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公开(公告)号：US07871834B2
公开(公告)日：2011-01-18
申请号：US12320511
申请日：2009-01-28
IPC分类号： H01L21/50
CPC分类号： B41J2/451 , B41J2/45 , H01L27/153 , H01L33/0079 , H01L2224/48091 , H01L2224/48137 , H01L2224/49175 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor apparatus includes two thin semiconductor films bonded to a substrate, and a thin-film interconnecting line electrically connecting a semiconductor device such as a light-emitting device in the first thin semiconductor film to an integrated circuit in the second thin semiconductor film. Typically, the integrated circuit drives the semiconductor device. The two thin semiconductor films are formed separately from the substrate. The first thin semiconductor film may include an array of semiconductor devices. The first and second thin semiconductor films may be replicated as arrays bonded to the same substrate. Compared with conventional semiconductor apparatus comprising an array chip and a separate driver chip, the invented apparatus is smaller and has a reduced material cost.
摘要翻译： 半导体装置包括两个结合到基板的薄的半导体膜，以及将第一薄膜半导体膜中的诸如发光器件的半导体器件电连接到第二薄半导体膜中的集成电路的薄膜互连线。 通常，集成电路驱动半导体器件。 两个薄的半导体膜与衬底分开形成。 第一薄膜半导体膜可以包括半导体器件阵列。 第一和第二薄的半导体膜可以被复制为与同一衬底结合的阵列。 与包括阵列芯片和单独的驱动器芯片的常规半导体装置相比，本发明的装置更小并且材料成本降低。
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公开(公告)号：US20090149000A1
公开(公告)日：2009-06-11
申请号：US12320511
申请日：2009-01-28
IPC分类号： H01L21/30
CPC分类号： B41J2/451 , B41J2/45 , H01L27/153 , H01L33/0079 , H01L2224/48091 , H01L2224/48137 , H01L2224/49175 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor apparatus includes two thin semiconductor films bonded to a substrate, and a thin-film interconnecting line electrically connecting a semiconductor device such as a light-emitting device in the first thin semiconductor film to an integrated circuit in the second thin semiconductor film. Typically, the integrated circuit drives the semiconductor device. The two thin semiconductor films are formed separately from the substrate. The first thin semiconductor film may include an array of semiconductor devices. The first and second thin semiconductor films may be replicated as arrays bonded to the same substrate. Compared with conventional semiconductor apparatus comprising an array chip and a separate driver chip, the invented apparatus is smaller and has a reduced material cost.
摘要翻译： 半导体装置包括两个结合到基板的薄的半导体膜，以及将第一薄膜半导体膜中的诸如发光器件的半导体器件电连接到第二薄半导体膜中的集成电路的薄膜互连线。 通常，集成电路驱动半导体器件。 两个薄的半导体膜与衬底分开形成。 第一薄膜半导体膜可以包括半导体器件阵列。 第一和第二薄的半导体膜可以被复制为与同一衬底结合的阵列。 与包括阵列芯片和单独的驱动器芯片的常规半导体装置相比，本发明的装置更小并且材料成本降低。
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公开(公告)号：US07456449B2
公开(公告)日：2008-11-25
申请号：US10998801
申请日：2004-11-30
申请人： Hiroyuki Fujiwara , Takahito Suzuki , Susumu Chihara , Mitsuhiko Ogihara , Ichimatsu Abiko , Masaaki Sakuta
发明人： Hiroyuki Fujiwara , Takahito Suzuki , Susumu Chihara , Mitsuhiko Ogihara , Ichimatsu Abiko , Masaaki Sakuta
IPC分类号： H01L27/76
CPC分类号： B41J2/45 , H01L27/153
摘要： A semiconductor apparatus has a substrate to which is attached a thin semiconductor film including at least one semiconductor device. An interconnecting line links the semiconductor film with electrical circuitry on the substrate. The interconnecting line includes a pad located on the substrate, between the thin semiconductor film and the electrical circuitry. The pad, which is wider than other parts of the interconnecting line, can be used as a probe pad for testing the apparatus, and in particular for testing the electrical circuitry on the substrate before the thin semiconductor film is attached.
摘要翻译： 半导体装置具有附着有包括至少一个半导体器件的薄半导体膜的衬底。 互连线将半导体膜与衬底上的电路连接。 互连线包括位于衬底上的衬垫，位于薄的半导体膜和电路之间。 比互连线的其它部分更宽的焊盘可以用作用于测试设备的探针焊盘，特别是用于在薄的半导体膜附着之前测试衬底上的电路。
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4.发明申请Semiconductor device, LED print head and image-forming apparatus using same, and method of manufacturing semiconductor device 有权半导体装置，LED打印头和使用其的图像形成装置以及半导体装置的制造方法公开(公告)号：US20080274571A1
公开(公告)日：2008-11-06
申请号：US12165699
申请日：2008-07-01
IPC分类号： H01L21/00
CPC分类号： H01L25/0753 , B41J2/45 , H01L21/6835 , H01L33/0079 , H01L2221/68322 , H01L2221/68354 , H01L2221/68368 , H01L2224/48227 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/14 , H01L2924/3025
摘要： In a method of manufacturing a semiconductor thin film piece device, a plurality of semiconductor thin film pieces (14) are selected from among the semiconductor thin film pieces (14) formed on a first substrate (35), and bonded to a first set of predetermined area on a second substrate (12). Subsequently, a plurality of semiconductor thin film pieces are selected from the remaining semiconductor thin film pieces (14), and bonded to a second set of predetermined area.
摘要翻译： 在制造半导体薄膜片器件的方法中，从形成在第一衬底（35）上的半导体薄膜片（14）中选择多个半导体薄膜片（14），并结合到第一组 在第二基板（12）上的预定区域。 随后，从剩余的半导体薄膜片（14）中选择多个半导体薄膜片，并结合到第二组预定区域。
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公开(公告)号：US20060097354A1
公开(公告)日：2006-05-11
申请号：US11268556
申请日：2005-11-08
IPC分类号： H01L29/12
CPC分类号： H01L24/83 , B41J2/45 , H01L24/29 , H01L24/32 , H01L27/153 , H01L2224/27444 , H01L2224/2747 , H01L2224/2908 , H01L2224/29082 , H01L2224/291 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29114 , H01L2224/29117 , H01L2224/29139 , H01L2224/29144 , H01L2224/29155 , H01L2224/29164 , H01L2224/32502 , H01L2224/83005 , H01L2224/83011 , H01L2224/83013 , H01L2224/83192 , H01L2224/83203 , H01L2224/8382 , H01L2224/83825 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01024 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01072 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/10336 , H01L2924/10349 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/00014 , H01L2924/01007 , H01L2924/00
摘要： A semiconductor composite apparatus includes a semiconductor thin film layer and a substrate. The semiconductor thin film layer and the substrate are bonded to each other with a layer of an alloy of a high-melting-point metal and a low-melting-point metal formed between the semiconductor thin film layer and the substrate. The alloy has a higher melting point than the low-melting-point metal. The layer of the alloy contains a product resulting from a reaction of the low-melting-point metal and a material of said semiconductor thin film layer.
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公开(公告)号：US20050127389A1
公开(公告)日：2005-06-16
申请号：US10998801
申请日：2004-11-30
申请人： Hiroyuki Fujiwara , Takahito Suzuki , Susumu Chihara , Mitsuhiko Ogihara , Ichimatsu Abiko , Masaaki Sakuta
发明人： Hiroyuki Fujiwara , Takahito Suzuki , Susumu Chihara , Mitsuhiko Ogihara , Ichimatsu Abiko , Masaaki Sakuta
CPC分类号： B41J2/45 , H01L27/153
摘要： A semiconductor apparatus has a substrate to which is attached a thin semiconductor film including at least one semiconductor device. An interconnecting line links the semiconductor film with electrical circuitry on the substrate. The interconnecting line includes a pad located on the substrate, between the thin semiconductor film and the electrical circuitry. The pad, which is wider than other parts of the interconnecting line, can be used as a probe pad for testing the apparatus, and in particular for testing the electrical circuitry on the substrate before the thin semiconductor film is attached.
摘要翻译： 半导体装置具有附着有包括至少一个半导体器件的薄半导体膜的衬底。 互连线将半导体膜与衬底上的电路连接。 互连线包括位于衬底上的衬垫，位于薄的半导体膜和电路之间。 比互连线的其它部分更宽的焊盘可以用作用于测试设备的探针焊盘，特别是用于在薄的半导体膜附着之前测试衬底上的电路。
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公开(公告)号：US08664668B2
公开(公告)日：2014-03-04
申请号：US12654486
申请日：2009-12-22
IPC分类号： H01L27/15
CPC分类号： H01L25/167 , B41J2/45 , H01L27/153 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A combined semiconductor apparatus includes a semiconductor substrate having an integrated circuit, a planarized region formed in a surface of the semiconductor substrate, and a semiconductor thin film including at least one semiconductor device and bonded on the planarized region. A surface of the semiconductor thin film, in which the semiconductor device is formed, is disposed on a side of the planarized region. The apparatus may further include a planarized film disposed between the planarized region and the semiconductor thin film.
摘要翻译： 组合半导体装置包括具有集成电路的半导体衬底，形成在半导体衬底的表面中的平坦化区域，以及包含至少一个半导体器件并结合在平坦化区域上的半导体薄膜。 其中形成有半导体器件的半导体薄膜的表面设置在平坦化区域的一侧。 该装置还可以包括设置在平坦化区域和半导体薄膜之间的平坦化膜。
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公开(公告)号：US08395159B2
公开(公告)日：2013-03-12
申请号：US12591475
申请日：2009-11-20
CPC分类号： G03G15/043 , B41J2/45 , H01L27/153 , H01L33/62 , H01L2224/48137
摘要： A semiconductor apparatus includes a substrate having at least one terminal, a thin semiconductor film including at least one semiconductor device, the thin semiconductor film being disposed and bonded on the substrate; and an individual interconnecting line formed as a thin conductive film extending from the semiconductor device in the thin semiconductor film to the terminal in the substrate, electrically connecting the semiconductor device to the terminal. Compared with conventional semiconductor apparatus, the invented apparatus is smaller and has a reduced material cost.
摘要翻译： 半导体装置包括具有至少一个端子的基板，包括至少一个半导体器件的薄半导体膜，所述薄半导体膜设置并接合在所述基板上; 以及形成为从薄半导体膜中的半导体器件延伸到衬底中的端子的薄导电膜的单独互连线，将半导体器件电连接到端子。 与传统的半导体装置相比，本发明的装置更小，材料成本降低。
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公开(公告)号：US20070235883A1
公开(公告)日：2007-10-11
申请号：US11806145
申请日：2007-05-30
CPC分类号： B41J2/451 , B41J2/45 , H01L27/153 , H01L33/0079 , H01L2224/48091 , H01L2224/48137 , H01L2224/49175 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor apparatus includes two thin semiconductor films bonded to a substrate, and a thin-film interconnecting line electrically connecting a semiconductor device in the first thin semiconductor film to an integrated circuit in the second thin semiconductor film. The two thin semiconductor films are formed separately from the substrate. The first thin semiconductor film may include an array of semiconductor devices. The first and second thin semiconductor films may be replicated as arrays bonded to the same substrate.
摘要翻译： 半导体器件包括两个结合到衬底的薄的半导体膜，以及将第一薄膜半导体膜中的半导体器件与第二薄膜半导体膜中的集成电路电连接的薄膜互连线。 两个薄的半导体膜与衬底分开形成。 第一薄膜半导体膜可以包括半导体器件阵列。 第一和第二薄的半导体膜可以被复制为与同一衬底结合的阵列。
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10.发明申请公开(公告)号：US20050057641A1
公开(公告)日：2005-03-17
申请号：US10936515
申请日：2004-09-09
CPC分类号： B41J2/45 , H01L25/0753 , H01L25/167 , H01L2224/48137 , H01L2924/01322 , H01L2924/3025 , H01L2924/00
摘要： A combined semiconductor apparatus has a substrate, a thin semiconductor film attached directly or indirectly to one major surface of the substrate, and a lens attached to the opposite surface of the substrate. The thin semiconductor film includes a light-emitting element that emits light through the substrate. After passing through the substrate, the emitted light is focused by the lens. The substrate functions as a spacing element, assuring that the lens is positioned at the correct distance from the light-emitting element without the need for separate alignment. The substrate also holds the lens without the need for a separate lens holder. Driving circuitry may also be formed on the substrate.
摘要翻译： 组合半导体装置具有基板，直接或间接附着到基板的一个主表面的薄半导体膜，以及附接到基板的相对表面的透镜。 薄型半导体膜包括通过基板发光的发光元件。 通过基板后，发射的光被透镜聚焦。 基板用作间隔元件，确保透镜位于与发光元件正确的距离处，而不需要单独对准。 基板也保持透镜而不需要单独的透镜支架。 也可以在衬底上形成驱动电路。
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