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公开(公告)号：US20140182932A1
公开(公告)日：2014-07-03
申请号：US14115091
申请日：2012-04-17
申请人： Harald Cholewa , Christoph Degen , Bernhard Reul , Mitja Rateiczak , Andreas Schlarb , Lothar Lesmeister
发明人： Harald Cholewa , Christoph Degen , Bernhard Reul , Mitja Rateiczak , Andreas Schlarb , Lothar Lesmeister
IPC分类号： H01R4/02
CPC分类号： H01R4/02 , H01L2924/0002 , H05B3/84 , H05B2203/016 , H05K3/3463 , H05K3/3494 , H05K3/4015 , H05K2201/1028 , H05K2201/1031 , H05K2203/0465 , Y02P70/611 , H01L2924/0001
摘要： A disk having at least one electric connecting element is described. The disk has a substrate, an electrically conductive structure on a region of the substrate, a connecting element containing at least chromium-containing steel, and a layer of a soldering compound that electrically connects the connecting element to sub-regions of the electrically conductive structure.
摘要翻译： 描述具有至少一个电连接元件的盘。 盘具有基板，在基板的区域上的导电结构，至少含有含铬钢的连接元件和将连接元件电连接到导电结构的子区域的焊料化合物层 。
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公开(公告)号：US09385437B2
公开(公告)日：2016-07-05
申请号：US13695426
申请日：2011-07-04
申请人： Harald Cholewa , Andreas Schlarb , Lothar Lesmeister , Mitja Rateiczak , Bernhard Reul , Lothar Schmidt
发明人： Harald Cholewa , Andreas Schlarb , Lothar Lesmeister , Mitja Rateiczak , Bernhard Reul , Lothar Schmidt
IPC分类号： H01R4/02 , H01R43/20 , B23K1/002 , B23K35/36 , H01R43/16 , B23K1/06 , H05B3/84 , B23K35/26 , H05K3/34
CPC分类号： H05K1/0306 , B23K1/002 , B23K1/06 , B23K35/262 , B23K35/264 , B23K35/36 , H01R4/02 , H01R4/023 , H01R43/16 , H01R43/20 , H05B3/84 , H05B2203/016 , H05B2203/017 , H05K1/09 , H05K1/11 , H05K3/341 , H05K2201/02 , H05K2201/068
摘要： A pane with an electrical connection element is described. The pane can have a glass substrate and an electrically conductive structure on the substrate. Solder material can be used to electrically connect a connection element to the electrically conductive structure.
摘要翻译： 描述具有电连接元件的窗格。 该玻璃板可以在基板上具有玻璃基板和导电结构。 焊料可用于将连接元件电连接到导电结构。
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公开(公告)号：US20130043066A1
公开(公告)日：2013-02-21
申请号：US13695426
申请日：2011-07-04
申请人： Harald Cholewa , Andreas Schlarb , Lothar Lesmeister , Mitja Rateiczak , Bernhard Reul , Lothar Schmidt
发明人： Harald Cholewa , Andreas Schlarb , Lothar Lesmeister , Mitja Rateiczak , Bernhard Reul , Lothar Schmidt
CPC分类号： H05K1/0306 , B23K1/002 , B23K1/06 , B23K35/262 , B23K35/264 , B23K35/36 , H01R4/02 , H01R4/023 , H01R43/16 , H01R43/20 , H05B3/84 , H05B2203/016 , H05B2203/017 , H05K1/09 , H05K1/11 , H05K3/341 , H05K2201/02 , H05K2201/068
摘要： The present invention relates to a pane with an electrical connection element, comprising: a substrate made of glass (1), an electrically conductive structure (2) with a layer thickness of 5 μm to 40 μm on a region of the substrate (1), a connection element (3), and a layer of a solder material (4), which electrically connects the connection element (3) to a portion (12) of the electrically conductive structure (2), wherein the connection element (3) contains at least an iron-nickel alloy or an iron-nickel-cobalt alloy, the connection element (3) is connected to the portion (12) of the electrically conductive structure (2) via a contact surface (11) over its entire surface, and the contact surface (11) has no corners.
摘要翻译： 本发明涉及具有电连接元件的窗格，包括：由玻璃（1）制成的基板，在基板（1）的区域上具有5μm至40μm层厚度的导电结构（2） ，连接元件（3）和将所述连接元件（3）电连接到所述导电结构（2）的部分（12）的焊料材料层（4），其中所述连接元件（3） 至少含有铁 - 镍合金或铁 - 镍 - 钴合金，所述连接元件（3）通过其整个表面上的接触表面（11）连接到所述导电结构（2）的所述部分（12） ，并且接触面（11）没有角部。
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公开(公告)号：US10355378B2
公开(公告)日：2019-07-16
申请号：US14115844
申请日：2012-04-17
摘要： A pane having at least one electrical connection element is described. The pane has a substrate, an electrically conductive structure on a region of the substrate, a layer of a solder material on a region of the electrically conductive structure, and at least two soldering points of a connection element on the solder material. The at least two soldering points define at least one contact surface between the connection element and the electrically conductive structure, and a shape of the at least one contact surface has at least one segment of an oval, an ellipse, or a circle with a central angle α of at least 90°.
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公开(公告)号：US20140110166A1
公开(公告)日：2014-04-24
申请号：US14115844
申请日：2012-04-17
IPC分类号： H01R4/62
CPC分类号： H01R4/62 , H01R4/02 , H05B3/84 , H05B2203/016 , Y10T29/49128
摘要： A pane having at least one electrical connection element is described. The pane has a substrate, an electrically conductive structure on a region of the substrate, a layer of a solder material on a region of the electrically conductive structure, and at least two soldering points of a connection element on the solder material. The at least two soldering points define at least one contact surface between the connection element and the electrically conductive structure, and a shape of the at least one contact surface has at least one segment of an oval, an ellipse, or a circle with a central angle α of at least 90°.
摘要翻译： 描述具有至少一个电连接元件的窗格。 所述窗格具有基板，在所述基板的区域上的导电结构，所述导电结构的区域上的焊料层，以及所述焊料材料上的连接元件的至少两个焊接点。 所述至少两个焊接点限定所述连接元件和所述导电结构之间的至少一个接触表面，并且所述至少一个接触表面的形状具有椭圆形，椭圆形或具有中心的圆形的至少一个部分 角度α至少为90°。
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公开(公告)号：US20130319518A1
公开(公告)日：2013-12-05
申请号：US13878174
申请日：2011-10-24
申请人： Matthias Doech , Christoph Degen , Robert Gass , Thomas Happ , Franz Karg , Lothar Lesmeister , Jan Boris Philipp , Mitja Rateiczak , Jaap Van Der Burgt , Andreas Schlarb , Bernhard Reul
发明人： Matthias Doech , Christoph Degen , Robert Gass , Thomas Happ , Franz Karg , Lothar Lesmeister , Jan Boris Philipp , Mitja Rateiczak , Jaap Van Der Burgt , Andreas Schlarb , Bernhard Reul
IPC分类号： H01L31/0224
CPC分类号： H01L31/022441 , H01L31/02008 , H02S40/34 , Y02E10/50
摘要： A solar module having a connecting element is described. The solar module has a substrate, a back electrode layer, a photovoltaically active absorber layer, and a cover pane disposed one over the other, at least one prefabricated conductive film at least one connection housing.
摘要翻译： 描述具有连接元件的太阳能模块。 太阳能组件具有基板，背面电极层，光伏活性吸收层和一个彼此重叠设置的至少一个预制导电膜，至少一个连接壳体。
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公开(公告)号：US10305239B2
公开(公告)日：2019-05-28
申请号：US14115839
申请日：2012-04-17
IPC分类号： H01R13/02 , H01R43/02 , H05B3/84 , H01R13/03 , B23K1/00 , B23K1/002 , B23K1/005 , B23K1/012 , B23K1/06 , B23K33/00 , H05K1/09 , H05K1/11 , H01R4/02 , B23K101/00 , B23K101/38 , B23K103/04 , B23K103/12 , H01R12/57 , H01R101/00
摘要： A pane provided with at least one electrical connection element is described. The pane has a substrate, an electroconductive structure on a region of the substrate, a layer of soldering mass on a region of the electroconductive structure, and a connection element on the solder mass. The connection element contains a first and a second base region, a first and a second transition region, and a bridge region between the first and the second transition region, a first and a second contact surface arranged on a lower side of the first and second base regions. The first and the second contact surfaces and surfaces of the first and the second transition regions, facing the substrate are connected to the electroconductive structure by the solder mass. An angle between a surface of the substrate and each tangential plane of the surfaces of the first and the second transition region, facing the substrate, is less than 90°.
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公开(公告)号：US20140170913A1
公开(公告)日：2014-06-19
申请号：US14115839
申请日：2012-04-17
CPC分类号： H01R43/0235 , B23K1/0004 , B23K1/002 , B23K1/0056 , B23K1/012 , B23K1/06 , B23K33/00 , B23K2101/006 , B23K2101/38 , B23K2103/05 , B23K2103/12 , H01R4/02 , H01R4/023 , H01R4/029 , H01R12/57 , H01R13/03 , H01R43/0207 , H01R43/0242 , H01R2101/00 , H05B3/84 , H05B2203/016 , H05K1/09 , H05K1/11 , Y10T29/49213
摘要： A pane provided with at least one electrical connection element is described. The pane has a substrate, an electroconductive structure on a region of the substrate, a layer of soldering mass on a region of the electroconductive structure, and a connection element on the solder mass. The connection element contains a first and a second base region, a first and a second transition region, and a bridge region between the first and the second transition region, a first and a second contact surface arranged on a lower side of the first and second base regions. The first and the second contact surfaces and surfaces of the first and the second transition regions, facing the substrate are connected to the electroconductive structure by the solder mass. An angle between a surface of the substrate and each tangential plane of the surfaces of the first and the second transition region, facing the substrate, is less than 90°.
摘要翻译： 描述了具有至少一个电连接元件的窗格。 该玻璃板具有衬底，在衬底的区域上的导电结构，在导电结构的区域上的焊料层，以及焊料块上的连接元件。 连接元件包括第一和第二基极区域，第一和第二过渡区域以及第一和第二过渡区域之间的桥接区域，布置在第一和第二过渡区域的下侧的第一和第二接触表面 基地区。 面向衬底的第一和第二过渡区域的第一和第二接触表面和表面通过焊料块连接到导电结构。 基板的表面与面向基板的第一和第二过渡区域的表面的每个切向平面之间的角度小于90°。
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公开(公告)号：US20140158424A1
公开(公告)日：2014-06-12
申请号：US14125904
申请日：2012-05-29
IPC分类号： H01R4/02
CPC分类号： H01R4/02 , B23K1/0008 , B23K1/19 , B23K35/0244 , B23K35/26 , B23K35/36 , B23K35/362 , B23K35/40 , B23K2101/006 , C22C12/00 , C22C13/00 , C22C38/18 , H01R43/0256 , H05B3/84 , H05B2203/016
摘要： A method of producing a pane having at least one electrical connection element is described. The method includes: applying soldering compound to at least one contact face of the connection element, arranging the connection element over the soldering compound on a region of an electrically conductive structure on a substrate, and connecting the connection element to the electrically conductive structure by means of the soldering compound with introduction of heat.
摘要翻译： 描述了生产具有至少一个电连接元件的窗格的方法。 该方法包括：将焊接化合物施加到连接元件的至少一个接触面上，将连接元件布置在焊接化合物上的导电结构的区域上，并将连接元件连接到导电结构上 的焊接化合物引入热量。
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公开(公告)号：US09425517B2
公开(公告)日：2016-08-23
申请号：US14125904
申请日：2012-05-29
IPC分类号： H01R4/02 , B23K1/00 , B23K35/26 , B23K35/40 , H05B3/84 , B23K35/36 , B23K35/362 , B23K35/02 , H01R43/02 , B23K1/19 , C22C12/00 , C22C13/00 , C22C38/18
CPC分类号： H01R4/02 , B23K1/0008 , B23K1/19 , B23K35/0244 , B23K35/26 , B23K35/36 , B23K35/362 , B23K35/40 , B23K2101/006 , C22C12/00 , C22C13/00 , C22C38/18 , H01R43/0256 , H05B3/84 , H05B2203/016
摘要： A method of producing a pane having at least one electrical connection element is described. The method includes: applying soldering compound to at least one contact face of the connection element, arranging the connection element over the soldering compound on a region of an electrically conductive structure on a substrate, and connecting the connection element to the electrically conductive structure by means of the soldering compound with introduction of heat.
摘要翻译： 描述了生产具有至少一个电连接元件的窗格的方法。 该方法包括：将焊接化合物施加到连接元件的至少一个接触面上，将连接元件布置在焊接化合物上的导电结构的区域上，并将连接元件连接到导电结构上 的焊接化合物引入热量。
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