公开(公告)号：US07666953B2

公开(公告)日：2010-02-23

申请号：US12108023

申请日：2008-04-23

申请人： Shinya Nakamura ,  Mitsuo Katayose ,  Kayoko Nakamura

发明人： Shinya Nakamura ,  Mitsuo Katayose ,  Kayoko Nakamura

IPC分类号： C08K3/36 ,  C08L63/00 ,  C08L63/04

CPC分类号： C08G59/688

摘要： The invention relates to a curing accelerator for a curing resin obtained by reacting a phosphine compound (a) with a compound (b) having at least one halogen atom substituted on an aromatic ring and at least one proton atom which can be discharged, and subjecting the reaction product to dehydrohalogenation, a curing resin composition containing the curing accelerator, and an electronic component device having a device component encapsulated with the curing resin composition. The curing accelerator exhibits superior curability under moisture absorption, flow properties, reflow cracking resistance and high-temperature storage characteristics.

摘要翻译： 本发明涉及一种固化树脂的固化促进剂，该固化树脂通过使膦化合物（a）与具有至少一个在芳香环上取代的卤素原子的化合物（b）和至少一个能够排出的质子原子反应而得到， 脱卤化氢反应产物，含有固化促进剂的固化树脂组合物和具有由固化树脂组合物包封的装置组分的电子部件装置。 固化促进剂在吸湿性，流动性，回流开裂性和高温保存特性方面表现出优异的固化性。

公开(公告)号：US20050267286A1

公开(公告)日：2005-12-01

申请号：US10968216

申请日：2004-10-20

申请人： Shinya Nakamura ,  Mitsuo Katayose ,  Kayoko Nakamura

发明人： Shinya Nakamura ,  Mitsuo Katayose ,  Kayoko Nakamura

IPC分类号： C08G59/68

CPC分类号： C08G59/688

摘要： The invention relates to a curing accelerator for a curing resin obtained by reacting a phosphine compound (a) with a compound (b) having at least one halogen atom substituted on an aromatic ring and at least one proton atom which can be discharged, and subjecting the reaction product to dehydrohalogenation, a curing resin composition containing the curing accelerator, and an electronic component device having a device component encapsulated with the curing resin composition. The curing accelerator exhibits superior curability under moisture absorption, flow properties, reflow cracking resistance and high-temperature storage characteristics.

摘要翻译： 本发明涉及一种固化树脂的固化促进剂，该固化树脂通过使膦化合物（a）与具有至少一个在芳香环上取代的卤素原子的化合物（b）和至少一个能够排出的质子原子反应而得到， 脱卤化氢反应产物，含有固化促进剂的固化树脂组合物和具有由固化树脂组合物包封的装置组分的电子部件装置。 固化促进剂在吸湿性，流动性，回流开裂性和高温保存特性方面表现出优异的固化性。

公开(公告)号：US20090005480A1

公开(公告)日：2009-01-01

申请号：US12108023

申请日：2008-04-23

申请人： Shinya Nakamura ,  Mitsuo Katayose ,  Kayoko Nakamura

发明人： Shinya Nakamura ,  Mitsuo Katayose ,  Kayoko Nakamura

IPC分类号： C08L91/06 ,  C07F9/02

CPC分类号： C08G59/688

摘要： The invention relates to a curing accelerator for a curing resin obtained by reacting a phosphine compound (a) with a compound (b) having at least one halogen atom substituted on an aromatic ring and at least one proton atom which can be discharged, and subjecting the reaction product to dehydrohalogenation, a curing resin composition containing the curing accelerator, and an electronic component device having a device component encapsulated with the curing resin composition. The curing accelerator exhibits superior curability under moisture absorption, flow properties, reflow cracking resistance and high-temperature storage characteristics.

摘要翻译： 本发明涉及一种固化树脂的固化促进剂，该固化树脂通过使膦化合物（a）与具有至少一个在芳香环上取代的卤素原子的化合物（b）和至少一个能够排出的质子原子反应而得到， 脱卤化氢反应产物，含有固化促进剂的固化树脂组合物和具有由固化树脂组合物包封的装置组分的电子部件装置。 固化促进剂在吸湿性，流动性，回流开裂性和高温保存特性方面表现出优异的固化性。

公开(公告)号：US20080262135A1

公开(公告)日：2008-10-23

申请号：US11942533

申请日：2007-11-19

申请人： Shinya Nakamura ,  Mitsuo Katayose ,  Kayoko Nakamura

发明人： Shinya Nakamura ,  Mitsuo Katayose ,  Kayoko Nakamura

IPC分类号： C08K5/00 ,  C08L63/00 ,  C08L81/00 ,  C08L61/06 ,  C08K3/38 ,  C08G65/00 ,  C08K3/10 ,  C08K3/22

CPC分类号： C08G59/688

摘要： A curing accelerator for a curing resin of the invention is represented by the following general formula (I). R1 to R3 in the formula (I) represent a hydrogen atom, or a substituted or unsubstituted hydrocarbon group having 1 to 18 carbon atoms, and each may be the same or different. Two or more of R1 to R3 may be bonded to have a ring structure. R4 to R7 represent a hydrogen atom or a substituted or unsubstituted monovalent organic group having 1 to 18 carbon atoms, and each may be the same or different. Y− represents a group in which one proton is discharged from a monovalent group having 0 to 18 carbon atoms and having at least one proton capable of being discharged. Two or more of R4 to R7 and Y− may be bonded to have a ring structure. The curing accelerator exhibits superior curability under moisture absorption, flow properties, reflow cracking resistance and high-temperature storage characteristics.

摘要翻译： 本发明的固化性树脂固化促进剂由下述通式（I）表示。 式（I）中的R 1〜R 3表示氢原子或取代或未取代的碳原子数1〜18的烃基，各自可以相同 或不同。 可以将R 1至R 3中的两个或更多个键合以具有环结构。 R 4至R 7表示氢原子或取代或未取代的碳原子数1〜18的一价有机基团，各自可以相同或不同。 表示其中一个质子从具有0至18个碳原子并具有至少一个能够排出的质子的一价基团排出的基团。 可以将R 4和R 7中的两个或更多个连接成一个环结构。 固化促进剂在吸湿性，流动性，回流开裂性和高温保存特性方面表现出优异的固化性。

公开(公告)号：US08013052B2

公开(公告)日：2011-09-06

申请号：US11816571

申请日：2006-01-31

申请人： Shinya Nakamura ,  Tomoya Masuda ,  Mitsuo Katayose

发明人： Shinya Nakamura ,  Tomoya Masuda ,  Mitsuo Katayose

IPC分类号： C08G65/48 ,  C08G77/00

CPC分类号： C08G59/302 ,  C08G59/4261 ,  C08G77/52 ,  C08L83/14 ,  C09J163/00 ,  H01L23/296 ,  H01L2924/0002 ,  H01L2924/00

摘要： A curable resin which exhibits excellent heat resistance while including an extremely smaller amount of volatile component is disclosed, and an electronic component device having excellent reliability in heat resistance and the like which contains the above curable resin is provided. A curable resin obtained in reaction of at least one compound (a) selected from the group consisting of the silane compounds represented by the following Formula (I-1) and the partial condensates thereof with a phenol compound (b), comprising a remaining volatile component in an amount of 10 wt % or less with respect to the total weight of the curable resin is used as a curing agent. [Formula 1] R1nSiR2(4-n)  (I-1) (Wherein, n denotes a number of 0 to 2; R1 represent a hydrogen atom, or substituted or unsubstituted hydrocarbon groups having 1 to 18 carbon atoms; R2 represent a halogen atom, a hydroxyl group, substituted or unsubstituted oxy groups, amino groups, and carbonyloxy groups having 1 to 18 carbon atoms; and two or more of R1 and R2 may bind to each other to form a cyclic structure).

摘要翻译： 公开了一种显示出优异的耐热性同时包含极少挥发性成分的固化树脂，并且提供了含有上述可固化树脂的具有优异的耐热性等可靠性的电子部件装置。 将选自由下式（I-1）表示的硅烷化合物和其部分缩合物的至少一种化合物（a）与酚化合物（b）反应获得的可固化树脂，其包含剩余的挥发性 使用相对于固化性树脂的总重量为10重量％以下的成分作为固化剂。 [式1] R 1 n SiR 2（4-n）（I-1）（其中，n表示0〜2的数; R 1表示氢原子，或取代或未取代的碳原子数1〜18的烃基， 原子，羟基，取代或未取代的氧基，氨基和碳原子数为1〜18的碳氧基; R2和R2中的两个以上可以相互结合形成环状结构）。

公开(公告)号：US20050222300A1

公开(公告)日：2005-10-06

申请号：US10505008

申请日：2003-01-14

申请人： Ryoichi Ikezawa ,  Takayuki Akimoto ,  Yoshihiro Takahashi ,  Mitsuo Katayose ,  Naoki Watanabe ,  Shinya Nakamura

发明人： Ryoichi Ikezawa ,  Takayuki Akimoto ,  Yoshihiro Takahashi ,  Mitsuo Katayose ,  Naoki Watanabe ,  Shinya Nakamura

IPC分类号： C08G65/26 ,  H01L23/29 ,  C08L63/00

CPC分类号： C08G65/2654 ,  H01L23/296 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： There is disclosed an encapsulating epoxy resin composition, containing an epoxy resin (A), a curing agent (B), and a composite metal hydroxide (C), and having a mold release force under shearing after 10 shots of molding which is less than or equal to 200 KPa. The resin composition is preferably applied for encapsulating a semiconductor device having at least one of features including: (a) at least one of an encapsulating material of an upper side of a semiconductor chip and an encapsulating material of a lower side of the semiconductor chip has a thickness less than or equal to 0.7 mm; (b) a pin count is greater than or equal to 80; (c) a wire length is greater than or equal to 2 mm; (d) a pad pitch on the semiconductor chip is less than or equal to 90 (m; (e) a thickness of a package, in which the semiconductor chip is disposed on a mounting substrate, is less than or equal to 2 mm; and (f) an area of the semiconductor chip is greater than or equal to 25 mm2.

摘要翻译： 公开了一种包含环氧树脂（A），固化剂（B）和复合金属氢氧化物（C）的封装环氧树脂组合物，并且在10次成型后具有在剪切下的脱模力小于 或等于200KPa。 树脂组合物优选地用于封装具有以下特征中的至少一个的半导体器件：（a）半导体芯片的上侧的封装材料和半导体芯片的下侧的封装材料中的至少一个具有 厚度小于或等于0.7mm; （b）引脚数大于或等于80; （c）电线长度大于或等于2mm; （d）半导体芯片上的焊盘间距小于或等于90（m;（e）半导体芯片设置在安装基板上的封装的厚度小于或等于2mm; 和（f）半导体芯片的面积大于或等于25mm 2。

公开(公告)号：US20050165202A1

公开(公告)日：2005-07-28

申请号：US10968492

申请日：2004-10-20

申请人： Shinya Nakamura ,  Mitsuo Katayose

发明人： Shinya Nakamura ,  Mitsuo Katayose

IPC分类号： C08G59/68 ,  C08G65/10

CPC分类号： C08G59/688

摘要： A curing accelerator for a curing resin of the invention is represented by the following general formula (I). R1 to R3 in the formula (I) represent a hydrogen atom, or a substituted or unsubstituted hydrocarbon group having 1 to 18 carbon atoms, and each may be the same or different. Two or more of R1 to R3 may be bonded to have a ring structure. R4 to R7 represent a hydrogen atom or a substituted or unsubstituted monovalent organic group having 1 to 18 carbon atoms, and each may be the same or different. Y− represents a group in which one proton is discharged from a monovalent group having 0 to 18 carbon atoms and having at least one proton capable of being discharged. Two or more of R4 to R7 and Y− may be bonded to have a ring structure. The curing accelerator exhibits superior curability under moisture absorption, flow properties, reflow cracking resistance and high-temperature storage characteristics.

摘要翻译： 本发明的固化性树脂固化促进剂由下述通式（I）表示。 式（I）中的R 1〜R 3表示氢原子或取代或未取代的碳原子数1〜18的烃基，各自可以相同 或不同。 可以将R 1至R 3中的两个或更多个键合以具有环结构。 R 4至R 7表示氢原子或取代或未取代的碳原子数1〜18的一价有机基团，各自可以相同或不同。 表示其中一个质子从具有0至18个碳原子并具有至少一个能够排出的质子的一价基团排出的基团。 可以将R 4和R 7中的两个或更多个连接成一个环结构。 固化促进剂在吸湿性，流动性，回流开裂性和高温保存特性方面表现出优异的固化性。

公开(公告)号：US06495270B1

公开(公告)日：2002-12-17

申请号：US09622569

申请日：2000-10-23

申请人： Mitsuo Katayose ,  Shinya Nakamura

发明人： Mitsuo Katayose ,  Shinya Nakamura

IPC分类号： H01L2912

CPC分类号： C07D231/12 ,  C07D233/56 ,  C07D249/08 ,  C08G59/686 ,  C08L63/00 ,  H01L23/293 ,  H01L2924/0002 ,  Y10T428/12528 ,  C08L2666/22 ,  H01L2924/00

摘要： Nitrogen compounds represented by formula (XXIa) or (XXIb); an epoxy resin hardening accelerator and a resin composition each containing any of the compounds; and an electronic part device containing an element encapsulated with the composition. In the formulae, R1 and R2 each represents hydrogen or a C1-20 monovalent organic group; R3 and R4 each represents a C1-20 divalnt organic group; R5 represents hydrogen or a C1-6 monovalent organic group; k is an integer of 0 to 2; and p is 0 or 1.

摘要翻译： 由式（XXIa）或（X​​XIb）表示的氮化合物; 环氧树脂硬化促进剂和各自含有任何化合物的树脂组合物; 以及包含用所述组合物封装的元件的电子部件装置。 在式中，R 1和R 2各自表示氢或C 1-20的一价有机基团; R3和R4各自表示C1-20二价有机基团; R5表示氢或C1-6一价有机基团; k为0〜2的整数， p为0或1。

公开(公告)号：US20090023855A1

公开(公告)日：2009-01-22

申请号：US11816571

申请日：2006-01-31

申请人： Shinya Nakamura ,  Tomoya Masuda ,  Mitsuo Katayose

发明人： Shinya Nakamura ,  Tomoya Masuda ,  Mitsuo Katayose

IPC分类号： C08G77/52 ,  C08L63/00

CPC分类号： C08G59/302 ,  C08G59/4261 ,  C08G77/52 ,  C08L83/14 ,  C09J163/00 ,  H01L23/296 ,  H01L2924/0002 ,  H01L2924/00

摘要： A curable resin which exhibits excellent heat resistance while including an extremely smaller amount of volatile component is disclosed, and an electronic component device having excellent reliability in heat resistance and the like which contains the above curable resin is provided. A curable resin obtained in reaction of at least one compound (a) selected from the group consisting of the silane compounds represented by the following Formula (I-1) and the partial condensates thereof with a phenol compound (b), comprising a remaining volatile component in an amount of 10 wt % or less with respect to the total weight of the curable resin is used as a curing agent. [Formula 1] R1nSiR2(4-n)  (I-1) (Wherein, n denotes a number of 0 to 2; R1 represent a hydrogen atom, or substituted or unsubstituted hydrocarbon groups having 1 to 18 carbon atoms; R2 represent a halogen atom, a hydroxyl group, substituted or unsubstituted oxy groups, amino groups, and carbonyloxy groups having 1 to 18 carbon atoms; and two or more of R1 and R2 may bind to each other to form a cyclic structure).

摘要翻译： 公开了一种显示出优异的耐热性同时包含极少挥发性成分的固化树脂，并且提供了含有上述可固化树脂的具有优异的耐热性等可靠性的电子部件装置。 将选自由下式（I-1）表示的硅烷化合物和其部分缩合物的至少一种化合物（a）与酚化合物（b）反应获得的可固化树脂，其包含剩余的挥发性 使用相对于固化性树脂的总重量为10重量％以下的成分作为固化剂。 <？in-line-formula description =“In-line Formulas”end =“lead”？> [Formula 1] <？in-line-formula description =“In-line Formulas”end =“tail”？> in-line-formula description =“In-line Formulas”end =“lead”？> R1nSiR2（4-n）（I-1）<？in-line-formula description =“In-line Formulas”end =“tail “其中，n表示0〜2的数; R1表示氢原子，或取代或未取代的碳原子数1〜18的烃基，R2表示卤素原子，羟基，取代或未取代的氧基， 氨基和碳原子数为1〜18的碳氧基; R2和R2中的两个以上可以相互结合形成环状结构）。

公开(公告)号：US08956513B2

公开(公告)日：2015-02-17

申请号：US13378534

申请日：2010-07-15

申请人： Shinya Nakamura ,  Yoshinori Fujii ,  Hideto Nagashima

发明人： Shinya Nakamura ,  Yoshinori Fujii ,  Hideto Nagashima

IPC分类号： C23C14/56 ,  C23C14/06 ,  C23C14/00

CPC分类号： C23C14/0641 ,  C23C14/0036 ,  C23C14/56 ,  C23C14/568

摘要： There is provided a substrate processing method, in which a throughput can be improved even in case the time for recovery processing for restoring the state of a processing chamber is longer than the time for predetermined processing to be performed in the processing chamber. Substrates are alternately transferred to two processing chambers C, D, and the same film forming processing is performed on the substrates in the processing chambers C, D in parallel with each other. When the number of substrates processed in the processing chamber C has reached a predetermined number (11 substrates), dummy sputtering processing in the film forming chamber C is started and also 23rd-25th substrates of the first lot are transferred to the film forming chamber D to thereby perform film forming processing until the dummy sputtering processing is finished.

摘要翻译： 提供了一种基板处理方法，其中即使在用于恢复处理室的状态的恢复处理的时间比在处理室中进行预定处理的时间长的情况下也可以提高吞吐量。 基板交替地传送到两个处理室C，D，并且在处理室C，D中的基板上彼此平行地执行相同的成膜处理。 当处理室C中处理的基板的数量达到预定数量（11个基板）时，成膜室C中的虚拟溅射处理开始，第一批次的第23至25个基板被转印到成膜室D 从而进行成膜处理，直到虚拟溅射处理结束。