公开(公告)号：US07841918B2

公开(公告)日：2010-11-30

申请号：US11639681

申请日：2006-12-15

申请人： Shu-Ping Lee ,  San-Yuan Chen ,  Kuan-Ting Kuo ,  Chu-Chi Ting ,  Yu-Heng Hsieh

发明人： Shu-Ping Lee ,  San-Yuan Chen ,  Kuan-Ting Kuo ,  Chu-Chi Ting ,  Yu-Heng Hsieh

IPC分类号： H01J9/24 ,  H01J17/49

CPC分类号： H01J65/046 ,  C09K11/025 ,  C09K11/7734 ,  H01J61/305 ,  H01J61/46

摘要： Microwave irradiation treatment is used to enhance the luminescent efficiency by improving surface morphology of the illuminating phosphors. The invention modifies the phosphor particles from the sheet-like shape into the spherical shape and so as to exhibit better crystalline property, thus it may provide for the fabrication of the phosphors with high luminescent efficiency for the optoelectronic devices.

摘要翻译： 微波照射处理用于通过改善照明荧光体的表面形态来提高发光效率。 本发明将荧光体颗粒从片状形状修改为球形，并且表现出更好的晶体性质，因此可以为光电子器件提供高发光效率的荧光体的制造。

公开(公告)号：US20080146112A1

公开(公告)日：2008-06-19

申请号：US11639681

申请日：2006-12-15

申请人： Shu-Ping Lee ,  San-Yuan Chen ,  Kuan-Ting Kuo ,  Chu-Chi Ting ,  Yu-Heng Hsieh

发明人： Shu-Ping Lee ,  San-Yuan Chen ,  Kuan-Ting Kuo ,  Chu-Chi Ting ,  Yu-Heng Hsieh

IPC分类号： H01J9/02

CPC分类号： H01J65/046 ,  C09K11/025 ,  C09K11/7734 ,  H01J61/305 ,  H01J61/46

摘要： Microwave irradiation treatment is used to enhance the luminescent efficiency by improving surface morphology of the illuminating phosphors. The invention modifies the phosphor particles from the sheet-like shape into the spherical shape and so as to exhibit better crystalline property, thus it may provide for the fabrication of the phosphors with high luminescent efficiency for the optoelectronic devices.

摘要翻译： 微波照射处理用于通过改善照明荧光体的表面形态来提高发光效率。 本发明将荧光体颗粒从片状形状修改为球形，并且表现出更好的晶体性质，因此可以为光电子器件提供高发光效率的荧光体的制造。

公开(公告)号：US20130092729A1

公开(公告)日：2013-04-18

申请号：US13398852

申请日：2012-02-17

申请人： Kuan-Ting Kuo

发明人： Kuan-Ting Kuo

IPC分类号： G06F17/30

CPC分类号： G06K7/00 ,  G06F1/1647 ,  G06F1/26 ,  G06F1/32 ,  G06F1/3225 ,  G06F1/3265 ,  G06F1/3287 ,  G06K7/083 ,  G09G3/00 ,  Y02D10/153 ,  Y02D10/171

摘要： A card reader that is connected to a portable electronic apparatus includes a processor and a memory card controller. The processor receives a trigger signal from the portable electronic apparatus when the portable electronic apparatus is in a standby mode. The memory card controller detects whether at least one memory card is inserted into the card reader and generates a memory card inserting status accordingly. The portable electronic apparatus provides a standby power to the card reader and a first screen based on the trigger signal. The processor receives the memory card inserting status; according to the memory card inserting status, the processor reads contents of the memory card, so that the contents of the memory card are displayed on the first screen.

摘要翻译： 连接到便携式电子设备的读卡器包括处理器和存储卡控制器。 当便携式电子设备处于待机模式时，处理器从便携式电子设备接收触发信号。 存储卡控制器检测是否将至少一个存储卡插入到读卡器中并相应地生成存储卡插入状态。 便携式电子设备基于触发信号向读卡器和第一屏幕提供备用电源。 处理器接收存储卡插入状态; 根据存储卡插入状态，处理器读取存储卡的内容，使得存储卡的内容显示在第一屏幕上。

公开(公告)号：US08875989B2

公开(公告)日：2014-11-04

申请号：US13398852

申请日：2012-02-17

申请人： Kuan-Ting Kuo

发明人： Kuan-Ting Kuo

IPC分类号： G06F17/00 ,  G09G3/00 ,  G06F1/32 ,  G06K7/08 ,  G06F1/26 ,  G06F1/16 ,  G06K7/00

CPC分类号： G06K7/00 ,  G06F1/1647 ,  G06F1/26 ,  G06F1/32 ,  G06F1/3225 ,  G06F1/3265 ,  G06F1/3287 ,  G06K7/083 ,  G09G3/00 ,  Y02D10/153 ,  Y02D10/171

摘要： A card reader that is connected to a portable electronic apparatus includes a processor and a memory card controller. The processor receives a trigger signal from the portable electronic apparatus when the portable electronic apparatus is in a standby mode. The memory card controller detects whether at least one memory card is inserted into the card reader and generates a memory card inserting status accordingly. The portable electronic apparatus provides a standby power to the card reader and a first screen based on the trigger signal. The processor receives the memory card inserting status; according to the memory card inserting status, the processor reads contents of the memory card, so that the contents of the memory card are displayed on the first screen.

摘要翻译： 连接到便携式电子设备的读卡器包括处理器和存储卡控制器。 当便携式电子设备处于待机模式时，处理器从便携式电子设备接收触发信号。 存储卡控制器检测是否将至少一个存储卡插入到读卡器中并相应地生成存储卡插入状态。 便携式电子设备基于触发信号向读卡器和第一屏幕提供备用电源。 处理器接收存储卡插入状态; 根据存储卡插入状态，处理器读取存储卡的内容，使得存储卡的内容显示在第一屏幕上。

公开(公告)号：US07102222B2

公开(公告)日：2006-09-05

申请号：US10846427

申请日：2004-05-14

申请人： Kuan-Ting Kuo ,  Yu-Ting Lai ,  Chin-Chien Chiang

发明人： Kuan-Ting Kuo ,  Yu-Ting Lai ,  Chin-Chien Chiang

IPC分类号： H01L23/48

CPC分类号： H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A conductive trace structure and a semiconductor package having the conductive trace structure are provided. A plurality of conductive traces are formed in and surrounding a chip mounting area on a substrate, for mounting a chip on the chip mounting area. Widened portions are formed on the conductive traces in the chip mounting area and at positions across a periphery of the chip mounting area, the widened portions having a line width larger than that of the rest part of the conductive traces. The widened portions of the conductive traces can sustain concentrated thermal stress from the peripheral area of the chip caused by mismatch in coefficient of thermal expansion between the chip and the substrate. This prevents the conductive traces that pass through the periphery of the chip mounting area from cracks or breaks due to the thermal stress, thereby improving the reliability and yield of the semiconductor package.

摘要翻译： 提供具有导电迹线结构的导电迹线结构和半导体封装。 多个导电迹线形成在基板上并围绕芯片安装区域周围，用于将芯片安装在芯片安装区域上。 扩大部分形成在芯片安装区域中的导电迹线上并且在芯片安装区域的周边的位置处形成，所述加宽部分的线宽大于导电迹线的其余部分的线宽。 导电迹线的加宽部分可以由芯片和衬底之间的热膨胀系数不匹配引起来自芯片外围区域的集中的热应力。 这防止了通过芯片安装区域的周边的导电迹线由于热应力而被破裂或断裂，从而提高了半导体封装的可靠性和产量。

公开(公告)号：US20050073038A1

公开(公告)日：2005-04-07

申请号：US10846427

申请日：2004-05-14

申请人： Kuan-Ting Kuo ,  Yu-Ting Lai ,  Chin-Chien Chiang

发明人： Kuan-Ting Kuo ,  Yu-Ting Lai ,  Chin-Chien Chiang

IPC分类号： H01L23/498 ,  H01L29/00

CPC分类号： H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A conductive trace structure and a semiconductor package having the conductive trace structure are provided. A plurality of conductive traces are formed in and surrounding a chip mounting area on a substrate, for mounting a chip on the chip mounting area. Widened portions are formed on the conductive traces in the chip mounting area and at positions across a periphery of the chip mounting area, the widened portions having a line width larger than that of the rest part of the conductive traces. The widened portions of the conductive traces can sustain concentrated thermal stress from the peripheral area of the chip caused by mismatch in coefficient of thermal expansion between the chip and the substrate. This prevents the conductive traces that pass through the periphery of the chip mounting area from cracks or breaks due to the thermal stress, thereby improving the reliability and yield of the semiconductor package.

摘要翻译： 提供具有导电迹线结构的导电迹线结构和半导体封装。 多个导电迹线形成在基板上并围绕芯片安装区域周围，用于将芯片安装在芯片安装区域上。 扩大部分形成在芯片安装区域中的导电迹线上并且在芯片安装区域的周边的位置处形成，所述加宽部分的线宽大于导电迹线的其余部分的线宽。 导电迹线的加宽部分可以由芯片和衬底之间的热膨胀系数不匹配引起来自芯片外围区域的集中的热应力。 这防止了通过芯片安装区域的周边的导电迹线由于热应力而被破裂或断裂，从而提高了半导体封装的可靠性和产量。