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    Planar optical interface and splitter
    1.
    发明授权
    Planar optical interface and splitter 有权
    平面光接口和分路器

    公开(公告)号：US08690455B2

    公开(公告)日：2014-04-08

    申请号：US13532829

    申请日：2012-06-26

    申请人： Shmuel Levy ,  Shai Rephaeli ,  Nimer Khazen ,  Yonatan Malkiman

    发明人： Shmuel Levy ,  Shai Rephaeli ,  Nimer Khazen ,  Yonatan Malkiman

    IPC分类号： G02B6/38 ,  G02B6/43

    CPC分类号： G02B6/3885 ,  G02B6/2804 ,  G02B6/2817 ,  G02B6/43 ,  H05K1/0274 ,  H05K1/189 ,  H05K2201/047 ,  H05K2201/10121 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49826

    摘要： An apparatus includes an optical Input/Output (I/O) connector, which has a central axis that is mounted in a plane and which is configured to connect to external optical fibers for transferring input optical signals to the apparatus and output optical signals from the apparatus. A first optical ferrule is mounted perpendicularly to the optical I/O connector in the plane, and is configured to transfer the input optical signals from the optical I/O connector to respective optical detectors. A second optical ferrule is mounted perpendicularly to the optical I/O connector in the plane, and is configured to transfer the output optical signals from respective optical emitters to the optical connector. A light rotation module is configured to bend and transfer the input and output optical signals between the optical I/O connector and the perpendicularly-mounted first and second optical ferrules.

    摘要翻译： 一种设备包括光输入/输出（I / O）连接器，其具有安装在平面中的中心轴，并被配置为连接到外部光纤以将输入光信号传送到设备并输出来自 仪器。 第一光学套圈垂直于平面中的光学I / O连接器安装，并且被配置为将输入的光信号从光学I / O连接器传送到相应的光学检测器。 第二光学套圈垂直于平面中的光学I / O连接器安装，并且被配置为将来自相应的光发射器的输出光信号传送到光学连接器。 光旋转模块被配置为在光学I / O连接器和垂直安装的第一和第二光学套圈之间弯曲和传送输入和输出光学信号。

    PLANAR OPTICAL INTERFACE AND SPLITTER
    2.
    发明申请
    PLANAR OPTICAL INTERFACE AND SPLITTER 有权
    平面光接口和分离器

    公开(公告)号：US20130294780A1

    公开(公告)日：2013-11-07

    申请号：US13532829

    申请日：2012-06-26

    申请人： Shmuel Levy ,  Shai Rephaeli ,  Nimer Khazen ,  Yonatan Malkiman

    发明人： Shmuel Levy ,  Shai Rephaeli ,  Nimer Khazen ,  Yonatan Malkiman

    IPC分类号： G02B6/42 ,  H05K3/32 ,  H05K3/00 ,  H05K13/04 ,  H04B10/12 ,  B23P11/00

    CPC分类号： G02B6/3885 ,  G02B6/2804 ,  G02B6/2817 ,  G02B6/43 ,  H05K1/0274 ,  H05K1/189 ,  H05K2201/047 ,  H05K2201/10121 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49826

    摘要： An apparatus includes an optical Input/Output (I/O) connector, which has a central axis that is mounted in a plane and which is configured to connect to external optical fibers for transferring input optical signals to the apparatus and output optical signals from the apparatus. A first optical ferrule is mounted perpendicularly to the optical I/O connector in the plane, and is configured to transfer the input optical signals from the optical I/O connector to respective optical detectors. A second optical ferrule is mounted perpendicularly to the optical I/O connector in the plane, and is configured to transfer the output optical signals from respective optical emitters to the optical connector. A light rotation module is configured to bend and transfer the input and output optical signals between the optical I/O connector and the perpendicularly-mounted first and second optical ferrules.

    摘要翻译： 一种设备包括光输入/输出（I / O）连接器，其具有安装在平面中的中心轴，并被配置为连接到外部光纤以将输入光信号传送到设备并输出来自 仪器。 第一光学套圈垂直于平面中的光学I / O连接器安装，并且被配置为将输入的光信号从光学I / O连接器传送到相应的光学检测器。 第二光学套圈垂直于平面中的光学I / O连接器安装，并且被配置为将来自相应的光发射器的输出光信号传送到光学连接器。 光旋转模块被配置为在光学I / O连接器和垂直安装的第一和第二光学套圈之间弯曲和传送输入和输出光学信号。

    OPTICAL MODULE FABRICATED ON FOLDED PRINTED CIRCUIT BOARD
    3.
    发明申请
    OPTICAL MODULE FABRICATED ON FOLDED PRINTED CIRCUIT BOARD 有权
    折叠印刷电路板上的光学模块

    公开(公告)号：US20130202247A1

    公开(公告)日：2013-08-08

    申请号：US13366326

    申请日：2012-02-05

    申请人： Shmuel Levy ,  Shai Rephaeli ,  Yonatan Malkiman

    发明人： Shmuel Levy ,  Shai Rephaeli ,  Yonatan Malkiman

    IPC分类号： G02B6/12 ,  H05K3/00 ,  H05K3/30

    CPC分类号： H05K1/189 ,  G02B6/4249 ,  G02B6/428 ,  G02B6/4284 ,  G02B6/43 ,  H05K1/147 ,  H05K2201/055 ,  H05K2201/10121 ,  Y10T29/49128 ,  Y10T29/4913

    摘要： An optical interface module includes a single flexible Printed Circuit Board (PCB) including conductive traces. An electrical connector, one or more opto-electronic transducers and ancillary circuitry are disposed on the flexible PCB. The electrical connector is configured to mate with a corresponding connector on a substrate. The opto-electronic transducers are configured to be coupled to optical fibers carrying optical signals. The ancillary circuitry is coupled by the traces to the opto-electronic transducers and the electrical connector so as to convey electrical signals corresponding to the optical signals between the opto-electronic transducers and the electrical connector.

    摘要翻译： 光接口模块包括单个柔性印刷电路板（PCB），包括导电迹线。 电连接器，一个或多个光电换能器和辅助电路设置在柔性PCB上。 电连接器被配置为与基板上的相应连接器配合。 光电换能器被配置为耦合到携带光信号的光纤。 辅助电路通过迹线耦合到光电换能器和电连接器，以便传送对应于光电换能器和电连接器之间的光信号的电信号。

    Optical module fabricated on folded printed circuit board
    4.
    发明授权
    Optical module fabricated on folded printed circuit board 有权
    在折叠印刷电路板上制造的光学模块

    公开(公告)号：US08867870B2

    公开(公告)日：2014-10-21

    申请号：US13366326

    申请日：2012-02-05

    申请人： Shmuel Levy ,  Shai Rephaeli ,  Yonatan Malkiman

    发明人： Shmuel Levy ,  Shai Rephaeli ,  Yonatan Malkiman

    IPC分类号： G02B6/12 ,  H05K1/18 ,  G02B6/43

    CPC分类号： H05K1/189 ,  G02B6/4249 ,  G02B6/428 ,  G02B6/4284 ,  G02B6/43 ,  H05K1/147 ,  H05K2201/055 ,  H05K2201/10121 ,  Y10T29/49128 ,  Y10T29/4913

    摘要： An optical interface module includes a single flexible Printed Circuit Board (PCB) including conductive traces. An electrical connector, one or more opto-electronic transducers and ancillary circuitry are disposed on the flexible PCB. The electrical connector is configured to mate with a corresponding connector on a substrate. The opto-electronic transducers are configured to be coupled to optical fibers carrying optical signals. The ancillary circuitry is coupled by the traces to the opto-electronic transducers and the electrical connector so as to convey electrical signals corresponding to the optical signals between the opto-electronic transducers and the electrical connector.

    摘要翻译： 光接口模块包括单个柔性印刷电路板（PCB），包括导电迹线。 电连接器，一个或多个光电换能器和辅助电路设置在柔性PCB上。 电连接器被配置为与基板上的相应连接器配合。 光电换能器被配置为耦合到携带光信号的光纤。 辅助电路通过迹线耦合到光电换能器和电连接器，以便传送对应于光电换能器和电连接器之间的光信号的电信号。

    OPTOELECTRONIC INTERCONNECTS USING L-SHAPED FIXTURE
    6.
    发明申请
    OPTOELECTRONIC INTERCONNECTS USING L-SHAPED FIXTURE 审中-公开
    光电互连使用L形形状

    公开(公告)号：US20130243368A1

    公开(公告)日：2013-09-19

    申请号：US13419449

    申请日：2012-03-14

    申请人： Shmuel Levy ,  Shai Rephaeli ,  Shai Cohen ,  Evelyn Landman ,  Ofer Ezra

    发明人： Shmuel Levy ,  Shai Rephaeli ,  Shai Cohen ,  Evelyn Landman ,  Ofer Ezra

    IPC分类号： G02B6/12 ,  B29C65/00

    CPC分类号： G02B6/423 ,  G02B6/3882 ,  G02B6/3885 ,  G02B6/3897 ,  G02B6/4292 ,  Y10T156/1089

    摘要： An apparatus includes an L-shaped fixture, a first semiconductor die and a second semiconductor die. The L-shaped fixture includes first and second perpendicular faces. The first semiconductor die includes an array of optoelectronic transducers and is attached onto the first face. The second semiconductor die, which is mounted parallel to the second face, includes ancillary circuitry connected to the optoelectronic transducers by electronic interconnects configured within the fixture.

    摘要翻译： 一种装置包括L形固定装置，第一半导体管芯和第二半导体管芯。 L形夹具包括第一和第二垂直面。 第一半导体管芯包括光电子换能器的阵列并附着在第一面上。 平行于第二面安装的第二半导体管芯包括通过配置在固定装置内的电子互连连接到光电子换能器的辅助电路。

    Method of fabricating integrated optoelectronic interconnects with side mounted transducer
    7.
    发明授权
    Method of fabricating integrated optoelectronic interconnects with side mounted transducer 有权
    使用侧面安装的传感器制造集成光电互连的方法

    公开(公告)号：US08871570B2

    公开(公告)日：2014-10-28

    申请号：US13419447

    申请日：2012-03-14

    申请人： Shmuel Levy ,  Shai Rephaeli

    发明人： Shmuel Levy ,  Shai Rephaeli

    IPC分类号： H01L21/00 ,  H01L23/34 ,  H01L21/78 ,  H01L23/522

    CPC分类号： H01L21/78 ,  G02B6/4231 ,  G02B6/4249 ,  G02B6/4274 ,  H01L21/76898 ,  H01L23/5226 ,  H01L24/13 ,  H01L2224/13144 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/00

    摘要： A method for fabricating an optical interconnect includes producing a semiconductor wafer that includes multiple first dies. Each first die includes circuitry disposed over a surface of the wafer and connected to conductive vias arranged in rows. The multiple first dies are diced by cutting the wafer across the rows of the vias, such that, in each first die, the cut vias form respective contact pads on a side face of the first die that is perpendicular to the surface. A second semiconductor die including one or more optoelectronic transducers is attached to the contact pads, so as to connect the transducers to the circuitry.

    摘要翻译： 制造光学互连的方法包括制造包括多个第一裸片的半导体晶片。 每个第一管芯包括设置在晶片的表面上并连接到以行布置的导电通孔的电路。 多个第一裸片通过在通孔的行上切割晶片来切割，使得在每个第一裸片中，切割通孔在垂直于表面的第一裸片的侧面上形成相应的接触垫。 包括一个或多个光电换能器的第二半导体管芯附接到接触焊盘，以将换能器连接到电路。

    INTEGRATED OPTOELECTRONIC INTERCONNECTS WITH SIDE-MOUNTED TRANSDUCERS
    8.
    发明申请
    INTEGRATED OPTOELECTRONIC INTERCONNECTS WITH SIDE-MOUNTED TRANSDUCERS 有权
    集成光电互连与侧面安装的传感器

    公开(公告)号：US20130241050A1

    公开(公告)日：2013-09-19

    申请号：US13419447

    申请日：2012-03-14

    申请人： Shmuel Levy ,  Shai Rephaeli

    发明人： Shmuel Levy ,  Shai Rephaeli

    IPC分类号： H01L23/498 ,  H01L21/50

    CPC分类号： H01L21/78 ,  G02B6/4231 ,  G02B6/4249 ,  G02B6/4274 ,  H01L21/76898 ,  H01L23/5226 ,  H01L24/13 ,  H01L2224/13144 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/00

    摘要： A method for fabricating an optical interconnect includes producing a semiconductor wafer that includes multiple first dies. Each first die includes circuitry disposed over a surface of the wafer and connected to conductive vias arranged in rows. The multiple first dies are diced by cutting the wafer across the rows of the vias, such that, in each first die, the cut vias form respective contact pads on a side face of the first die that is perpendicular to the surface. A second semiconductor die including one or more optoelectronic transducers is attached to the contact pads, so as to connect the transducers to the circuitry.

    摘要翻译： 制造光学互连的方法包括制造包括多个第一裸片的半导体晶片。 每个第一管芯包括设置在晶片的表面上并连接到以行布置的导电通孔的电路。 多个第一裸片通过在通孔的行上切割晶片来切割，使得在每个第一裸片中，切割通孔在垂直于表面的第一裸片的侧面上形成相应的接触垫。 包括一个或多个光电换能器的第二半导体管芯附接到接触焊盘，以将换能器连接到电路。