摘要:
A clamp is provided having a synthetic clip and a metal plate spring. The clip includes a pair of side walls opposed each other at a certain distance, engaging shoulder portions each formed at an outer surface of each of the side walls and configured to be engaged with a peripheral edge of a mounting hole of a panel at the time of securing a mounting member to the panel. The spring is attached to one of the side walls of the clip. A press-fitting portion is formed at an inner surface of the other side wall and configured to be pressed against a boss portion of the mounting member. The spring includes a bite-into portion facing the press-fitting portion and configured to bite into the boss portion of the mounting member at the time of securing the mounting member to the panel.
摘要:
Conventionally, when executing a plurality of programs while being synchronized by a plurality of debuggers, an interface has been required for performing a particular coordination between the debuggers. In the present invention, programs are synchronously executed without coordination between the debuggers by performing a control method including a step for maintaining a program execution state in the debuggers to be different from an actual program execution state, so that the program execution is retained, if necessary, in response to a program execution request from a debugger.
摘要:
The present invention provides a silicon-containing polyamic acid derivative which is represented by the formula (VI) ##STR1## and which has a logarithmic viscosity number of 0.1 to 5.0 dl/g at 30.degree. C. in N-methyl-2-pyrrolidone, said silicon-containing polyamic acid derivative being obtained by reacting A mol of a tetracarboxylic acid derivative, B mol of a diamine, and C mol of an aminosilicon compound so as to meet the relations of the equations (IV) and (V): ##EQU1## A photosensitive resin composition using this silicon-containing polyamic acid derivative can be easily manufactured, permits the formation of a negative type sharp relief pattern, can inhibit film reduction at the time of curing by baking, and is excellent in adhesive properties to substrates, heat stability and shelf stability.
摘要翻译:本发明提供由式(VI)XkR3-k5Si(VI)< IMAGE>表示的含硅聚酰胺酸衍生物,其在30℃下的对数粘度为0.1〜5.0dl / g - 甲基-2-吡咯烷酮,所述含硅聚酰胺酸衍生物是通过使A摩尔四羧酸衍生物,B摩尔二胺和C摩尔的氨基硅化合物反应得到的,以满足式(IV (V):(V)使用该含硅聚酰胺酸衍生物的感光性树脂组合物可以容易地制造,允许形成负型锐利浮雕图案,可以抑制膜还原 在通过烘烤固化时,对基材的粘合性优异,热稳定性和贮存稳定性优异。
摘要:
A process for the preparation of olefin polymers, which comprises polymerizing an olefin in the presence of a catalyst which comprises: (A) a solid catalyst component obtained by contacting a magnesium dihalide such as MgCl.sub.2 with a titanium tetra-alkoxide such as Ti(O-nBu).sub.4 and then with a polymeric silicon compound having a structure represented by the formula ##STR1## wherein R stands for a hydrocarbon residue such as CH.sub.3, and contacting the obtained solid component with a halogen compound of silicon such as SiCl.sub.4 or with a halogen compound of silicon such as SiCl.sub.4 and a halogen compound of titanium such as TiCl.sub.4, (B) an organoaluminum compound such as Al(Et).sub.3 ; and (C) an organic silicon compound having an Si--O--C linkage such as PhSi(OEt).sub.3. According to this process, a polymer having a high stereoregularity, a narrow particle size distribution and a high bulk density can be obtained in a high yield with a high efficiency.
摘要:
A lock apparatus includes a operation handle, a pair of springs movably supported by the container member, a pair of slide pins urged in directions of lock holes defined on the support member by the springs, respectively, and a pair of cam members to which rear end portions of the slide pins are fitted, respectively, to urge each slide pin to project and retract. When the operation handle is operated in a swing manner, a front end portion of each slide pin is retracted from each lock hole of the support member against pressure of each spring. Engagement holes are defined on opposed surfaces of each front end portion of the cam member having a cylindrical shape. Each rear end portion of the slide pin is formed in a bifurcated structure to have elastic pieces. Each of elastic pieces has a protrusion for detachably engaging with each of engagement holes.
摘要:
A photosensitive resin composition containing 0.5 to 15 parts by weight of a compound generating an acid by light irradiation in 100 parts by weight of a polyamic acid amide having an alkoxysilane having a specified structure at its terminals are provided,which composition has superior resolution properties, a small shrinkage of volume, a superior adhesion onto a substrate, and can prepare a polyimide by baking.
摘要:
A photosensitive resin composition is provide which includes a compound for generating an acid by light irradiation and at least one polyimide precursor selected from the group consisting of a silicon-containing polyimide precursor (a) obtained from A mol of a tetracarboxylic dianhydride or its derivative formed by adding 2 mols or less of a monovalent saturated alcohol to 1 mol of the tetracarboxylic dianhydride, B mol of a diamine and C mol of an aminosilicon compound represented by the formula (1) H2N—R1—SiR23−kXk (1) {wherein R1 is —(CH2)s—, (wherein s is an integer of from 1 to 4); R2 is independently an alkyl group having 1 to 6 carbon atoms, a phenyl group or a phenyl group substituted by an alkyl group having 7 to 12 carbon atoms; X is a hydrolytic alkoxy group; and k is 1≦k≦3} in a ratio meeting the following formulae (2) and (3) 1 ≦ C A - B ≦ 2.5 ( 2 ) 0.1 ≦ C B + C ≦ 1 ( 3 ) a silicon-containing polyamic acid ester (b) obtained by esterifying the precursor (a) with a monovalent saturated alcohol, and a partially esterified silicon-containing polyamic acid ester (c) obtained by partially esterifying the precursor (a) with the monovalent saturated alcohol.
摘要:
A photosensitive polyimide precursor composition of the present invention comprises a polyimide precursor represented by the formula (6)(OR.sup.5).sub.k R.sup.4.sub.3-k Si--R.sup.3 --X--Z (6)and having a logarithmic viscosity number of 0.1 to 5.0 dl/g measured in N-methyl-2-pyrrolidone at 30.degree. C. and a compound capable of generating an acid by light irradiation, said polyimide precursor being obtained by reacting A mol of a tetracarboxylic dianhydride, B mol of a diamine, and C mol of an aminosilane so as to meet the relations of the equations: ##EQU1## This composition not only has practical photosensitivity but also inhibits the reduction of film thickness due to curing and development, and it is also excellent in shelf stability in varnish and adhesive properties to a substrate such as a silicon wafer or the like.
摘要:
A method of preparing a negative type pattern of a polyimide film is provided which includes applying to a substrate a sufficient amount of a photosensitive polymer composition to form a negative type pattern, the photosensitive polymer composition comprising a mixture of a poly(amido)imide precursor containing a repeating unit represented by the following formula (I), at least one kind of quinonediazide compound and an organic solvent: ##STR1## R.sup.1 is a trivalent or a tetravalent carbocyclic aromatic group or heterocyclic group; R.sup.2 is an aliphatic group having at least two carbon atoms, an alicyclic group, an aromatic aliphatic group, a carbocyclic aromatic group, a heterocyclic group or a polysiloxane group; X is --O-- or NR.sup.5 --, where R.sup.5 is a hydrogen atom or a monovalent organic group having 10 or less carbon atoms; R.sup.3 is a divalent organic group; R.sup.4 is a hydrogen atom or a monovalent organic group having 20 or less carbon atoms; Ar is a hexavalent or decavalent organic group represented by the formula ##STR2## k is an integer of 1.ltoreq.k.ltoreq.5, and j+k+1 is equal to the valence of Ar; m is independently 1 or 2; n is independently 0 or 1 and the values of m and n are in the range of 1.ltoreq.m+n.ltoreq.2; prebaking the composition at 50.degree.-130.degree. C.; irradiating the composition through a mask with actinic radiation to form an irradiated composition; developing the irradiated composition with a developing solution comprising a basic solution of a basic substance in a solvent comprising 0 to 10 parts by weight of water and 100 to 90 parts by weight of a water-soluble organic solvent to remove unexposed portions of the composition and form a negative type pattern; rinsing and drying the pattern; and post-baking the pattern at 200.degree.-500.degree. C.