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30 条记录 (耗时 0.026 秒)

    Processing apparatus
    1.
    发明申请
    Processing apparatus 审中-公开
    处理装置

    公开(公告)号：US20050042881A1

    公开(公告)日：2005-02-24

    申请号：US10843295

    申请日：2004-05-12

    申请人： Shinya Nishimoto ,  Masakazu Higuma ,  Shinji Muto ,  Hisashi Fujiwara ,  Hiroyuki Nakayama ,  Yoshinori Shimanuki

    发明人： Shinya Nishimoto ,  Masakazu Higuma ,  Shinji Muto ,  Hisashi Fujiwara ,  Hiroyuki Nakayama ,  Yoshinori Shimanuki

    IPC分类号： H01L21/00 ,  H01L21/683 ,  H01L21/68

    CPC分类号： H01L21/67248 ,  H01L21/6833

    摘要： The time period during which a wafer is stabilized to a predetermined temperature by increasing a thermal conductivity of a junction layer for bonding an electrostatic chuck layer and a support together, and the deterioration of the junction layer that is caused by active species generated by plasma is suppressed. Between the electrostatic chuck layer formed by sintering together a chuck electrode made of tungsten and an insulating layer made of alumina and the support, made of aluminum, for supporting the electrostatic chuck layer, the junction layer is provided to bond the electrostatic chuck layer and the support together. The junction layer is formed by impregnating a porous ceramic with a silicone-based adhesive resin. Further, rubber or a heat shrink tube made of a fluoric resin such as PFA is provided as a soft coating member so as to coat a side circumferential surface of the junction layer and the side circumferential surfaces of the electrostatic chuck layer and the support come into a tight contact with the heat shrink tube or rubber.

    摘要翻译： 通过增加用于将静电卡盘层和支撑体接合在一起的接合层的热导率，并且由等离子体产生的活性物质引起的接合层的劣化，晶片稳定在预定温度的时间段是 被压制 在通过烧结在由钨制成的卡盘电极和由氧化铝制成的绝缘层上形成的静电卡盘层和由铝制成的用于支撑静电卡盘层的支撑件之间设置接合层以将静电卡盘层和 一起支持 接合层通过用硅氧烷基粘合剂树脂浸渍多孔陶瓷而形成。 此外，作为软涂层，设置橡胶或由诸如PFA的氟树脂制成的热收缩管，以覆盖接合层的侧周面，并且静电卡盘层和支撑体的侧周面进入 与热缩管或橡胶紧密接触。

    Electrostatic chuck
    2.
    发明授权
    Electrostatic chuck 有权
    静电吸盘

    公开(公告)号：US07663860B2

    公开(公告)日：2010-02-16

    申请号：US11001298

    申请日：2004-12-02

    申请人： Shinya Nishimoto ,  Hiroyuki Nakayama ,  Hidetoshi Kimura

    发明人： Shinya Nishimoto ,  Hiroyuki Nakayama ,  Hidetoshi Kimura

    IPC分类号： H01T23/00

    CPC分类号： H01L21/67109 ,  H01L21/6831

    摘要： An electrostatic chuck for attracting and holding a substrate by using an electrostatic force includes a plurality of protrusion portions to be brought into contact with the substrate. The protrusion portions are formed of a ceramic dielectric including grains each having a specified particle diameter, and contact surfaces of the protrusion portions with the substrate are formed to have a surface roughness depending on the particle diameter.

    摘要翻译： 用于通过使用静电力吸引和保持基板的静电卡盘包括与基板接触的多个突出部分。 突出部由陶瓷电介质形成，该陶瓷电介质包括各自具有特定粒径的晶粒，并且突出部与基板的接触表面形成为具有取决于粒径的表面粗糙度。