公开(公告)号：US20170093361A1

公开(公告)日：2017-03-30

申请号：US15186510

申请日：2016-06-19

Applicant: SiTime Corporation

Inventor： Charles I. Grosjean ,  Nicholas Miller ,  Paul M. Hagelin ,  Ginel C. Hill ,  Joseph C. Doll ,  Trushal Chokshi ,  Yi Zhang ,  Aaron Partridge ,  Markus Lutz

IPC: H03H3/007 ,  H03H9/17

CPC classification number: H03H3/0077 ,  H03H9/02259 ,  H03H9/02401 ,  H03H9/02448 ,  H03H9/1057 ,  H03H9/17 ,  H03H9/2463 ,  H03H2003/027 ,  H03H2009/02307 ,  H03H2009/155

Abstract: In a MEMS device having a substrate and a moveable micromachined member, a mechanical structure secures the moveable micromachined member to the substrate, thermally isolates the moveable micromachined member from the substrate and provides a conduction path to enable heating of the moveable micromachined member to a temperature of at least 300 degrees Celsius.