路的薄膜互连线。 通常，集成电路驱动半导体器件。 两个薄的半导体膜与衬底分开形成。 第一薄膜半导体膜可以包括半导体器件阵列。 第一和第二薄的半导体膜可以被复制为与同一衬底结合的阵列。 与包括阵列芯片和单独的驱动器芯片的常规半导体装置相比，本发明的装置更小并且材料成本降低。
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公开(公告)号：US20090149000A1
公开(公告)日：2009-06-11
申请号：US12320511
申请日：2009-01-28
IPC分类号： H01L21/30
CPC分类号： B41J2/451 , B41J2/45 , H01L27/153 , H01L33/0079 , H01L2224/48091 , H01L2224/48137 , H01L2224/49175 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor apparatus includes two thin semiconductor films bonded to a substrate, and a thin-film interconnecting line electrically connecting a semiconductor device such as a light-emitting device in the first thin semiconductor film to an integrated circuit in the second thin semiconductor film. Typically, the integrated circuit drives the semiconductor device. The two thin semiconductor films are formed separately from the substrate. The first thin semiconductor film may include an array of semiconductor devices. The first and second thin semiconductor films may be replicated as arrays bonded to the same substrate. Compared with conventional semiconductor apparatus comprising an array chip and a separate driver chip, the invented apparatus is smaller and has a reduced material cost.
摘要翻译： 半导体装置包括两个结合到基板的薄的半导体膜，以及将第一薄膜半导体膜中的诸如发光器件的半导体器件电连接到第二薄半导体膜中的集成电路的薄膜互连线。 通常，集成电路驱动半导体器件。 两个薄的半导体膜与衬底分开形成。 第一薄膜半导体膜可以包括半导体器件阵列。 第一和第二薄的半导体膜可以被复制为与同一衬底结合的阵列。 与包括阵列芯片和单独的驱动器芯片的常规半导体装置相比，本发明的装置更小并且材料成本降低。
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