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公开(公告)号:US20060097245A1
公开(公告)日:2006-05-11
申请号:US11312268
申请日:2005-12-20
申请人: Srinath Aanegola , Emil Radkov , James Reginelli , Larry Stadelman , Matthew Mrakovich , Tomislav Stimac
发明人: Srinath Aanegola , Emil Radkov , James Reginelli , Larry Stadelman , Matthew Mrakovich , Tomislav Stimac
IPC分类号: H01L23/02 , H01L29/06 , H01L31/0328 , H01L31/0336 , H01L31/072 , H01L31/109
CPC分类号: H01L25/0753 , F21K9/68 , F21V23/00 , H01L33/507 , H01L2224/48091 , H01L2924/01322 , H01L2924/00 , H01L2924/00014
摘要: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
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公开(公告)号:US20070267976A1
公开(公告)日:2007-11-22
申请号:US10555721
申请日:2004-05-05
申请人: Christopher Bohler , Boris Kolodin , Emil Radkov , Srinath Aanegola , Shanton Weaver , James Petroski , Zena Brown
发明人: Christopher Bohler , Boris Kolodin , Emil Radkov , Srinath Aanegola , Shanton Weaver , James Petroski , Zena Brown
IPC分类号: H01J61/52
CPC分类号: B82Y10/00 , F21K9/23 , F21K9/232 , F21K9/61 , F21K9/64 , F21V3/00 , F21V3/02 , F21V29/58 , F21V29/63 , F21V29/67 , F21V29/70 , F21V29/773 , F21Y2105/00 , F21Y2105/18 , F21Y2115/10
摘要: A light source (10) comprises a light engine (16), a base (24), a power conversion circuit (30) and an enclosure (22). The light engine (16) comprises at least one LED (12) disposed on a platform (14). The platform (14) is adapted to directly mate with the base (24) which a standard incandescent bulb light base. Phosphor (44) receives the light generated by the at least one LED (12) and converts it to visible light. The enclosure (22) has a shape of a standard incandescent lamp.
摘要翻译: 光源(10)包括光引擎(16),基座(24),电源转换电路(30)和外壳(22)。 光引擎(16)包括设置在平台(14)上的至少一个LED(12)。 平台(14)适于与基座(24)直接配合,该基座(24)是标准的白炽灯泡灯座。 荧光体(44)接收由至少一个LED(12)产生的光并将其转换成可见光。 外壳(22)具有标准白炽灯的形状。
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公开(公告)号:US08519611B2
公开(公告)日:2013-08-27
申请号:US12353455
申请日:2009-01-14
申请人: Emil Radkov , Anant Setlur , Srinath Aanegola
发明人: Emil Radkov , Anant Setlur , Srinath Aanegola
CPC分类号: C09K11/7734 , F21K9/64 , F21Y2113/17 , F21Y2115/10 , Y02B20/181
摘要: A white light hybrid illumination system including an amber LED, a red LED, and a phosphor converted LED such as a blue LED chip and a green phosphor, wherein a peak emission difference between the amber and red LED is at least 25 nm. This system provides higher color quality than prior devices due to its high luminous efficacy, high CRI over a wide CCT range, and better color control.
摘要翻译: 一种白光混合照明系统,包括琥珀色LED,红色LED和蓝色LED芯片和绿色荧光体等磷光体转换LED,其中琥珀色和红色LED之间的峰值发射差异至少为25nm。 由于其高发光效率,较宽的CCT范围内的高CRI以及更好的色彩控制,该系统提供比现有器件更高的色彩质量。
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公开(公告)号:US20100177513A1
公开(公告)日:2010-07-15
申请号:US12353455
申请日:2009-01-14
申请人: Emil Radkov , Anant Setlur , Srinath Aanegola
发明人: Emil Radkov , Anant Setlur , Srinath Aanegola
IPC分类号: F21K7/00
CPC分类号: C09K11/7734 , F21K9/64 , F21Y2113/17 , F21Y2115/10 , Y02B20/181
摘要: A white light hybrid illumination system including an amber LED, a red LED, and a phosphor converted LED such as a blue LED chip and a green phosphor, wherein a peak emission difference between the amber and red LED is at least 25 nm. This system provides higher color quality than prior devices due to its high luminous efficacy, high CRI over a wide CCT range, and better color control.
摘要翻译: 一种白光混合照明系统,包括琥珀色LED,红色LED和蓝色LED芯片和绿色荧光体等磷光体转换LED,其中琥珀色和红色LED之间的峰值发射差异至少为25nm。 由于其高发光效率,较宽的CCT范围内的高CRI以及更好的色彩控制,该系统提供比现有器件更高的色彩质量。
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公开(公告)号:US20050239227A1
公开(公告)日:2005-10-27
申请号:US10831862
申请日:2004-04-26
申请人: Srinath Aanegola , James Petroski , Emil Radkov , Stanton Weaver
发明人: Srinath Aanegola , James Petroski , Emil Radkov , Stanton Weaver
IPC分类号: H01L21/00 , H01L21/44 , H01L21/48 , H01L21/50 , H01L25/075 , H01L27/15 , H01L29/267 , H01L31/12 , H01L33/48 , H01L33/52 , H01L33/58 , H01L33/00
CPC分类号: H01L33/52 , H01L25/0753 , H01L33/507 , H01L33/58 , H01L2224/48091 , H01L2924/00
摘要: A light emitting package (8, 8′, 8″, 208, 408) includes a printed circuit board (10, 10′, 10″, 210, 410) supporting at least one light emitting die (12, 12″, 14, 16, 212, 412). A light transmissive cover (60, 60′, 60″, 260, 460) is disposed over the at least one light emitting die. The cover has an open end defining a cover perimeter (62, 62′, 62″, 262, 462) connected with the printed circuit board. An inside surface of the cover together with the printed circuit board defines an interior volume (70, 70″, 270, 470) containing the at least one light emitting die. An encapsulant (76, 76″, 276, 278, 476) is disposed in the interior volume and covers at least the light emitting die.
摘要翻译: 发光封装(8,8',8“,208,408)包括支撑至少一个发光管芯(12,12”,“10”)的印刷电路板(10,10',10“,210,410) ,14,16,212,412)。 透光罩(60,60',60“,260,460)设置在所述至少一个发光管芯上。 盖具有限定与印刷电路板连接的盖周长(62,62',62“,262,462)的开口端。 与印刷电路板一起,盖的内表面限定包含至少一个发光管芯的内部容积(70,70“,270,470)。 密封剂(76,76“,276,278,476)设置在内部体积中并且至少覆盖发光管芯。
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公开(公告)号:US20060181192A1
公开(公告)日:2006-08-17
申请号:US11400998
申请日:2006-04-10
申请人: Emil Radkov , James Reginelli , Anant Setlur
发明人: Emil Radkov , James Reginelli , Anant Setlur
CPC分类号: C09K11/7739 , C09K11/584 , C09K11/665 , C09K11/7731 , C09K11/7734 , C09K11/7738 , C09K11/774 , C09K11/7767 , C09K11/7774 , C09K11/778 , C09K11/7784 , C09K11/7787 , C09K11/7789 , C09K11/7794 , H01L33/502 , H01L33/504 , H01L51/5036
摘要: A method for the manufacturing of white LEDs is proposed, which can achieve a tunable CCT through the use of at least two phosphor materials, each composition including at least one individual phosphor compound. The method allows optimization of the devices for any desired CCT and approximation of the color coordinates of the black body (Planckian) locus.
摘要翻译: 提出了一种用于制造白色LED的方法,其可以通过使用至少两种磷光体材料来实现可调CCT,每种组合物包括至少一种单独的磷光体化合物。 该方法允许用于任何期望的CCT的装置的优化和黑体(普朗克))轨迹的颜色坐标的近似。
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公开(公告)号:US07842960B2
公开(公告)日:2010-11-30
申请号:US11516533
申请日:2006-09-06
IPC分类号: H01L21/00
CPC分类号: H01L25/0753 , G02F1/353 , H01L33/507 , H01L33/54 , H01L33/58 , H01L33/644 , H01L2924/0002 , H01S5/02288 , H01S5/02296 , H01L2924/00
摘要: In a light emitting package (8), at least one light emitting chip (12, 14, 16, 18) is supported by a board (10). A light transmissive encapsulant (30) is disposed over the at least one light emitting chip and over a footprint area (32) of the board. A light transmissive generally conformal shell (40) is disposed over the encapsulant and has an inner surface (44) spaced apart by an air gap (G) from, and generally conformal with, an outer surface (34) of the encapsulant. At least one phosphor (50) is disposed on or embedded in the conformal shell to output converted light responsive to irradiation by the at least one light emitting chip. A thermally conductive filler material disposed in the generally conformal shell (40) is effective to enhance a thermal conductivity of the composite shell material to a value higher than 0.3 W/(m·K).
摘要翻译: 在发光封装(8)中,至少一个发光芯片(12,14,16,18)由板(10)支撑。 透光密封剂(30)设置在所述至少一个发光芯片之上并且在所述板的覆盖区域(32)之上。 光透射的大致保形的壳体(40)设置在密封剂上方并且具有通过与密封剂的外表面(34)的气隙(G)间隔开并且大体上与其密封的外表面间隔开的内表面(44)。 至少一个磷光体(50)被布置在所述保形壳中或嵌入所述保形壳中,以响应于所述至少一个发光芯片的照射来输出转换的光。 设置在大致保形壳(40)中的导热填充材料有效地将复合壳材料的热导率提高到高于0.3W /(m·K)的值。
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公开(公告)号:US20080054280A1
公开(公告)日:2008-03-06
申请号:US11516533
申请日:2006-09-06
CPC分类号: H01L25/0753 , G02F1/353 , H01L33/507 , H01L33/54 , H01L33/58 , H01L33/644 , H01L2924/0002 , H01S5/02288 , H01S5/02296 , H01L2924/00
摘要: In a light emitting package (8), at least one light emitting chip (12, 14, 16, 18) is supported by a board (10). A light transmissive encapsulant (30) is disposed over the at least one light emitting chip and over a footprint area (32) of the board. A light transmissive generally conformal shell (40) is disposed over the encapsulant and has an inner surface (44) spaced apart by an air gap (G) from, and generally conformal with, an outer surface (34) of the encapsulant. At least one phosphor (50) is disposed on or embedded in the conformal shell to output converted light responsive to irradiation by the at least one light emitting chip. A thermally conductive filler material disposed in the generally conformal shell (40) is effective to enhance a thermal conductivity of the composite shell material to a value higher than 0.3 W/(m.K).
摘要翻译: 在发光封装(8)中,至少一个发光芯片(12,14,16,18)由板(10)支撑。 透光密封剂(30)设置在所述至少一个发光芯片之上并且在所述板的覆盖区域(32)之上。 光透射的大致保形的壳体(40)设置在密封剂上方并且具有通过与密封剂的外表面(34)的气隙(G)间隔开并且大体上与其密封的外表面间隔开的内表面(44)。 至少一个磷光体(50)被布置在所述保形壳中或嵌入所述保形壳中,以响应于所述至少一个发光芯片的照射来输出转换的光。 布置在大致保形壳(40)中的导热填料有效地将复合壳材料的热导率提高到高于0.3W /(m.K)的值。
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公开(公告)号:US08324640B2
公开(公告)日:2012-12-04
申请号:US10884205
申请日:2004-07-02
申请人: Cherian Jacob , Chen-Lun Hsing Chen , Emil Radkov , Alok Mani Srivastava , Anant Achyut Setlur , Holly Ann Comanzo , Joseph Shiang
发明人: Cherian Jacob , Chen-Lun Hsing Chen , Emil Radkov , Alok Mani Srivastava , Anant Achyut Setlur , Holly Ann Comanzo , Joseph Shiang
IPC分类号: H01L33/00
CPC分类号: G02B6/0041 , G02B6/0003 , G02B6/0031 , G02B6/0053 , G02B6/0055 , G02B6/0065 , G02B6/0071 , G02F1/133603 , G02F1/133615
摘要: An edge lit illumination system is directed to providing backlighting utilizing a luminescent impregnated lightguide. The apparatus includes an LED radiation source providing a first radiation and a lightguide optically coupled to the LED radiation source including a luminescent material embedded or coated on an output surface of the lightguide designed to absorb the first radiation, and emit one or more radiations. The illumination system may further include additional optical components such as reflective layers, for directing radiation striking the back surfaces of the light guide back into the lightguide, as well as diffusion layers, UV reflectors, and polarizers.
摘要翻译: 边缘照明照明系统旨在利用发光浸渍光导提供背光。 该装置包括提供第一辐射的LED辐射源和光耦合到LED辐射源的光导,该光源包括嵌入或涂覆在设计成吸收第一辐射的光导的输出表面上的发光材料,并且发射一个或多个辐射。 照明系统还可以包括诸如反射层的附加光学部件,用于将照射到光导的后表面的辐射引导回到光导中,以及扩散层,UV反射器和偏振器。
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公开(公告)号:US20080206910A1
公开(公告)日:2008-08-28
申请号:US12002929
申请日:2007-12-19
IPC分类号: H01L33/00
CPC分类号: H05B33/145 , H01L33/505 , H05B33/22
摘要: A lighting apparatus comprising at least one light emitting diode is disposed on an interconnect board to emit ultraviolet or blue radiation. A polymeric layer including a luminophor is disposed about the lighting apparatus to convert at least a portion of the radiation emitted from the LED into visible light. The polymeric layer is shrinkable to conform to a shape enclosing the light emitting diode.
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