公开(公告)号：US20180033952A1

公开(公告)日：2018-02-01

申请号：US15646399

申请日：2017-07-11

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Shinji YAMAMOTO ,  Jumpei KONNO ,  Takashi MIYAGAWA

IPC: H01L41/23 ,  H01L41/053 ,  H03H9/25 ,  H01L41/312 ,  H03H3/08 ,  H01L41/047 ,  H01L41/29

CPC classification number: H01L41/23 ,  H01L41/0475 ,  H01L41/0533 ,  H01L41/1873 ,  H01L41/29 ,  H01L41/312 ,  H01L2224/81192 ,  H01L2224/97 ,  H03H3/02 ,  H03H3/08 ,  H03H9/0523 ,  H03H9/059 ,  H03H9/14541 ,  H03H9/25

Abstract: A method of fabricating an electronic device, the method including: arranging a device chip with no bump located on a lower surface of the device chip on a mounting substrate including a bump located on an upper surface of the mounting substrate; and bonding a pad located on the lower surface of the device chip and the bump by applying an ultrasonic wave to the device chip from an upper surface of the device chip.

公开(公告)号：US20240283426A1

公开(公告)日：2024-08-22

申请号：US18435564

申请日：2024-02-07

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Koichi SATO ,  Shinji YAMAMOTO

IPC: H03H9/13 ,  H03H9/05 ,  H03H9/15 ,  H03H9/56 ,  H03H9/70

CPC classification number: H03H9/13 ,  H03H9/05 ,  H03H9/15 ,  H03H9/568 ,  H03H9/70

Abstract: An acoustic wave device includes a support substrate, a piezoelectric layer provided on the support substrate, at least one pair of comb-shaped electrodes provided on the piezoelectric layer, the at least one pair of comb-shaped electrodes including a plurality of electrode fingers, a first intermediate layer provided between the support substrate and the piezoelectric layer, a second intermediate layer provided between the support substrate and the first intermediate layer, the second intermediate layer having a porosity higher than a porosity of the first intermediate layer, and a third intermediate layer provided between the support substrate and the second intermediate layer, the third intermediate layer having a porosity lower than the porosity of the second intermediate layer.

公开(公告)号：US20190356297A1

公开(公告)日：2019-11-21

申请号：US16390739

申请日：2019-04-22

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Ryohei KOMIYAMA ,  Hitoshi TSUKIDATE ,  Shinji YAMAMOTO

IPC: H03H9/02 ,  H03H3/10 ,  H03H9/145 ,  H03H9/25 ,  H03H9/64 ,  H03H9/72 ,  B23K26/53 ,  B23K26/00

Abstract: An acoustic wave resonator includes: a piezoelectric substrate; a pair of comb-shaped electrodes that is located on the piezoelectric substrate and excites an acoustic wave, each of the pair of comb-shaped electrodes including a plurality of electrode fingers; and a polycrystalline substrate that is located at an opposite side of the piezoelectric substrate from a surface on which the pair of comb-shaped electrodes is located, an average particle size of the polycrystalline substrate being equal to or less than 66 times an average pitch of the plurality of electrode fingers.

公开(公告)号：US20220368307A1

公开(公告)日：2022-11-17

申请号：US17724346

申请日：2022-04-19

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Koichi SATO ,  Shinji YAMAMOTO ,  Toshio NISHIZAWA ,  Ryohei KOMIYAMA

IPC: H03H9/13 ,  H03H9/17 ,  H03H9/70

Abstract: An acoustic wave device includes a piezoelectric layer, a pair of comb-shaped electrodes disposed on a first surface of the piezoelectric layer, each of the pair of comb-shaped electrodes including electrode fingers that excite an acoustic wave, a support substrate disposed at a second surface side of the piezoelectric layer, and having protruding portions and/or recessed portions on a first surface, which is closer to the piezoelectric layer, of the support substrate, each of the protruding portions and/or the recessed portions having a shape in which each of left and right side surfaces has linear slopes inclined at different angles with respect to the first surface of the piezoelectric layer in a cross-sectional view, and a second insulating layer located between the piezoelectric layer and the support substrate and disposed on the third surface, on which the protruding portions and/or the recessed portions are formed, of the support substrate.

公开(公告)号：US20220038071A1

公开(公告)日：2022-02-03

申请号：US17364462

申请日：2021-06-30

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Toshiharu NAKAZATO ,  Shinji YAMAMOTO ,  Ryouta IWABUCHI ,  Naoki TAKAHASHI

IPC: H03H9/02 ,  H03H9/64 ,  H03H9/145

Abstract: An acoustic wave device includes a support substrate, a piezoelectric layer provided over the support substrate, comb-shaped electrodes disposed on the piezoelectric layer, each of the comb-shaped electrodes including electrode fingers exciting an acoustic wave, a temperature compensation film interposed between the support substrate and the piezoelectric layer and having a temperature coefficient of an elastic constant opposite in sign to that of the piezoelectric layer, a boundary layer interposed between the support substrate and the temperature compensation film, an acoustic velocity of a bulk wave propagating through the boundary layer being higher than an acoustic velocity of a bulk wave propagating through the temperature compensation film and being lower than an acoustic velocity of a bulk wave propagating through the support substrate, and an intermediate layer interposed between the support substrate and the boundary layer and having a Q factor less than a Q factor of the boundary layer.

公开(公告)号：US20240162881A1

公开(公告)日：2024-05-16

申请号：US18507700

申请日：2023-11-13

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Satoshi IMASU ,  Ryohei KOMIYAMA ,  Shinji YAMAMOTO

IPC: H03H9/02 ,  H03H9/25 ,  H03H9/64

CPC classification number: H03H9/02929 ,  H03H9/02015 ,  H03H9/25 ,  H03H9/6483

Abstract: An acoustic wave device includes a piezoelectric layer, and at least one pair of comb-shaped electrodes provided on the piezoelectric layer, each of the comb-shaped electrodes including electrode fingers each having a first layer and a second layer provided on the first layer, the first layer being a titanium nitride layer with a thickness greater than 50 nm, the second layer being a metal layer.

公开(公告)号：US20230208395A1

公开(公告)日：2023-06-29

申请号：US17991259

申请日：2022-11-21

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Shinji YAMAMOTO ,  Koichi SATO ,  Toshiharu NAKAZATO

IPC: H03H9/25 ,  H03H9/64 ,  H03H9/72 ,  H03H9/145 ,  H03H9/02

CPC classification number: H03H9/25 ,  H01L41/313 ,  H03H9/725 ,  H03H9/02559 ,  H03H9/6483 ,  H03H9/14541

Abstract: An acoustic wave device includes a support substrate, a piezoelectric layer provided on the support substrate, at least a pair of comb-shaped electrodes provided on the piezoelectric layer, each of the comb-shaped electrodes including a plurality of electrode fingers, and an insulating layer provided between the support substrate and the piezoelectric layer, the insulating layer having, in at least a part thereof, a plurality of void regions of which extending directions are different from each other when viewed from a thickness direction of the support substrate, a width in the corresponding extending direction of each of the void regions being longer than a width in a direction orthogonal to the corresponding extending direction when viewed from the thickness direction of the support substrate.

公开(公告)号：US20220094330A1

公开(公告)日：2022-03-24

申请号：US17462543

申请日：2021-08-31

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Shinji YAMAMOTO ,  Michio MIURA

IPC: H03H9/17 ,  H03H9/02 ,  H03H9/13 ,  H03H3/02

Abstract: An acoustic wave device includes a support substrate having an uneven surface, a piezoelectric layer provided on the uneven surface of the support substrate, an electrode that excites an acoustic wave in the piezoelectric layer, and an insulating layer that is provided between the uneven surface of the support substrate and the piezoelectric layer, and has an air gap located in a recess part of the uneven surface.

公开(公告)号：US20210399709A1

公开(公告)日：2021-12-23

申请号：US17323598

申请日：2021-05-18

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Shinji YAMAMOTO ,  Toshio NISHIZAWA ,  Naoki KAKITA

IPC: H03H9/02 ,  H03H9/05 ,  H03H9/17 ,  H03H9/13 ,  H03H9/54

Abstract: An acoustic wave device including a support substrate, a piezoelectric layer provided over the support substrate, at least one pair of comb-shaped electrodes disposed on the piezoelectric layer, each of the at least one pair of comb-shaped electrodes including electrode fingers, a temperature compensation film interposed between the support substrate and the piezoelectric layer, the temperature compensation film having a temperature coefficient of elastic constant opposite in sign to a temperature coefficient of elastic constant of the piezoelectric layer; and an insulating layer interposed between the support substrate and the temperature compensation film, a first surface of the insulating layer having first protruding portions and/or first recessed portions, a second surface of the insulating layer having second protruding portions and/or second recessed portions, the first surface being closer to the support substrate, the second surface being closer to the temperature compensation film.

公开(公告)号：US20200313650A1

公开(公告)日：2020-10-01

申请号：US16802071

申请日：2020-02-26

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Shinji YAMAMOTO ,  Ryohei KOMIYAMA ,  Koichi SATOH ,  Hitoshi TSUKIDATE ,  Michio MIURA

IPC: H03H9/25 ,  H03H9/02 ,  H03H9/145 ,  H03H9/05 ,  H03H9/72 ,  H03H9/64 ,  H03H3/08

Abstract: An acoustic wave device includes: a piezoelectric substrate: a pair of comb-shaped electrodes located on the piezoelectric substrate, each of the comb-shaped electrodes including a plurality of electrode fingers; a support substrate having protruding portions and/or recessed portions in a region overlapping with the pair of comb-shaped electrodes in plan view, the protruding portions and/or recessed portions being regularly arranged; and an insulating layer directly or indirectly bonded between the piezoelectric substrate and the support substrate, a boundary face between the insulating layer and the support substrate being provided along the protruding portions and/or the recessed portions.