公开(公告)号：US11114248B2

公开(公告)日：2021-09-07

申请号：US16354373

申请日：2019-03-15

Applicant: TDK Corporation

Inventor： Kazuhiro Yoshikawa ,  Daiki Ishii ,  Kenichi Yoshida

IPC: H01G4/33 ,  H01G4/012

Abstract: A thin film capacitor includes a capacitance portion in which a plurality of electrode layers and dielectric layers are alternately laminated, a cover layer, an insulating layer, a via hole in which one electrode layer different from an uppermost electrode layer among the plurality of electrode layers is exposed at a bottom surface thereof, and an opening which is provided inside the via hole and in which the one electrode layer is exposed at a bottom surface thereof, and in which the cover layer and the insulating layer are exposed at a side surface. The opening includes a first opening portion which passes through the insulating layer and a second opening portion which is provided below the first opening portion and passes through the cover layer, and when an inner diameter of the first opening portion is D1 and an inner diameter of the second opening portion is D2, D1>D2.

公开(公告)号：US11631541B2

公开(公告)日：2023-04-18

申请号：US17207212

申请日：2021-03-19

Applicant: TDK Corporation

Inventor： Daiki Ishii ,  Eiko Wakata

IPC: H01G4/30 ,  H01G2/06 ,  H01G4/232 ,  H01G4/248

Abstract: Disclosed herein is a multilayer capacitor that includes a capacitor layer having a plurality of odd-numbered electrode layers which are positioned at odd-numbered rows and a plurality of even-numbered electrode layers which are positioned at even-numbered rows. The capacitor layer includes a first side surface to which the odd-numbered electrode layers are exposed, a second side surface to which the even-numbered electrode layers are exposed, and a first planar region. The first external terminal covers the first side surface so as to be connected to the odd-numbered electrode layers. The second external terminal covers the second side surface so as to be connected to the even-numbered electrode layers. The first external terminal covers also the first planar region and is connected to the first internal electrode layer through a first via conductor extending in a stacking direction.

公开(公告)号：US12237366B2

公开(公告)日：2025-02-25

申请号：US18012820

申请日：2020-12-24

Applicant: TDK Corporation

Inventor： Daiki Ishii ,  Yoshihiko Yano ,  Yuki Yamashita ,  Kenichi Yoshida ,  Tetsuhiro Takahashi

IPC: H01G4/005 ,  H01G2/06 ,  H01G4/008 ,  H01G4/01 ,  H01G4/012 ,  H01G4/06 ,  H01G4/10 ,  H01G4/12 ,  H01G4/228 ,  H01G4/33 ,  H01L25/16 ,  H01L49/02 ,  H05K1/18 ,  H01G4/252 ,  H01L23/00

Abstract: To provide a thin film capacitor having high adhesion with respect to a circuit substrate. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. An angle θa formed by the other main surface of the metal foil and a side surface thereof is more than 20° and less than 80°. The side surface is thus tapered at an angle of more than 20° and less than 80°, so that it is possible to suppress warpage and to enhance adhesion with respect to a multilayer substrate when the thin film capacitor is embedded in the multilayer substrate.

公开(公告)号：US12218185B2

公开(公告)日：2025-02-04

申请号：US18012145

申请日：2020-12-24

Applicant: TDK Corporation

Inventor： Daiki Ishii ,  Yoshihiko Yano ,  Yuki Yamashita ,  Kenichi Yoshida ,  Tetsuhiro Takahashi

IPC: H01G4/008 ,  H01G2/06 ,  H01G4/005 ,  H01G4/01 ,  H01G4/012 ,  H01G4/06 ,  H01G4/10 ,  H01G4/12 ,  H01G4/228 ,  H01G4/252 ,  H01G4/33 ,  H01L23/00 ,  H01L25/16 ,  H01L49/02 ,  H05K1/18

Abstract: To provide a thin film capacitor in which warpage is less likely to occur. A thin film capacitor includes: a metal foil having roughened upper and lower surfaces; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a dielectric film covering the lower surface of the metal foil and made of a dielectric material having a thermal expansion coefficient smaller than that of the metal foil; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the first dielectric film without contacting the metal foil. The lower surface of the metal foil is thus covered with the dielectric film having a small thermal expansion coefficient, thereby making it possible to prevent the occurrence of warpage.

公开(公告)号：US12132078B2

公开(公告)日：2024-10-29

申请号：US18012809

申请日：2020-12-24

Applicant: TDK Corporation

Inventor： Yoshihiko Yano ,  Daiki Ishii ,  Kenichi Yoshida ,  Yuki Yamashita

IPC: H01G4/008 ,  H01G2/06 ,  H01G4/005 ,  H01G4/01 ,  H01G4/012 ,  H01G4/06 ,  H01G4/10 ,  H01G4/12 ,  H01G4/228 ,  H01G4/252 ,  H01G4/33 ,  H01L23/00 ,  H01L25/16 ,  H01L49/02 ,  H05K1/18

CPC classification number: H01L28/75 ,  H01G2/065 ,  H01G4/005 ,  H01G4/008 ,  H01G4/01 ,  H01G4/012 ,  H01G4/06 ,  H01G4/10 ,  H01G4/1209 ,  H01G4/1218 ,  H01G4/1254 ,  H01G4/228 ,  H01G4/33 ,  H01L25/16 ,  H01L28/84 ,  H05K1/18 ,  H01G4/252 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2924/19015 ,  H01L2924/19041 ,  H01L2924/19102 ,  H01L2924/19103 ,  H05K2201/10015

Abstract: To provide a thin film capacitor having high adhesion performance with respect to a multilayer substrate. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. A height of the first electrode layer is lower than a height of the second electrode layer. This enhances adhesion performance when the thin film capacitor is embedded in a multilayer substrate and improves ESR characteristics.

公开(公告)号：US10950389B2

公开(公告)日：2021-03-16

申请号：US16360405

申请日：2019-03-21

Applicant: TDK CORPORATION

Inventor： Daiki Ishii ,  Kazuhiro Yoshikawa ,  Koichi Tsunoda ,  Mitsuhiro Tomikawa ,  Junki Nakamoto ,  Kenichi Yoshida

IPC: H01G4/33 ,  H01G4/008 ,  H01G4/12

Abstract: A thin-film capacitor satisfies a relationship of CTE1>CTE2>CTE3 regarding a linear expansion coefficient CTE1 of a base, a linear expansion coefficient CTE2 of a capacitance unit, and a linear expansion coefficient CTE3 of a barrier layer. The inventors have newly found that in a case in which such a relationship is satisfied, when a temperature falls from a deposition temperature, cracking occurring in the capacitance unit of the thin-film capacitor is prevented, and cracking occurring in the barrier layer is also prevented.