公开(公告)号：US20170062353A1

公开(公告)日：2017-03-02

申请号：US14840808

申请日：2015-08-31

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： TZU-CHUN TANG ,  SHOU ZEN CHANG ,  WEI-TING CHEN ,  IN-TSANG LIN ,  VINCENT CHEN ,  CHUEI-TANG WANG ,  KAI-CHIANG WU ,  CHUN-LIN LU

IPC分类号： H01L23/552 ,  H01L23/31 ,  H01L21/56 ,  H01L23/66 ,  H01L21/48 ,  H01L23/498 ,  H01L23/58

CPC分类号： H01L23/552 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/5384 ,  H01L23/5389 ,  H01L23/585 ,  H01L23/66 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244

摘要： A semiconductor structure includes a substrate, a die disposed over the substrate, and including a die pad disposed over the die and a seal ring disposed at a periphery of the die and electrically connected with the die pad, a polymeric layer disposed over the die, a via extending through the polymeric layer and electrically connected with the die pad, and a molding disposed over the substrate and surrounding the die and the polymeric layer, wherein the seal ring is configured for grounding.

摘要翻译： 半导体结构包括基板，设置在基板上的管芯，并且包括设置在管芯上的管芯焊盘和设置在管芯的周围并与管芯焊盘电连接的密封环，设置在管芯上的聚合物层， 延伸穿过聚合物层并与管芯焊盘电连接的通孔，以及设置在基板上并围绕模头和聚合物层的模制件，其中密封环被配置为接地。

公开(公告)号：US20190067222A1

公开(公告)日：2019-02-28

申请号：US16173450

申请日：2018-10-29

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： VINCENT CHEN ,  HUNG-YI KUO ,  CHUEI-TANG WANG ,  HAO-YI TSAI ,  CHEN-HUA YU ,  WEI-TING CHEN ,  MING HUNG TSENG ,  YEN-LIANG LIN

IPC分类号： H01L23/66

摘要： A method of manufacturing a semiconductor structure includes providing a transceiver, forming a molding to surround the transceiver, forming a plurality of recesses extending through the molding, disposing a conductive material into the plurality of recesses to form a plurality of vias, disposing and patterning an insulating layer over the molding, the plurality of vias and the transceiver, and forming a redistribution layer (RDL) over the insulating layer, wherein the RDL comprises an antenna disposed over the insulating layer and a dielectric layer covering the antenna, and a portion of the antenna is extended through the insulating layer and is electrically connected with the transceiver.

公开(公告)号：US20180226368A1

公开(公告)日：2018-08-09

申请号：US15944463

申请日：2018-04-03

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： VINCENT CHEN ,  HUNG-YI KUO ,  CHUEI-TANG WANG ,  HAO-YI TSAI ,  CHEN-HUA YU ,  WEI-TING CHEN ,  MING HUNG TSENG ,  YEN-LIANG LIN

IPC分类号： H01L23/66

CPC分类号： H01L23/66 ,  H01L23/3107

摘要： A method of manufacturing a semiconductor structure includes providing a transceiver, forming a molding to surround the transceiver, forming a plurality of recesses extending through the molding, disposing a conductive material into the plurality of recesses to form a plurality of vias, disposing and patterning an insulating layer over the molding, the plurality of vias and the transceiver, and forming a redistribution layer (RDL) over the insulating layer, wherein the RDL comprises an antenna disposed over the insulating layer and a dielectric layer covering the antenna, and a portion of the antenna is extended through the insulating layer and is electrically connected with the transceiver.

公开(公告)号：US20200075516A1

公开(公告)日：2020-03-05

申请号：US16679051

申请日：2019-11-08

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： VINCENT CHEN ,  HUNG-YI KUO ,  CHUEI-TANG WANG ,  HAO-YI TSAI ,  CHEN-HUA YU ,  WEI-TING CHEN ,  MING HUNG TSENG ,  YEN-LIANG LIN

IPC分类号： H01L23/66

摘要： A semiconductor structure includes a transceiver, a molding surrounding the transceiver, a plurality of vias extending through the molding, and a RDL disposed over the transceiver and the plurality of vias. In some embodiments, the RDL includes an antenna disposed over and electrically connected to the transceiver, and a dielectric layer surrounding the antenna. In some embodiments, the antenna includes an elongated portion extending over the molding and a via portion electrically connected to the transceiver.

公开(公告)号：US20170221838A1

公开(公告)日：2017-08-03

申请号：US15013678

申请日：2016-02-02

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： WEI-TING CHEN ,  TZU-CHUN TANG ,  MING HUNG TSENG ,  IN-TSANG LIN ,  VINCENT CHEN ,  CHUEI-TANG WANG ,  HUNG-YI KUO

IPC分类号： H01L23/66 ,  H01Q5/10 ,  H01L23/58 ,  H01L23/522 ,  H01L25/18 ,  H01L21/683 ,  H01Q1/38 ,  H01L23/528

CPC分类号： H01L23/66 ,  H01L21/6835 ,  H01L23/5227 ,  H01L23/528 ,  H01L23/585 ,  H01L25/18 ,  H01L2223/6677 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q5/385 ,  H01Q7/00

摘要： A fan-out package structure is disclosed. The fan-out package structure includes an antenna main body; a redistribution layer (RDL); and an antenna auxiliary body in the RDL. An antenna system is also disclosed. The antenna system includes: an antenna main body, arranged to provide a first resonance; and an antenna auxiliary body, arranged to provide a second resonance through parasitic coupling to the antenna main body; wherein a dimension of the antenna main body is greater than a dimension of the antenna auxiliary body. An associated semiconductor packaging method is also disclosed.

公开(公告)号：US20180350740A1

公开(公告)日：2018-12-06

申请号：US16055702

申请日：2018-08-06

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： WEI-TING CHEN ,  IN-TSANG LIN ,  VINCENT CHEN ,  CHUEI-TANG WANG ,  CHEN-HUA YU

IPC分类号： H01L23/522 ,  H01L49/02 ,  H01L23/532 ,  H01L23/528 ,  H01L23/498 ,  H01L23/15 ,  H01L23/14

CPC分类号： H01L23/5227 ,  H01L23/145 ,  H01L23/147 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/528 ,  H01L23/5329 ,  H01L28/10

摘要： The present disclosure provides an inductor structure. The inductor structure, comprising a first surface, a second surface intersecting with the first surface, a first conductive pattern and a second conductive pattern. The first conductive pattern is formed on the first surface. The second conductive pattern is formed on the second surface. The first conductive pattern is connected with the second conductive pattern.

公开(公告)号：US20170287832A1

公开(公告)日：2017-10-05

申请号：US15088128

申请日：2016-04-01

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： WEI-TING CHEN ,  IN-TSANG LIN ,  VINCENT CHEN ,  CHUEI-TANG WANG ,  CHEN-HUA YU

IPC分类号： H01L23/522 ,  H01L23/528 ,  H01L23/532 ,  H01L49/02

CPC分类号： H01L23/5227 ,  H01L23/145 ,  H01L23/147 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/528 ,  H01L23/5329 ,  H01L28/10

摘要： The present disclosure provides an inductor structure. The inductor structure, comprising a first surface, a second surface intersecting with the first surface, a first conductive pattern and a second conductive pattern. The first conductive pattern is formed on the first surface. The second conductive pattern is formed on the second surface. The first conductive pattern is connected with the second conductive pattern.

公开(公告)号：US20170126047A1

公开(公告)日：2017-05-04

申请号：US14928651

申请日：2015-10-30

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： VINCENT CHEN ,  HUNG-YI KUO ,  CHUEI-TANG WANG ,  HAO-YI TSAI ,  CHEN-HUA YU ,  WEI-TING CHEN ,  MING HUNG TSENG ,  YEN-LIANG LIN

IPC分类号： H02J7/02 ,  H02J7/00

CPC分类号： H01L23/66 ,  H01L23/3107

摘要： A semiconductor structure includes a transceiver configured to communicate with a device, a molding surrounding the transceiver, a via extending through the molding, an insulating layer disposed over the molding, the via and the transceiver, and a redistribution layer (RDL) disposed over the insulating layer and comprising an antenna and a dielectric layer surrounding the antenna, wherein a portion of the antenna is extended through the insulating layer and the molding to electrically connect with the transceiver.