公开(公告)号：US20240213008A1

公开(公告)日：2024-06-27

申请号：US18244034

申请日：2023-09-08

申请人： Spark Thermionics, Inc. ,  The Trustees of the University of Pennsylvania

发明人： Matthew Campbell ,  Mohsen Azadi ,  Kyana Van Houten ,  Jared William Schwede ,  Samuel M. Nicaise ,  Igor Bargatin

IPC分类号： H01J45/00 ,  H01J9/18 ,  H01L29/66 ,  H10N10/00

CPC分类号： H01J45/00 ,  H01J9/185 ,  H01L29/6653 ,  H01L29/6656 ,  H10N10/00

摘要： A small-gap device system, preferably including two or more electrodes and one or more spacers maintaining a gap between two or more of the electrodes. A spacer for a small-gap device system, preferably including a plurality of legs defining a mesh structure. A method of spacer and/or small-gap device fabrication, preferably including: defining lateral features, depositing spacer material, selectively removing spacer material, separating the spacer from a fabrication substrate, and/or assembling the small-gap device.

公开(公告)号：US20220139687A1

公开(公告)日：2022-05-05

申请号：US17155638

申请日：2021-01-22

申请人： Spark Thermionics, Inc. ,  The Trustees of the University of Pennsylvania

发明人： Matthew Campbell ,  Mohsen Azadi ,  Kyana Van Houten ,  Jared William Schwede ,  Samuel M. Nicaise ,  Igor Bargatin

IPC分类号： H01J45/00

摘要： A small-gap device system, preferably including two or more electrodes and one or more spacers maintaining a gap between two or more of the electrodes. A spacer for a small-gap device system, preferably including a plurality of legs defining a mesh structure. A method of spacer and/or small-gap device fabrication, preferably including: defining lateral features, depositing spacer material, selectively removing spacer material, separating the spacer from a fabrication substrate, and/or assembling the small-gap device.

公开(公告)号：US11791142B2

公开(公告)日：2023-10-17

申请号：US17155638

申请日：2021-01-22

申请人： Spark Thermionics, Inc. ,  The Trustees of the University of Pennsylvania

发明人： Matthew Campbell ,  Mohsen Azadi ,  Kyana Van Houten ,  Jared William Schwede ,  Samuel M. Nicaise ,  Igor Bargatin

IPC分类号： H01J45/00 ,  H01J9/18 ,  H01L29/66 ,  H10N10/00

CPC分类号： H01J45/00 ,  H01J9/185 ,  H01L29/6653 ,  H01L29/6656 ,  H10N10/00

摘要： A small-gap device system, preferably including two or more electrodes and one or more spacers maintaining a gap between two or more of the electrodes. A spacer for a small-gap device system, preferably including a plurality of legs defining a mesh structure. A method of spacer and/or small-gap device fabrication, preferably including: defining lateral features, depositing spacer material, selectively removing spacer material, separating the spacer from a fabrication substrate, and/or assembling the small-gap device.

公开(公告)号：US20220037138A1

公开(公告)日：2022-02-03

申请号：US17497342

申请日：2021-10-08

申请人： Spark Thermionics, Inc. ,  The Trustees of the University of Pennsylvania

发明人： Jared William Schwede ,  Igor Bargatin ,  Samuel M. Nicaise ,  Chen Lin ,  John Provine

IPC分类号： H01J45/00

摘要： A small-gap device system, preferably including two or more electrodes and one or more spacers maintaining a gap between two or more of the electrodes. A spacer for a small-gap device system, preferably including a plurality of legs defining a mesh structure. A method of spacer and/or small-gap device fabrication, preferably including: defining lateral features, depositing spacer material, selectively removing spacer material, separating the spacer from a fabrication substrate, and/or assembling the small-gap device.

公开(公告)号：US20230420233A1

公开(公告)日：2023-12-28

申请号：US18243972

申请日：2023-09-08

申请人： Spark Thermionics, Inc. ,  The Trustees of the University of Pennsylvania

发明人： Jared William Schwede ,  Igor Bargatin ,  Samuel M. Nicaise ,  Chen Lin ,  John Provine

IPC分类号： H01J45/00

CPC分类号： H01J45/00

摘要： A small-gap device system, preferably including two or more electrodes and one or more spacers maintaining a gap between two or more of the electrodes. A spacer for a small-gap device system, preferably including a plurality of legs defining a mesh structure. A method of spacer and/or small-gap device fabrication, preferably including: defining lateral features, depositing spacer material, selectively removing spacer material, separating the spacer from a fabrication substrate, and/or assembling the small-gap device.

公开(公告)号：US11791143B2

公开(公告)日：2023-10-17

申请号：US17497342

申请日：2021-10-08

申请人： Spark Thermionics, Inc. ,  The Trustees of the University of Pennsylvania

发明人： Jared William Schwede ,  Igor Bargatin ,  Samuel M. Nicaise ,  Chen Lin ,  John Provine

IPC分类号： H01J45/00

CPC分类号： H01J45/00

摘要： A small-gap device system, preferably including two or more electrodes and one or more spacers maintaining a gap between two or more of the electrodes. A spacer for a small-gap device system, preferably including a plurality of legs defining a mesh structure. A method of spacer and/or small-gap device fabrication, preferably including: defining lateral features, depositing spacer material, selectively removing spacer material, separating the spacer from a fabrication substrate, and/or assembling the small-gap device.

公开(公告)号：US11170984B2

公开(公告)日：2021-11-09

申请号：US16044215

申请日：2018-07-24

申请人： Spark Thermionics, Inc. ,  The Trustees of the University of Pennsylvania

发明人： Jared William Schwede ,  Igor Bargatin ,  Samuel M. Nicaise ,  Chen Lin ,  John Provine

IPC分类号： H02N10/00 ,  H01J45/00

摘要： A small-gap device system, preferably including two or more electrodes and one or more spacers maintaining a gap between two or more of the electrodes. A spacer for a small-gap device system, preferably including a plurality of legs defining a mesh structure. A method of spacer and/or small-gap device fabrication, preferably including: defining lateral features, depositing spacer material, selectively removing spacer material, separating the spacer from a fabrication substrate, and/or assembling the small-gap device.

公开(公告)号：US11198938B2

公开(公告)日：2021-12-14

申请号：US16787733

申请日：2020-02-11

申请人： THE TRUSTEES OF THE UNIVERSITY OF PENNSYLVANIA

发明人： Igor Bargatin ,  Keivan Davami

IPC分类号： B32B3/12 ,  C23C16/455 ,  C23C16/01 ,  C23C16/12 ,  C23C16/50 ,  H01J37/32

摘要： A nanoscale plate structure includes base plates and rib plates with nanoscale thickness and macroscopic lateral dimensions. The base plate resides in the first plane, the ribs can reside out-of-plane and form at least one strengthening rib, and additional base plates can reside in planes parallel to the first plane. The strengthening rib can be patterned such that there is no straight line path extending through a lateral dimension of the plate structure that does not intersect the at least one base plate and the at least one strengthening rib. The plates and ribs used in the structure have a thickness between about 1 nm and about 100 nm. The plate structures can be fabricated using a conformal deposition method including atomic layer deposition.

公开(公告)号：US11027514B2

公开(公告)日：2021-06-08

申请号：US15998451

申请日：2018-08-15

申请人： THE TRUSTEES OF THE UNIVERSITY OF PENNSYLVANIA

发明人： Igor Bargatin ,  Chen Lin ,  Samuel Nicaise

IPC分类号： B32B3/12 ,  B32B3/26

摘要： The presently disclosed subject matter relates to nanocardboard structures and methods of fabrication thereof. An exemplary nanocardboard structure includes at least two parallel planar films and webbing. The planar films can be separated from each other by a gap of from about 0.1 micrometers to about 1000 micrometers.

公开(公告)号：US20170183772A1

公开(公告)日：2017-06-29

申请号：US15456718

申请日：2017-03-13

申请人： THE TRUSTEES OF THE UNIVERSITY OF PENNSYLVANIA

发明人： Igor Bargatin ,  Keivan Davami

IPC分类号： C23C16/455 ,  H01J37/32 ,  C23C16/50

CPC分类号： C23C16/45525 ,  C23C16/01 ,  C23C16/12 ,  C23C16/45555 ,  C23C16/50 ,  H01J37/321 ,  H01J2237/334

摘要： A nanoscale plate structure includes base plates and rib plates with nanoscale thickness and macroscopic lateral dimensions. The base plate resides in the first plane, the ribs can reside out-of-plane and form at least one strengthening rib, and additional base plates can reside in planes parallel to the first plane. The strengthening rib can be patterned such that there is no straight line path extending through a lateral dimension of the plate structure that does not intersect the at least one base plate and the at least one strengthening rib. The plates and ribs used in the structure have a thickness between about 1 nm and about 100 nm. The plate structures can be fabricated using a conformal deposition method including atomic layer deposition.