摘要:
A memory cell of EEPROM having a floating gate, a control gate, a drain region, and a source region is formed on a silicon substrate. Thereafter, a BPSG film (interlayer insulating film) covering the memory cell is formed by CVD. After a wire including a bit line, an SiON film (passivation film), covering the silicon substrate and serving as an uppermost layer, is formed on an upper portion of the silicon substrate. Thereafter, annealing is performed to discharge water in the BPSG film to an outer portion of an LSI. The annealing is performed under a condition satisfying the following equation of t≧7.86×10−11×L2×exp (9115/T) where t is anneal time (minutes), L is a thickness (nm) of the passivation film, and T is anneal temperature (absolute temperature). Thereby, an amount of electronic trap in a gate oxide film of the transistor can be reduced.
摘要:
A semiconductor device includes an element isolation insulating film, memory cell transistors formed in an element isolation region and having respective gate electrodes, and a stopper film for forming a contact, formed both on a sidewall of the gate electrode of each transistor and on the element isolation insulating film between the gate electrodes. A level difference is set between the upper surface of the element isolation insulating film and the upper surface of the semiconductor substrate in the element isolation region. The level difference is set so that a level difference between the gate electrodes is smaller than a level difference in the gate electrode. Furthermore, the surface of the semiconductor substrate in the drain contact formation region is located lower than the surface of the semiconductor substrate corresponding to the gate electrode.
摘要:
A plurality of nonvolatile memory elements formed on element regions respectively isolated by element isolation regions on a main surface of a first conductive type semiconductor substrate, the nonvolatile semiconductor memory elements comprising a gate insulating film formed on the main surface of the semiconductor substrate, a plurality of floating electrodes formed along a first direction on the gate insulating film, a plurality of grooves formed among the plurality of floating electrodes, groove insulating films filled in the plurality of the grooves, a second conductive type impurity diffusion region formed along a second direction so as to sandwich the floating electrodes, interelectrode insulating films formed along the first direction on the plurality of floating electrodes and the groove insulating films, and control electrodes formed on the interelectrode insulating films.
摘要:
A semiconductor device includes an element isolation insulating film adjacent to an active area, a gate insulating film formed on a semiconductor substrate in the active area, paired gate electrodes located on the gate insulating film, a contact plug located on the active area between the gate electrodes, a pair of first upper lines located on the gate electrodes, a second upper line located on the gate electrodes, and a stopper film above upper surfaces of the gate electrodes and side surfaces of the gate electrodes. The element isolation insulating film has a first height of an upper surface thereof with reference to an upper surface of the semiconductor substrate and a second height of another upper surface thereof with reference to another upper surface of the semiconductor substrate. The first height is smaller than the second height.
摘要:
A plurality of nonvolatile memory elements formed on element regions respectively isolated by element isolation regions on a main surface of a first conductive type semiconductor substrate, the nonvolatile semiconductor memory elements comprising a gate insulating film formed on the main surface of the semiconductor substrate, a plurality of floating electrodes formed along a first direction on the gate insulating film, a plurality of grooves formed among the plurality of floating electrodes, groove insulating films filled in the plurality of the grooves, a second conductive type impurity diffusion region formed along a second direction so as to sandwich the floating electrodes, interelectrode insulating films formed along the first direction on the plurality of floating electrodes and the groove insulating films, and control electrodes formed on the interelectrode insulating films.
摘要:
Disclosure is semiconductor device of a selective gate region, comprising a semiconductor layer, a first insulating film formed on the semiconductor layer, a first electrode layer formed on the first insulating layer, an element isolating region comprising an element isolating insulating film formed to extend through the first electrode layer and the first insulating film to reach an inner region of the semiconductor layer, the element isolating region isolating a element region and being self-aligned with the first electrode layer, a second insulating film formed on the first electrode layer and the element isolating region, an open portion exposing a surface of the first electrode layer being formed in the second insulating film, and a second electrode layer formed on the second insulating film and the exposed surface of the first electrode layer, the second electrode layer being electronically connected to the first electrode layer via the open portion.
摘要:
The number of constituent parts for an oil filter fixing system such as a bracket, are reduced, and the oil leaks during filter element exchange are avoided. The oil filter fixing system comprises a V bank of a V type engine, a crankcase fixed with the V bank and an oil filter fixed with the crankcase. A horizontal fixing plane is formed at a part of an outer surface of the crankcase and the oil filter is directly fixed with and hung down from the horizontal plane. Further, the horizontal fixing plane is provided at an outer surface of the crankcase and moreover under a cam fixing portion provided in the crankcase. The oil filter is disposed in a space which is formed by the horizontal fixing plane and a lower vertical side surface of the crankcase.
摘要:
A method of manufacturing a nonvolatile semiconductor memory device including at least one MOS transistor in a peripheral circuit and also including forming a first well for a memory cell and a second well for the MOS transistor in a semiconductor substrate.
摘要:
Disclosure is semiconductor device of a selective gate region, comprising a semiconductor layer, a first insulating film formed on the semiconductor layer, a first electrode layer formed on the first insulating layer, an element isolating region comprising an element isolating insulating film formed to extend through the first electrode layer and the first insulating film to reach an inner region of the semiconductor layer, the element isolating region isolating a element region and being self-aligned with the first electrode layer, a second insulating film formed on the first electrode layer and the element isolating region, an open portion exposing a surface of the first electrode layer being formed in the second insulating film, and a second electrode layer formed on the second insulating film and the exposed surface of the first electrode layer, the second electrode layer being electronically connected to the first electrode layer via the open portion.
摘要:
A method of fabricating a nonvolatile semiconductor memory including the steps of: sequentially forming a gate insulating layer and a first conductive layer of a floating gate on a semiconductor substrate; depositing an inter-gate insulating layer; forming an opening in a part of the inter-gate insulating layer; depositing a control gate electrode on the inter-gate insulating layer and an exposed portion of the first conductive layer by the opening; and forming the gate electrodes of the memory cell transistors and the gate electrodes of the select transistors by utilizing the etching processes of the control gate electrode, the inter-gate insulating layer and the first conductive layer, wherein the select transistors include at least a part of the exposed portion of the first conductive layer.