PAD CONDITIONER OF SEMICONDUCTOR WAFER POLISHING APPARATUS AND MANUFACTURING METHOD THEREOF
    2.
    发明申请
    PAD CONDITIONER OF SEMICONDUCTOR WAFER POLISHING APPARATUS AND MANUFACTURING METHOD THEREOF 审中-公开
    半导体波形抛光装置的PAD调节器及其制造方法

    公开(公告)号:US20090042494A1

    公开(公告)日:2009-02-12

    申请号:US12187007

    申请日:2008-08-06

    摘要: A pad conditioner of semiconductor wafer polishing apparatus and a pad conditioner manufacturing method thereof are provided with a uniform conditioning for a polishing pad of a polishing apparatus, the polishing apparatus being for evenly planarizing a metal layer formed on the surface of wafer in a semiconductor device manufacturing processor. The pad conditioner may include a substrate constructed of a flat plate of disk shape, a coating part formed with a given thickness on the substrate, and a plurality of protrusion parts formed on the coating part, the plurality of protrusion parts having a plurality of polishing members based on the same size in a predetermined grouping or pattern.

    摘要翻译: 半导体晶片抛光装置的垫调节器及其垫调节器的制造方法为研磨装置的抛光垫设置均匀的调理装置,该抛光装置用于在半导体装置中均匀地平坦化形成在晶片表面上的金属层 制造处理器。 垫调节器可以包括由盘形平板,在基板上形成给定厚度的涂层部分和形成在涂层部分上的多个突起部分构成的基板,所述多个突出部分具有多个抛光 基于相同尺寸的成员以预定的分组或模式。

    Slurry compositions and methods of polishing a layer using the slurry compositions
    5.
    发明授权
    Slurry compositions and methods of polishing a layer using the slurry compositions 有权
    浆料组合物和使用浆料组合物抛光层的方法

    公开(公告)号:US08314028B2

    公开(公告)日:2012-11-20

    申请号:US11853735

    申请日:2007-09-11

    IPC分类号: H01L21/461 C09K13/00

    摘要: In a slurry composition and a method of polishing a layer using the slurry composition, the slurry composition includes from about 3 to 20 percent by weight of an abrasive, from about 0.1 to 3 percent by weight of an ionic surfactant, from about 0.01 to 0.1 percent by weight of a nonionic surfactant, from about 0.01 to 1 percent by weight of a polish accelerating agent including an amino acid compound, and a remainder of an aqueous solution including a basic pH-controlling agent and water. The slurry composition including the nonionic surfactant and the polish accelerating agent may be used for speedily polishing a stepped upper portion of a silicon oxide layer, and may also enable a lower portion of the silicon oxide layer to function as a polish stop layer.

    摘要翻译: 在浆料组合物和使用浆料组合物抛光层的方法中,浆料组合物包括约3-20重量%的研磨剂,约0.1-3重量%的离子表面活性剂,约0.01至0.1重量% 重量百分比的非离子表面活性剂,约0.01至1%重量的包含氨基酸化合物的抛光促进剂,以及剩余的包含碱性pH控制剂和水的水溶液。 包括非离子表面活性剂和抛光促进剂的浆料组合物可以用于快速抛光氧化硅层的阶梯状上部,并且还可以使氧化硅层的下部用作抛光停止层。

    SLURRY COMPOSITIONS AND METHODS OF POLISHING A LAYER USING THE SLURRY COMPOSITIONS
    6.
    发明申请
    SLURRY COMPOSITIONS AND METHODS OF POLISHING A LAYER USING THE SLURRY COMPOSITIONS 有权
    浆料组合物和使用浆料组合物抛光层的方法

    公开(公告)号:US20080081542A1

    公开(公告)日:2008-04-03

    申请号:US11853735

    申请日:2007-09-11

    IPC分类号: B24B29/02 B24D3/04

    摘要: In a slurry composition and a method of polishing a layer using the slurry composition, the slurry composition includes from about 3 to 20 percent by weight of an abrasive, from about 0.1 to 3 percent by weight of an ionic surfactant, from about 0.01 to 0.1 percent by weight of a nonionic surfactant, from about 0.01 to 1 percent by weight of a polish accelerating agent including an amino acid compound, and a remainder of an aqueous solution including a basic pH-controlling agent and water. The slurry composition including the nonionic surfactant and the polish accelerating agent may be used for speedily polishing a stepped upper portion of a silicon oxide layer, and may also enable a lower portion of the silicon oxide layer to function as a polish stop layer.

    摘要翻译: 在浆料组合物和使用浆料组合物抛光层的方法中,浆料组合物包括约3-20重量%的研磨剂,约0.1-3重量%的离子表面活性剂,约0.01至0.1重量% 重量百分比的非离子表面活性剂,约0.01至1%重量的包含氨基酸化合物的抛光促进剂,以及剩余的包含碱性pH控制剂和水的水溶液。 包括非离子表面活性剂和抛光促进剂的浆料组合物可以用于快速抛光氧化硅层的阶梯状上部,并且还可以使氧化硅层的下部用作抛光停止层。