公开(公告)号：US20230210009A1

公开(公告)日：2023-06-29

申请号：US18117814

申请日：2023-03-06

申请人： FACE INTERNATIONAL CORPORATION

发明人： Clark D BOYD

IPC分类号： H10N19/00 ,  H01J45/00 ,  H10N10/00

CPC分类号： H10N19/00 ,  H01J45/00 ,  H10N10/00

摘要： An integrated circuit system, structure and/or component is provided that includes an integrated electrical power source in a form of a unique, environmentally-friendly energy harvesting element or component. The energy harvesting component provides a mechanism for generating autonomous renewable energy, or a renewable energy supplement, in the integrated circuit system, structure and/or component. The energy harvesting element includes a first conductor layer, a low work function layer, a dielectric layer, and a second conductor layer that are particularly configured to promote electron migration from the low work function layer, through the dielectric layer, to the facing surface of the second conductor layer in a manner that develops an electric potential between the first conductor layer and the second conductor layer. An energy harvesting component includes a plurality of energy harvesting elements electrically connected to one another to increase a power output of the electric harvesting component.

公开(公告)号：US11923131B2

公开(公告)日：2024-03-05

申请号：US17096699

申请日：2020-11-12

申请人： Lawrence Livermore National Security, LLC ,  Richard Thuss

发明人： Alexander Baker ,  Scott K. McCall ,  Harry B. Radousky ,  Nathan Woollett ,  Richard Thuss

IPC分类号： H01F7/02 ,  B22F10/25 ,  B22F10/38 ,  B32B1/04 ,  B32B3/02 ,  B32B3/26 ,  B32B3/30 ,  B32B5/14 ,  B32B5/16 ,  B32B7/025 ,  B32B7/027 ,  B32B15/04 ,  B33Y80/00 ,  C23C4/01 ,  C23C4/04 ,  C23C4/06 ,  C23C4/08 ,  C23C4/12 ,  C23C24/00 ,  C23C24/04 ,  C23C30/00 ,  H01F7/00 ,  H01F41/14 ,  H01F41/20 ,  H01F41/30 ,  H01F41/34 ,  H10N10/00 ,  H10N10/80 ,  H10N10/857 ,  H10N15/00 ,  H10N30/00 ,  H10N30/01 ,  H10N30/074 ,  H10N30/076 ,  H10N60/00 ,  H10N60/01 ,  B33Y10/00 ,  H10N10/01

CPC分类号： H01F41/14 ,  B22F10/25 ,  B22F10/38 ,  B32B1/04 ,  B32B3/02 ,  B32B3/26 ,  B32B3/30 ,  B32B5/14 ,  B32B5/142 ,  B32B5/145 ,  B32B5/16 ,  B32B7/025 ,  B32B7/027 ,  B32B15/04 ,  B32B15/043 ,  B33Y80/00 ,  C23C4/01 ,  C23C4/04 ,  C23C4/06 ,  C23C4/08 ,  C23C4/12 ,  C23C24/00 ,  C23C24/04 ,  C23C30/00 ,  C23C30/005 ,  H01F7/00 ,  H01F7/02 ,  H01F41/20 ,  H01F41/30 ,  H01F41/34 ,  H10N10/00 ,  H10N10/80 ,  H10N10/857 ,  H10N15/00 ,  H10N30/00 ,  H10N30/01 ,  H10N30/074 ,  H10N30/076 ,  H10N30/1051 ,  H10N60/00 ,  H10N60/01 ,  B22F2999/00 ,  B33Y10/00 ,  C22C2202/00 ,  H10N10/01 ,  Y10T428/12389 ,  Y10T428/12396 ,  Y10T428/12458 ,  Y10T428/12493 ,  Y10T428/12528 ,  Y10T428/12535 ,  Y10T428/12681 ,  Y10T428/24942 ,  Y10T428/249921 ,  Y10T428/26 ,  B22F2999/00 ,  B22F10/25 ,  B22F2207/01 ,  C22C2202/02

摘要： A product includes an array of cold spray-formed structures. Each of the structures is characterized by having a defined feature size in at least one dimension of less than 100 microns as measured in a plane of deposition of the structure, at least 90% of a theoretical density of a raw material from which the structure is formed, and essentially the same functional properties as the raw material. A product includes a cold spray-formed structure characterized by having a defined feature size in at least one dimension of less than 100 microns as measured in a plane of deposition of the structure, at least 90% of a theoretical density of a raw material from which the structure is formed, and essentially the same functional properties as the raw material.

公开(公告)号：US20240035897A1

公开(公告)日：2024-02-01

申请号：US18482960

申请日：2023-10-09

申请人： University of South Carolina

发明人： Amitav Tikadar ,  Sowmya Raghu ,  Jamil A. Khan

IPC分类号： G01K7/04 ,  H10N10/00 ,  H10N10/01 ,  H10N10/10 ,  H10N10/17

CPC分类号： G01K7/04 ,  H10N10/00 ,  H10N10/01 ,  H10N10/10 ,  H10N10/17

摘要： An in-contact temperature measurement probe, which can measure temperature accurately on the surface of a current carrying wire, rod, heater, or other device, while maintaining the safety of the user via employing non-electrically conductive but thermally conductive materials.

公开(公告)号：US20230392833A1

公开(公告)日：2023-12-07

申请号：US18448805

申请日：2023-08-11

申请人： BLUEXTHERMAL, INC.

发明人： Reza MONAZAMI ,  Sahar JAHANI ,  Nicholas Keith ANSELMO

IPC分类号： F25B21/02 ,  F28D15/02 ,  F28D15/04 ,  A61F7/00 ,  H01L23/38 ,  A61B18/20 ,  H10N10/00 ,  H10N10/13 ,  H10N10/17

CPC分类号： F25B21/02 ,  F28D15/0233 ,  F28D15/0275 ,  F28D15/046 ,  A61F7/007 ,  H01L23/38 ,  A61B18/203 ,  H10N10/00 ,  H10N10/13 ,  H10N10/17 ,  A61B2018/00452

摘要： Thermal management systems comprising a thermoelectric component, a heat transfer unit, and a controller. The heat transfer unit has a chamber and microfeatures in the chamber that are positioned to receive a working fluid. The controller is configured to operate the thermoelectric component and the heat transfer unit such that the heat transfer unit cools one side of the thermoelectric component to a first temperature and the thermoelectric component changes the temperature of a target material on its other side to a second temperature of +/−60° C. of the first temperature within 0.5-20 seconds.

公开(公告)号：US20230389215A1

公开(公告)日：2023-11-30

申请号：US18354615

申请日：2023-07-18

申请人： Consolidated Networks Corporation

发明人： John Kowalsky ,  Brian Baesler ,  Erik Howard ,  William Howard ,  Alec Valentino ,  Cesar Villalvazo ,  Todd Wilt

IPC分类号： H05K7/14 ,  H05K7/20 ,  H10N10/00

CPC分类号： H05K7/1489 ,  H05K7/1495 ,  H05K7/207 ,  H10N10/00

摘要： A command-and-control module for communications, ideally in military operating conditions, is adapted for easy insertion into, and removal from, a portable case. A chassis has front and rear vertical plates secured, e.g. welded, to a horizontal plate. At least one DIN rail, for securing electrical and electronic equipment, is mounted to a vertical plate. The case has electrical ports and outlets as well as multiple features to protect the sensitive electronic equipment inside. Shock absorbers between the horizontal plate and the inner surface of the case protect the equipment from mechanical shock. A thermoelectric cooler keeps the equipment from overheating. An inner cover protects the equipment from dust. The inner cover is bolted to the chassis. The chassis is not otherwise affixed to the case. When the bolts are removed, the chassis is easily lifted out by handles.

公开(公告)号：US11791142B2

公开(公告)日：2023-10-17

申请号：US17155638

申请日：2021-01-22

申请人： Spark Thermionics, Inc. ,  The Trustees of the University of Pennsylvania

发明人： Matthew Campbell ,  Mohsen Azadi ,  Kyana Van Houten ,  Jared William Schwede ,  Samuel M. Nicaise ,  Igor Bargatin

IPC分类号： H01J45/00 ,  H01J9/18 ,  H01L29/66 ,  H10N10/00

CPC分类号： H01J45/00 ,  H01J9/185 ,  H01L29/6653 ,  H01L29/6656 ,  H10N10/00

摘要： A small-gap device system, preferably including two or more electrodes and one or more spacers maintaining a gap between two or more of the electrodes. A spacer for a small-gap device system, preferably including a plurality of legs defining a mesh structure. A method of spacer and/or small-gap device fabrication, preferably including: defining lateral features, depositing spacer material, selectively removing spacer material, separating the spacer from a fabrication substrate, and/or assembling the small-gap device.

公开(公告)号：US12029122B2

公开(公告)日：2024-07-02

申请号：US17381269

申请日：2021-07-21

申请人： Applied Thermoelectric Solutions, LLC

发明人： Alfred J. Piggott

IPC分类号： H10N10/10 ,  H02J50/00 ,  H10N10/00 ,  H10N10/81

CPC分类号： H10N10/10 ,  H02J50/001 ,  H10N10/00 ,  H10N10/81

摘要： A TEG system is attached to a rotating shaft and generates electricity from radiant energy that is substantially radiatively transmitted through the atmosphere from a stationary source to the TEG system that is rotating with the shaft. The rotation of the shaft provides cooling to the TEG system, but not heat energy. The TEG system includes at least one TEG, each TEG equipped with an energy receiving and heat containment window and an energy conversion system in combination with controlled convection cooling enhanced by an airflow moving in response to the rotation of the rotating shaft. Individual TEGs having controlled convection cooling also are described.

公开(公告)号：US20240213008A1

公开(公告)日：2024-06-27

申请号：US18244034

申请日：2023-09-08

申请人： Spark Thermionics, Inc. ,  The Trustees of the University of Pennsylvania

发明人： Matthew Campbell ,  Mohsen Azadi ,  Kyana Van Houten ,  Jared William Schwede ,  Samuel M. Nicaise ,  Igor Bargatin

IPC分类号： H01J45/00 ,  H01J9/18 ,  H01L29/66 ,  H10N10/00

CPC分类号： H01J45/00 ,  H01J9/185 ,  H01L29/6653 ,  H01L29/6656 ,  H10N10/00

摘要： A small-gap device system, preferably including two or more electrodes and one or more spacers maintaining a gap between two or more of the electrodes. A spacer for a small-gap device system, preferably including a plurality of legs defining a mesh structure. A method of spacer and/or small-gap device fabrication, preferably including: defining lateral features, depositing spacer material, selectively removing spacer material, separating the spacer from a fabrication substrate, and/or assembling the small-gap device.

公开(公告)号：US20240177927A1

公开(公告)日：2024-05-30

申请号：US18433052

申请日：2024-02-05

申请人： Richard Thuss ,  Lawrence Livermore National Security, LLC

发明人： Alexander Baker ,  Scott K. McCall ,  Harry B. Radousky ,  Nathan Woollett ,  Richard Thuss

IPC分类号： H01F41/14 ,  B22F10/25 ,  B22F10/38 ,  B32B1/00 ,  B32B3/02 ,  B32B3/26 ,  B32B3/30 ,  B32B5/14 ,  B32B5/16 ,  B32B7/025 ,  B32B7/027 ,  B32B15/04 ,  B33Y80/00 ,  C23C4/01 ,  C23C4/04 ,  C23C4/06 ,  C23C4/08 ,  C23C4/12 ,  C23C24/00 ,  C23C24/04 ,  C23C30/00 ,  H01F7/00 ,  H01F7/02 ,  H01F41/20 ,  H01F41/30 ,  H01F41/34 ,  H10N10/00 ,  H10N10/80 ,  H10N10/857 ,  H10N15/00 ,  H10N30/00 ,  H10N30/01 ,  H10N30/074 ,  H10N30/076 ,  H10N60/00 ,  H10N60/01 ,  B33Y10/00 ,  H10N10/01

CPC分类号： H01F41/14 ,  B22F10/25 ,  B22F10/38 ,  B32B1/00 ,  B32B3/02 ,  B32B3/26 ,  B32B3/30 ,  B32B5/14 ,  B32B5/142 ,  B32B5/145 ,  B32B5/16 ,  B32B7/025 ,  B32B7/027 ,  B32B15/04 ,  B32B15/043 ,  B33Y80/00 ,  C23C4/01 ,  C23C4/04 ,  C23C4/06 ,  C23C4/08 ,  C23C4/12 ,  C23C24/00 ,  C23C24/04 ,  C23C30/00 ,  C23C30/005 ,  H01F7/00 ,  H01F7/02 ,  H01F41/20 ,  H01F41/30 ,  H01F41/34 ,  H10N10/00 ,  H10N10/80 ,  H10N10/857 ,  H10N15/00 ,  H10N30/00 ,  H10N30/01 ,  H10N30/074 ,  H10N30/076 ,  H10N30/1051 ,  H10N60/00 ,  H10N60/01 ,  B22F2999/00 ,  B33Y10/00 ,  C22C2202/00 ,  H10N10/01 ,  Y10T428/12389 ,  Y10T428/12396 ,  Y10T428/12458 ,  Y10T428/12493 ,  Y10T428/12528 ,  Y10T428/12535 ,  Y10T428/12681 ,  Y10T428/24942 ,  Y10T428/249921 ,  Y10T428/26

摘要： A method, in accordance with one embodiment, includes forming an array of structures from a raw material via cold spray. Each of the structures is characterized by having a defined feature size in at least one dimension of less than 100 microns as measured in a plane of deposition of the structure, at least 90% of a theoretical density of the raw material, and essentially the same functional properties as the raw material. A method, in accordance with another embodiment, includes positioning a mask between a cold spray nozzle and a substrate, and forming a structure on the substrate by cold spraying a raw material from the cold spray nozzle. The structure has a shape corresponding to an aperture in the mask.

公开(公告)号：US11906371B2

公开(公告)日：2024-02-20

申请号：US17082056

申请日：2020-10-28

申请人： General Electric Company

发明人： Kurt Kramer Schleif ,  Andrew David Ellis

IPC分类号： G01K7/02 ,  G01K1/14 ,  H10N10/00 ,  H10N10/80 ,  H10N10/85

CPC分类号： G01K7/02 ,  G01K1/14 ,  H10N10/00 ,  H10N10/80 ,  H10N10/85 ,  F05D2220/30 ,  F05D2270/303

摘要： Thermocouples for high temperature applications are provided. A thermocouple includes a vessel formed from a dielectric material, the vessel defining a first chamber and a second chamber, the first chamber and second chamber in fluid communication. The thermocouple further includes a first thermoelement disposed in the first chamber, the first thermoelement formed from a first thermoelectric material. The thermocouple further includes a second thermoelement disposed in the second chamber, the second thermoelement formed from a second thermoelectric material different from the first thermoelectric material, and wherein the second thermoelement is a liquid at operating conditions of the thermocouple.