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公开(公告)号：US09370048B2
公开(公告)日：2016-06-14
申请号：US13501452
申请日：2010-12-03
CPC分类号： H05B3/84 , H05B2203/016 , Y10T29/49117
摘要： The invention relates to a pane, wherein an electrically conductive structure is applied to a glass pane. At least one intermediate layer is applied to the electrically conductive structure, at least one electrical connecting element is attached to the intermediate layer, and the intermediate layer, electrical connecting element and electrically conductive structure form at least one hollow space comprising an electrically conductive mass. A method for the production and use thereof is also described.
摘要翻译： 本发明涉及一种窗格，其中将导电结构施加到玻璃板上。 至少一个中间层施加到导电结构，至少一个电连接元件附接到中间层，并且中间层，电连接元件和导电结构形成至少一个包含导电块的中空空间。 还描述了其生产和使用的方法。
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公开(公告)号：US08816215B2
公开(公告)日：2014-08-26
申请号：US13580741
申请日：2011-02-15
IPC分类号： H05K1/03 , H05K1/09 , B32B15/01 , H05B3/84 , B23K35/26 , C22C12/00 , C22C13/00 , C22C38/10 , C22C38/08 , H01R13/03 , H01R4/02
CPC分类号： H05B3/84 , B23K35/262 , B23K35/264 , B32B15/018 , C22C12/00 , C22C13/00 , C22C38/08 , C22C38/10 , H01R4/028 , H01R13/03 , H01R2201/02 , H01R2201/26 , H05B2203/016
摘要： The present invention relates to a disk with an electrical connection element, having a substrate with a first coefficient of thermal expansion, an electrically conductive structure on a region of the substrate, and a connection element with a second coefficient of thermal expansion.
摘要翻译： 本发明涉及具有电连接元件的盘，具有第一热膨胀系数的衬底，在衬底的区域上的导电结构以及具有第二热膨胀系数的连接元件。
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公开(公告)号：US20120298416A1
公开(公告)日：2012-11-29
申请号：US13575566
申请日：2011-02-15
CPC分类号： H05B3/84 , B23K35/262 , B23K35/264 , B32B15/018 , C22C12/00 , C22C13/00 , C22C38/08 , C22C38/10 , H01R4/028 , H01R13/03 , H01R2201/02 , H01R2201/26 , H05B2203/016
摘要： A pane with an electrical connection element is described, including a substrate made of glass with a first coefficient of thermal expansion, an electrically conductive structure with a layer thickness of 5 μm to 40 μm on a region of the substrate, a connection element with a second coefficient of thermal expansion, and a layer of a solder material that connects the connection element electrically to subregions of the electrically conductive structure.
摘要翻译： 描述了具有电连接元件的窗格，包括由第一热膨胀系数的玻璃制成的基板，在基板的区域上具有5μm至40μm的层厚度的导电结构，具有 第二热膨胀系数，以及将连接元件电连接到导电结构的子区域的焊料材料层。
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公开(公告)号：US20120318566A1
公开(公告)日：2012-12-20
申请号：US13580741
申请日：2011-02-15
CPC分类号： H05B3/84 , B23K35/262 , B23K35/264 , B32B15/018 , C22C12/00 , C22C13/00 , C22C38/08 , C22C38/10 , H01R4/028 , H01R13/03 , H01R2201/02 , H01R2201/26 , H05B2203/016
摘要： The present invention relates to a disk with an electrical connection element, having a substrate with a first coefficient of thermal expansion, an electrically conductive structure on a region of the substrate, and a connection element with a second coefficient of thermal expansion.
摘要翻译： 本发明涉及具有电连接元件的盘，具有第一热膨胀系数的衬底，在衬底的区域上的导电结构以及具有第二热膨胀系数的连接元件。
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公开(公告)号：US08816214B2
公开(公告)日：2014-08-26
申请号：US13575566
申请日：2011-02-15
IPC分类号： H05K1/03 , H05K1/09 , C22C38/08 , C22C13/00 , B23K35/26 , C22C12/00 , H05B3/84 , C22C38/10 , B32B15/01 , H01R13/03 , H01R4/02
CPC分类号： H05B3/84 , B23K35/262 , B23K35/264 , B32B15/018 , C22C12/00 , C22C13/00 , C22C38/08 , C22C38/10 , H01R4/028 , H01R13/03 , H01R2201/02 , H01R2201/26 , H05B2203/016
摘要： A pane with an electrical connection element is described, including a substrate made of glass with a first coefficient of thermal expansion, an electrically conductive structure with a layer thickness of 5 μm to 40 μm on a region of the substrate, a connection element with a second coefficient of thermal expansion, and a layer of a solder material that connects the connection element electrically to subregions of the electrically conductive structure.
摘要翻译： 描述了具有电连接元件的窗格，包括由第一热膨胀系数的玻璃制成的基板，在基板的区域上具有5μm至40μm的层厚度的导电结构，具有 第二热膨胀系数，以及将连接元件电连接到导电结构的子区域的焊料材料层。
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公开(公告)号：US20120205152A1
公开(公告)日：2012-08-16
申请号：US13501452
申请日：2010-12-03
CPC分类号： H05B3/84 , H05B2203/016 , Y10T29/49117
摘要： The invention relates to a pane, wherein an electrically conductive structure is applied to a glass pane. At least one intermediate layer is applied to the electrically conductive structure, at least one electrical connecting element is attached to the intermediate layer, and the intermediate layer, electrical connecting element and electrically conductive structure form at least one hollow space comprising an electrically conductive mass. A method for the production and use thereof is also described.
摘要翻译： 本发明涉及一种窗格，其中将导电结构施加到玻璃板上。 至少一个中间层施加到导电结构，至少一个电连接元件附接到中间层，并且中间层，电连接元件和导电结构形成至少一个包含导电块的中空空间。 还描述了其生产和使用的方法。
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公开(公告)号：US20140158424A1
公开(公告)日：2014-06-12
申请号：US14125904
申请日：2012-05-29
IPC分类号： H01R4/02
CPC分类号： H01R4/02 , B23K1/0008 , B23K1/19 , B23K35/0244 , B23K35/26 , B23K35/36 , B23K35/362 , B23K35/40 , B23K2101/006 , C22C12/00 , C22C13/00 , C22C38/18 , H01R43/0256 , H05B3/84 , H05B2203/016
摘要： A method of producing a pane having at least one electrical connection element is described. The method includes: applying soldering compound to at least one contact face of the connection element, arranging the connection element over the soldering compound on a region of an electrically conductive structure on a substrate, and connecting the connection element to the electrically conductive structure by means of the soldering compound with introduction of heat.
摘要翻译： 描述了生产具有至少一个电连接元件的窗格的方法。 该方法包括：将焊接化合物施加到连接元件的至少一个接触面上，将连接元件布置在焊接化合物上的导电结构的区域上，并将连接元件连接到导电结构上 的焊接化合物引入热量。
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公开(公告)号：US10355378B2
公开(公告)日：2019-07-16
申请号：US14115844
申请日：2012-04-17
摘要： A pane having at least one electrical connection element is described. The pane has a substrate, an electrically conductive structure on a region of the substrate, a layer of a solder material on a region of the electrically conductive structure, and at least two soldering points of a connection element on the solder material. The at least two soldering points define at least one contact surface between the connection element and the electrically conductive structure, and a shape of the at least one contact surface has at least one segment of an oval, an ellipse, or a circle with a central angle α of at least 90°.
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公开(公告)号：US09425517B2
公开(公告)日：2016-08-23
申请号：US14125904
申请日：2012-05-29
IPC分类号： H01R4/02 , B23K1/00 , B23K35/26 , B23K35/40 , H05B3/84 , B23K35/36 , B23K35/362 , B23K35/02 , H01R43/02 , B23K1/19 , C22C12/00 , C22C13/00 , C22C38/18
CPC分类号： H01R4/02 , B23K1/0008 , B23K1/19 , B23K35/0244 , B23K35/26 , B23K35/36 , B23K35/362 , B23K35/40 , B23K2101/006 , C22C12/00 , C22C13/00 , C22C38/18 , H01R43/0256 , H05B3/84 , H05B2203/016
摘要： A method of producing a pane having at least one electrical connection element is described. The method includes: applying soldering compound to at least one contact face of the connection element, arranging the connection element over the soldering compound on a region of an electrically conductive structure on a substrate, and connecting the connection element to the electrically conductive structure by means of the soldering compound with introduction of heat.
摘要翻译： 描述了生产具有至少一个电连接元件的窗格的方法。 该方法包括：将焊接化合物施加到连接元件的至少一个接触面上，将连接元件布置在焊接化合物上的导电结构的区域上，并将连接元件连接到导电结构上 的焊接化合物引入热量。
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公开(公告)号：US20140182932A1
公开(公告)日：2014-07-03
申请号：US14115091
申请日：2012-04-17
申请人： Harald Cholewa , Christoph Degen , Bernhard Reul , Mitja Rateiczak , Andreas Schlarb , Lothar Lesmeister
发明人： Harald Cholewa , Christoph Degen , Bernhard Reul , Mitja Rateiczak , Andreas Schlarb , Lothar Lesmeister
IPC分类号： H01R4/02
CPC分类号： H01R4/02 , H01L2924/0002 , H05B3/84 , H05B2203/016 , H05K3/3463 , H05K3/3494 , H05K3/4015 , H05K2201/1028 , H05K2201/1031 , H05K2203/0465 , Y02P70/611 , H01L2924/0001
摘要： A disk having at least one electric connecting element is described. The disk has a substrate, an electrically conductive structure on a region of the substrate, a connecting element containing at least chromium-containing steel, and a layer of a soldering compound that electrically connects the connecting element to sub-regions of the electrically conductive structure.
摘要翻译： 描述具有至少一个电连接元件的盘。 盘具有基板，在基板的区域上的导电结构，至少含有含铬钢的连接元件和将连接元件电连接到导电结构的子区域的焊料化合物层 。
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