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    PAD CONDITIONER OF SEMICONDUCTOR WAFER POLISHING APPARATUS AND MANUFACTURING METHOD THEREOF
    1.
    发明申请
    PAD CONDITIONER OF SEMICONDUCTOR WAFER POLISHING APPARATUS AND MANUFACTURING METHOD THEREOF 审中-公开
    半导体波形抛光装置的PAD调节器及其制造方法

    公开(公告)号：US20090042494A1

    公开(公告)日：2009-02-12

    申请号：US12187007

    申请日：2008-08-06

    申请人： Sung-Taek Moon ,  Kyoung-Moon Kang ,  Bong-Su Ahn ,  Nam-Soo Kim ,  Gi-Sik Hong

    发明人： Sung-Taek Moon ,  Kyoung-Moon Kang ,  Bong-Su Ahn ,  Nam-Soo Kim ,  Gi-Sik Hong

    IPC分类号： B24B53/02 ,  B24D18/00 ,  C25D9/04 ,  B24B53/00

    CPC分类号： C25D7/00 ,  B24B53/017 ,  B24B53/02 ,  B24D18/0018 ,  C23C26/00 ,  C25D13/02

    摘要： A pad conditioner of semiconductor wafer polishing apparatus and a pad conditioner manufacturing method thereof are provided with a uniform conditioning for a polishing pad of a polishing apparatus, the polishing apparatus being for evenly planarizing a metal layer formed on the surface of wafer in a semiconductor device manufacturing processor. The pad conditioner may include a substrate constructed of a flat plate of disk shape, a coating part formed with a given thickness on the substrate, and a plurality of protrusion parts formed on the coating part, the plurality of protrusion parts having a plurality of polishing members based on the same size in a predetermined grouping or pattern.

    摘要翻译： 半导体晶片抛光装置的垫调节器及其垫调节器的制造方法为研磨装置的抛光垫设置均匀的调理装置，该抛光装置用于在半导体装置中均匀地平坦化形成在晶片表面上的金属层 制造处理器。 垫调节器可以包括由盘形平板，在基板上形成给定厚度的涂层部分和形成在涂层部分上的多个突起部分构成的基板，所述多个突出部分具有多个抛光 基于相同尺寸的成员以预定的分组或模式。

    Pad conditioner for chemical mechanical polishing apparatus
    5.
    发明申请
    Pad conditioner for chemical mechanical polishing apparatus 有权
    化学机械抛光装置垫垫调节剂

    公开(公告)号：US20060199482A1

    公开(公告)日：2006-09-07

    申请号：US11368704

    申请日：2006-03-07

    申请人： Sung-Taek Moon ,  Dong-Jun Lee ,  Jae-Hyun So ,  Kyoung-Moon Kang ,  Bong-Su Ahn

    发明人： Sung-Taek Moon ,  Dong-Jun Lee ,  Jae-Hyun So ,  Kyoung-Moon Kang ,  Bong-Su Ahn

    IPC分类号： B24B29/00

    CPC分类号： B24B53/017 ,  B24D7/14

    摘要： A pad conditioner may include a surface having a first region including a portion having relatively irregular shaped and friable polishing particles, and a second region including a portion having relatively regular shaped and tough polishing particles. The relatively regular shaped and tough polishing particles may be provided on the edge portion of the surface and the relatively irregular shaped and friable polishing particles may be provided on the center portion of the surface.

    摘要翻译： 垫调节剂可以包括具有包括具有相对不规则形状和易碎的抛光颗粒的部分的第一区域的表面，以及包括具有相对规则形状和韧性抛光颗粒的部分的第二区域。 可以在表面的边缘部分设置相对规则形状和韧性的抛光颗粒，并且可以在表面的中心部分上设置相对不规则形状且易碎的抛光颗粒。

    Polishing pad, method of manufacturing the polishing pad, and chemical mechanical polishing apparatus comprising the polishing pad
    6.
    发明申请
    Polishing pad, method of manufacturing the polishing pad, and chemical mechanical polishing apparatus comprising the polishing pad 审中-公开
    研磨垫，抛光垫的制造方法以及包含该抛光垫的化学机械抛光装置

    公开(公告)号：US20070037486A1

    公开(公告)日：2007-02-15

    申请号：US11500512

    申请日：2006-08-08

    申请人： Kyoung-Moon Kang ,  Bong-Su Ahn ,  Dong-Jun Lee ,  Nam-Soo Kim ,  Jae-Hyun So

    发明人： Kyoung-Moon Kang ,  Bong-Su Ahn ,  Dong-Jun Lee ,  Nam-Soo Kim ,  Jae-Hyun So

    IPC分类号： B24B51/00 ,  B24B7/30 ,  B24B29/00

    CPC分类号： B24B37/26 ,  B24D7/14

    摘要： A polishing pad of a CMP apparatus has a plurality of pores. A characteristic associated with the pores, such as average size or pore density, varies substantially from region to region of the pad across the pad in a diametral direction of the pad. The polishing pad can be designed and manufactured using sample pads whose pore characteristics differ from each other. CMP test processes are performed in which the sample pads are used to polish test wafers, and the rates at which the test wafers are polished are measured and stored in a database. The polishing pad is fabricated using data from the database so that a chemical mechanical polishing apparatus employing the pad will polish wafers with a high degree of uniformity. The database can be used to select sample pads from a stockpile. Sections of the sample pads are cut out, respectively, and fastened to one another.

    摘要翻译： CMP设备的抛光垫具有多个孔。 与孔相关的特征，例如平均尺寸或孔密度，在焊盘的沿直径方向穿过焊盘的区域与区域之间显着变化。 可以使用其孔特性彼此不同的样品垫来设计和制造抛光垫。 进行CMP测试过程，其中使用样品垫来抛光测试晶片，并测量抛光测试晶片的速率并将其存储在数据库中。 使用来自数据库的数据制造抛光垫，使得使用该垫的化学机械抛光装置将以高度均匀度抛光晶片。 数据库可用于从库存中选择样品垫。 样品垫的切片分别切割并彼此紧固。

    Conditioner device for conditioning polishing pad and chemical mechanical polishing apparatus including the same
    7.
    发明授权
    Conditioner device for conditioning polishing pad and chemical mechanical polishing apparatus including the same 有权
    用于调理抛光垫的调节装置和包括其的化学机械抛光装置

    公开(公告)号：US07578727B2

    公开(公告)日：2009-08-25

    申请号：US11466425

    申请日：2006-08-22

    申请人： Sung-Tae Moon ,  Dong-Jun Lee ,  Kyoung-Moon Kang ,  Nam-Soo Kim ,  Bong-Su Ahn

    发明人： Sung-Tae Moon ,  Dong-Jun Lee ,  Kyoung-Moon Kang ,  Nam-Soo Kim ,  Bong-Su Ahn

    IPC分类号： B24B53/00

    CPC分类号： B24B53/017 ,  B24B53/14

    摘要： The present invention relates to a conditioner device for polishing pad and a chemical mechanical polishing (CMP) apparatus having the same. The conditioner device of the present invention comprises a rotable support plate including a support plate surface comprising a center area located about the rotational axis of the support plate, a mid area surrounding the center area, and a peripheral area surrounding the mid area, a plurality of conditioning zones located within a portion of the mid area of the support plate surface. A plurality of hard particles which are densely arranged within the conditioning zones and are attached to the support plate surface. A plurality of passages defined by the conditioning zones within which a slurry flows, the passages occupying a portion of the mid area which is not occupied by the conditioning zones, the center area and the peripheral area.

    摘要翻译： 本发明涉及一种用于抛光垫的调节装置和具有该抛光垫的化学机械抛光（CMP）装置。 本发明的调节装置包括可旋转的支撑板，其包括支撑板表面，该支撑板表面包括围绕支撑板的旋转轴线的中心区域，围绕中心区域的中间区域和围绕中间区域的周边区域，多个 位于支撑板表面的中部区域的一部分内的调理区。 多个坚硬颗粒密集地布置在调理区内并附着在支撑板表面上。 由浆料流过的调节区限定的多个通道，通道占据中部区域的未被调节区域，中心区域和周边区域占据的部分。

    Pad conditioner for chemical mechanical polishing apparatus
    8.
    发明授权
    Pad conditioner for chemical mechanical polishing apparatus 有权
    化学机械抛光装置垫垫调节剂

    公开(公告)号：US07261621B2

    公开(公告)日：2007-08-28

    申请号：US11368704

    申请日：2006-03-07

    申请人： Sung-Taok Moon ,  Dong-Jun Lee ,  Jae-Hyun So ,  Kyoung-Moon Kang ,  Bong-Su Ahn

    发明人： Sung-Taok Moon ,  Dong-Jun Lee ,  Jae-Hyun So ,  Kyoung-Moon Kang ,  Bong-Su Ahn

    IPC分类号： B24B19/00 ,  B24B21/18

    CPC分类号： B24B53/017 ,  B24D7/14

    摘要： A pad conditioner may include a surface having a first region including a portion having relatively irregular shaped and friable polishing particles, and a second region including a portion having relatively regular shaped and tough polishing particles. The relatively regular shaped and tough polishing particles may be provided on the edge portion of the surface and the relatively irregular shaped and friable polishing particles may be provided on the center portion of the surface.

    摘要翻译： 垫调节剂可以包括具有包括具有相对不规则形状和易碎的抛光颗粒的部分的第一区域的表面，以及包括具有相对规则形状和韧性抛光颗粒的部分的第二区域。 可以在表面的边缘部分设置相对规则形状和韧性的抛光颗粒，并且可以在表面的中心部分上设置相对不规则形状且易碎的抛光颗粒。

    Slurry composition, method of polishing an object layer and method of manufacturing a non-volatile memory device using the slurry composition
    9.
    发明申请
    Slurry composition, method of polishing an object layer and method of manufacturing a non-volatile memory device using the slurry composition 审中-公开
    浆料组合物，抛光物体层的方法和使用该浆料组合物制造非易失性存储器件的方法

    公开(公告)号：US20070281486A1

    公开(公告)日：2007-12-06

    申请号：US11809672

    申请日：2007-06-01

    申请人： Eui-Jin Han ,  Nam-Soo Kim ,  Bong-Su Ahn ,  Dong-Jun Lee

    发明人： Eui-Jin Han ,  Nam-Soo Kim ,  Bong-Su Ahn ,  Dong-Jun Lee

    IPC分类号： H01L21/461 ,  H01L21/302

    CPC分类号： H01L21/76819 ,  C09G1/02 ,  H01L21/31053 ,  H01L27/115 ,  H01L27/11521

    摘要： Methods of polishing an object layer and for manufacturing a non-volatile memory device that incorporates such a polished object layer using a specially formulated slurry composition are disclosed. The slurry compositions include a ceria abrasive, a nonionic surfactant having a hydrophilic-lipophilic balance (HLB) value in a range of about 12 to about 17, and water. The nonionic surfactant is selected such that it may be adsorbed onto a hydrophobic layer to protect the hydrophobic layer from the ceria abrasive during a polishing operation. The slurry compositions may have a relatively high polishing rate for a hydrophilic layer and at the same time a relatively low polishing rate for a hydrophobic layer. Thus, the slurry compositions may be applied during a process for polishing the hydrophilic layer using the hydrophobic layer as a polishing stop layer.

    摘要翻译： 公开了抛光目标层和用于制造使用特别配制的浆料组合物并入这种抛光对象层的非易失性存储器件的方法。 浆料组合物包括二氧化铈磨料，亲水 - 亲油平衡（HLB）值在约12至约17的范围内的非离子表面活性剂和水。 选择非离子表面活性剂，使得其可以在抛光操作期间吸附到疏水层上以保护疏水层免受二氧化铈磨料的侵蚀。 该浆料组合物可以具有相对较高的抛光速率，对于亲水层，同时对疏水层具有较低的抛光速率。 因此，可以在使用疏水层作为抛光停止层的亲水层的抛光工艺期间施加浆料组合物。