公开(公告)号：US20210202239A1

公开(公告)日：2021-07-01

申请号：US16727533

申请日：2019-12-26

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Hui-Chi Huang ,  Jeng-Chi Lin ,  Pin-Chuan Su ,  Chien-Ming Wang ,  Kei-Wei Chen

IPC: H01L21/02 ,  B08B7/04 ,  B08B1/00 ,  B08B1/04 ,  B08B3/08 ,  B08B5/04 ,  A46B13/04

Abstract: A tool and methods of removing films from bevel regions of wafers are disclosed. The bevel film removal tool includes an inner motor nested within an outer motor and a bevel brush secured to the outer motor. The bevel brush is adjustable radially outward to allow the wafer to be inserted in the bevel brush and to be secured to the inner motor. The bevel brush is adjustable radially inward to engage one or more sections of the bevel brush and to bring the bevel brush in contact with a bevel region of the wafer. Once engaged, a solution may be dispensed at the engaged sections of the bevel brush and the inner motor and the outer motor may be rotated such that the bevel brush is rotated against the wafer such that the bevel films of the wafer are both chemically and mechanically removed.

公开(公告)号：US20240395537A1

公开(公告)日：2024-11-28

申请号：US18324550

申请日：2023-05-26

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chi-hsiang Shen ,  Jeng-Chi Lin ,  Te-Chien Hou ,  Che-Hao Tu ,  Tang-Kuei Chang ,  Kei-Wei Chen ,  Hui-Chi Huang

IPC: H01L21/02 ,  H01L21/67 ,  H01L21/687

Abstract: Provided are a tool and a method for processing a semiconductor wafer. A processing method includes supporting a semiconductor wafer continuously along a periphery of the semiconductor wafer with an electrically grounded conductive member; and spinning the semiconductor wafer, wherein surface charges induced during spinning are dissipated by movement of electrons from the semiconductor wafer to the electrically grounded conductive member at the periphery of the semiconductor wafer.

公开(公告)号：US12131944B2

公开(公告)日：2024-10-29

申请号：US17460929

申请日：2021-08-30

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Chun-Wei Hsu ,  Chih-Chieh Chang ,  Yi-Sheng Lin ,  Jian-Ci Lin ,  Jeng-Chi Lin ,  Ting-Hsun Chang ,  Liang-Guang Chen ,  Ji Cui ,  Kei-Wei Chen ,  Chi-Jen Liu

IPC: H01L21/768 ,  C09G1/02 ,  H01L23/522

CPC classification number: H01L21/7684 ,  C09G1/02 ,  H01L21/76877 ,  H01L23/5226

Abstract: A slurry composition, a semiconductor structure and a method for forming a semiconductor structure are provided. The slurry composition includes a slurry and a precipitant dispensed in the slurry. The semiconductor structure comprises a blocking layer including at least one element of the precipitant. The method includes using the slurry composition with the precipitant to polish a conductive layer and causing the precipitant to flow into the gap.

公开(公告)号：US11664213B2

公开(公告)日：2023-05-30

申请号：US16727533

申请日：2019-12-26

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Hui-Chi Huang ,  Jeng-Chi Lin ,  Pin-Chuan Su ,  Chien-Ming Wang ,  Kei-Wei Chen

IPC: B08B7/04 ,  H01L21/02 ,  B08B1/00 ,  B08B3/08 ,  B08B5/04 ,  A46B13/04 ,  B08B1/04

CPC classification number: H01L21/02087 ,  A46B13/04 ,  B08B1/002 ,  B08B1/04 ,  B08B3/08 ,  B08B5/04 ,  B08B7/04 ,  A46B2200/30

Abstract: A tool and methods of removing films from bevel regions of wafers are disclosed. The bevel film removal tool includes an inner motor nested within an outer motor and a bevel brush secured to the outer motor. The bevel brush is adjustable radially outward to allow the wafer to be inserted in the bevel brush and to be secured to the inner motor. The bevel brush is adjustable radially inward to engage one or more sections of the bevel brush and to bring the bevel brush in contact with a bevel region of the wafer. Once engaged, a solution may be dispensed at the engaged sections of the bevel brush and the inner motor and the outer motor may be rotated such that the bevel brush is rotated against the wafer such that the bevel films of the wafer are both chemically and mechanically removed.

公开(公告)号：US20210053179A1

公开(公告)日：2021-02-25

申请号：US16549153

申请日：2019-08-23

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Pin-Chuan Su ,  Jeng-Chi Lin ,  Guan-Yi Lee ,  Hui-Chi Huang ,  Kei-Wei Chen

IPC: B24B37/20 ,  H01L21/306 ,  H01L21/321

Abstract: An embodiment is a polishing pad including a top pad and a sub pad that is below and contacting the top pad. The top pad includes top grooves along a top surface and microchannels extending from the top grooves to a bottom surface of the top pad. The sub pad includes sub grooves along a top surface of the sub pad.