公开(公告)号：US20190292429A1

公开(公告)日：2019-09-26

申请号：US16016660

申请日：2018-06-25

Applicant: TAIFLEX Scientific Co., Ltd.

Inventor： Hsiu-Ming Chang ,  Tsung-Tai Hung ,  Li-Jung Hsiao ,  Po-Wen Lin

IPC: C09J177/06 ,  C09J11/04 ,  C08K3/36 ,  C08K3/04 ,  C08G69/32 ,  C09J9/00

Abstract: A composition and a solution for temporary bonding are provided. The composition includes a dianhydride monomer, a light-absorbing monomer, and a light-absorbing material. The light-absorbing monomer includes at least one of N,N,N,N-(p-aminophenyl)-p-phenylenediamine (DPDA) and N,N-(p-aminophenyl)-p-phenylenediamine (TPDA). The light-absorbing material includes carbon black and silicon dioxide.

公开(公告)号：US20190103274A1

公开(公告)日：2019-04-04

申请号：US15826728

申请日：2017-11-30

Applicant: TAIFLEX Scientific Co., Ltd.

Inventor： Hsiu-Ming Chang ,  Po-Wen Lin ,  Tsung-Tai Hung

IPC: H01L21/263 ,  H01L27/15 ,  H01L21/67 ,  H01L33/00

Abstract: A method of transferring micro devices is provided. A carrier substrate having a first surface and a second surface opposite to each other is provided, wherein a plurality of micro devices is disposed on the first surface, and each micro device binds to the first surface through laser debonding gel. Next, a receiving substrate is subjected to be relatively closer to the first surface, and a mask is provided on the second surface. Afterwards, the second surface with the mask is irradiated with a laser light, so as to keep the micro devices without laser irradiation binding on the first surface, and the micro devices irradiated with the laser light lose adhesive force and transfer to the receiving substrate.

公开(公告)号：US20160286698A1

公开(公告)日：2016-09-29

申请号：US14714338

申请日：2015-05-17

Applicant: TAIFLEX Scientific Co., Ltd.

Inventor： Hsiu-Ming Chang ,  Po-Wen Lin ,  Ching-Wen Yu

IPC: H05K9/00 ,  H05K1/02 ,  B32B27/18 ,  B32B27/06 ,  B32B27/38

CPC classification number: H05K9/0083 ,  B32B5/30 ,  B32B7/06 ,  B32B7/12 ,  B32B25/02 ,  B32B27/08 ,  B32B27/14 ,  B32B27/20 ,  B32B27/26 ,  B32B27/38 ,  B32B2260/025 ,  B32B2260/046 ,  B32B2264/102 ,  B32B2264/105 ,  B32B2264/108 ,  B32B2307/206 ,  B32B2307/212 ,  B32B2307/306 ,  B32B2307/7242 ,  B32B2307/732 ,  B32B2307/748 ,  B32B2457/08 ,  H05K1/0216 ,  H05K1/0373 ,  H05K2201/0215

Abstract: An electromagnetic shielding film includes an insulation layer, and an electromagnetic shielding layer arranged at one side of the insulation layer. The electromagnetic shielding layer includes a polymer substrate and an electromagnetic shielding material. The polymer substrate has epoxy structures. The electromagnetic shielding material has a plurality of aculeate electromagnetic shielding microparticles dispersed in the polymer substrate.

Abstract translation: 电磁屏蔽膜包括绝缘层和布置在绝缘层一侧的电磁屏蔽层。 电磁屏蔽层包括聚合物基板和电磁屏蔽材料。 聚合物基材具有环氧结构。 电磁屏蔽材料具有分散在聚合物基板中的多个适当的电磁屏蔽微粒。