FABRICATION METHOD OF PACKAGE STRUCTURE HAVING MEMS ELEMENT
    6.
    发明申请
    FABRICATION METHOD OF PACKAGE STRUCTURE HAVING MEMS ELEMENT 有权
    具有MEMS元件的封装结构的制造方法

    公开(公告)号:US20130203200A1

    公开(公告)日:2013-08-08

    申请号:US13834684

    申请日:2013-03-15

    Abstract: A fabrication method of a package structure having at least an MEMS element is provided, including: preparing a wafer having electrical connection pads and the at least an MEMS element; disposing lids for covering the at least an MEMS element, the lids having a metal layer formed thereon; electrically connecting the electrical connection pads and the metal layer with bonding wires; forming an encapsulant for covering the lids, bonding wires, electrical connection pads and metal layer; removing portions of the encapsulant to separate the bonding wires each into first and second sub-bonding wires, wherein top ends of the first and second sub-bonding wires are exposed, the first sub-bonding wires electrically connecting to the electrical connection pads, and the second sub-bonding wires electrically connecting to the metal layer; forming metallic traces on the encapsulant for electrically connecting to the first sub-bonding wires; forming bumps on the metallic traces; and performing a singulation process.

    Abstract translation: 提供具有至少MEMS元件的封装结构的制造方法,包括:制备具有电连接焊盘和所述至少MEMS元件的晶片; 设置用于覆盖所述至少一个MEMS元件的盖,所述盖具有在其上形成的金属层; 电连接焊盘和金属层与接合线; 形成用于覆盖盖子,接合线,电连接垫和金属层的密封剂; 去除所述密封剂的部分以将所述接合线分别分离成第一和第二子接合线,其中所述第一和第二次接合线的顶端被暴露,所述第一子接合线电连接到所述电连接焊盘,以及 所述第二子接合线电连接到所述金属层; 在所述密封剂上形成用于电连接到所述第一子接合线的金属迹线; 在金属痕迹上形成凸块; 并执行单独处理。

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