Hybrid illumination system with improved color quality
    3.
    发明授权
    Hybrid illumination system with improved color quality 有权
    混合照明系统具有改进的色彩质量

    公开(公告)号:US08519611B2

    公开(公告)日:2013-08-27

    申请号:US12353455

    申请日:2009-01-14

    IPC分类号: F21K2/00 C09K11/00 H01J1/62

    摘要: A white light hybrid illumination system including an amber LED, a red LED, and a phosphor converted LED such as a blue LED chip and a green phosphor, wherein a peak emission difference between the amber and red LED is at least 25 nm. This system provides higher color quality than prior devices due to its high luminous efficacy, high CRI over a wide CCT range, and better color control.

    摘要翻译: 一种白光混合照明系统,包括琥珀色LED,红色LED和蓝色LED芯片和绿色荧光体等磷光体转换LED,其中琥珀色和红色LED之间的峰值发射差异至少为25nm。 由于其高发光效率,较宽的CCT范围内的高CRI以及更好的色彩控制,该系统提供比现有器件更高的色彩质量。

    HYBRID ILLUMINATION SYSTEM WITH IMPROVED COLOR QUALITY
    4.
    发明申请
    HYBRID ILLUMINATION SYSTEM WITH IMPROVED COLOR QUALITY 有权
    混合照明系统具有改进的颜色质量

    公开(公告)号:US20100177513A1

    公开(公告)日:2010-07-15

    申请号:US12353455

    申请日:2009-01-14

    IPC分类号: F21K7/00

    摘要: A white light hybrid illumination system including an amber LED, a red LED, and a phosphor converted LED such as a blue LED chip and a green phosphor, wherein a peak emission difference between the amber and red LED is at least 25 nm. This system provides higher color quality than prior devices due to its high luminous efficacy, high CRI over a wide CCT range, and better color control.

    摘要翻译: 一种白光混合照明系统,包括琥珀色LED,红色LED和蓝色LED芯片和绿色荧光体等磷光体转换LED,其中琥珀色和红色LED之间的峰值发射差异至少为25nm。 由于其高发光效率,较宽的CCT范围内的高CRI以及更好的色彩控制,该系统提供比现有器件更高的色彩质量。

    Light emitting diode component
    5.
    发明申请
    Light emitting diode component 有权
    发光二极管组件

    公开(公告)号:US20050239227A1

    公开(公告)日:2005-10-27

    申请号:US10831862

    申请日:2004-04-26

    摘要: A light emitting package (8, 8′, 8″, 208, 408) includes a printed circuit board (10, 10′, 10″, 210, 410) supporting at least one light emitting die (12, 12″, 14, 16, 212, 412). A light transmissive cover (60, 60′, 60″, 260, 460) is disposed over the at least one light emitting die. The cover has an open end defining a cover perimeter (62, 62′, 62″, 262, 462) connected with the printed circuit board. An inside surface of the cover together with the printed circuit board defines an interior volume (70, 70″, 270, 470) containing the at least one light emitting die. An encapsulant (76, 76″, 276, 278, 476) is disposed in the interior volume and covers at least the light emitting die.

    摘要翻译: 发光封装(8,8',8“,208,408)包括支撑至少一个发光管芯(12,12”,“10”)的印刷电路板(10,10',10“,210,410) ,14,16,212,412)。 透光罩(60,60',60“,260,460)设置在所述至少一个发光管芯上。 盖具有限定与印刷电路板连接的盖周长(62,62',62“,262,462)的开口端。 与印刷电路板一起,盖的内表面限定包含至少一个发光管芯的内部容积(70,70“,270,470)。 密封剂(76,76“,276,278,476)设置在内部体积中并且至少覆盖发光管芯。

    Light emitting packages and methods of making same
    7.
    发明授权
    Light emitting packages and methods of making same 有权
    发光封装及其制造方法

    公开(公告)号:US07842960B2

    公开(公告)日:2010-11-30

    申请号:US11516533

    申请日:2006-09-06

    IPC分类号: H01L21/00

    摘要: In a light emitting package (8), at least one light emitting chip (12, 14, 16, 18) is supported by a board (10). A light transmissive encapsulant (30) is disposed over the at least one light emitting chip and over a footprint area (32) of the board. A light transmissive generally conformal shell (40) is disposed over the encapsulant and has an inner surface (44) spaced apart by an air gap (G) from, and generally conformal with, an outer surface (34) of the encapsulant. At least one phosphor (50) is disposed on or embedded in the conformal shell to output converted light responsive to irradiation by the at least one light emitting chip. A thermally conductive filler material disposed in the generally conformal shell (40) is effective to enhance a thermal conductivity of the composite shell material to a value higher than 0.3 W/(m·K).

    摘要翻译: 在发光封装(8)中,至少一个发光芯片(12,14,16,18)由板(10)支撑。 透光密封剂(30)设置在所述至少一个发光芯片之上并且在所述板的覆盖区域(32)之上。 光透射的大致保形的壳体(40)设置在密封剂上方并且具有通过与密封剂的外表面(34)的气隙(G)间隔开并且大体上与其密封的外表面间隔开的内表面(44)。 至少一个磷光体(50)被布置在所述保形壳中或嵌入所述保形壳中,以响应于所述至少一个发光芯片的照射来输出转换的光。 设置在大致保形壳(40)中的导热填充材料有效地将复合壳材料的热导率提高到高于0.3W /(m·K)的值。

    Light emitting packages and methods of making same
    8.
    发明申请
    Light emitting packages and methods of making same 有权
    发光封装及其制造方法

    公开(公告)号:US20080054280A1

    公开(公告)日:2008-03-06

    申请号:US11516533

    申请日:2006-09-06

    IPC分类号: H01L33/00 H01L21/00

    摘要: In a light emitting package (8), at least one light emitting chip (12, 14, 16, 18) is supported by a board (10). A light transmissive encapsulant (30) is disposed over the at least one light emitting chip and over a footprint area (32) of the board. A light transmissive generally conformal shell (40) is disposed over the encapsulant and has an inner surface (44) spaced apart by an air gap (G) from, and generally conformal with, an outer surface (34) of the encapsulant. At least one phosphor (50) is disposed on or embedded in the conformal shell to output converted light responsive to irradiation by the at least one light emitting chip. A thermally conductive filler material disposed in the generally conformal shell (40) is effective to enhance a thermal conductivity of the composite shell material to a value higher than 0.3 W/(m.K).

    摘要翻译: 在发光封装(8)中,至少一个发光芯片(12,14,16,18)由板(10)支撑。 透光密封剂(30)设置在所述至少一个发光芯片之上并且在所述板的覆盖区域(32)之上。 光透射的大致保形的壳体(40)设置在密封剂上方并且具有通过与密封剂的外表面(34)的气隙(G)间隔开并且大体上与其密封的外表面间隔开的内表面(44)。 至少一个磷光体(50)被布置在所述保形壳中或嵌入所述保形壳中,以响应于所述至少一个发光芯片的照射来输出转换的光。 布置在大致保形壳(40)中的导热填料有效地将复合壳材料的热导率提高到高于0.3W /(m.K)的值。