MULTILAYER CAPACITOR AND ELECTRONIC COMPONENT DEVICE

    公开(公告)号:US20180226191A1

    公开(公告)日:2018-08-09

    申请号:US15875617

    申请日:2018-01-19

    Abstract: A multilayer capacitor includes an element assembly, a first external electrode, a second external electrode, and a plurality of internal electrodes which are disposed at the inside of the element assembly. The plurality of internal electrodes include a first internal electrode that is electrically connected to the first external electrode, a second internal electrode that is electrically connected to the second external electrode, and a plurality of third internal electrodes. The plurality of third internal electrodes are electrically connected to each other by a first connection conductor and a second connection conductor, a first capacitance portion is constituted by the first internal electrode and the third internal electrodes, a second capacitance portion is constituted by the second internal electrode and the third internal electrodes, and the first capacitance portion and the second capacitance portion are electrically connected in series.

    ELECTRONIC COMPONENT DEVICE
    3.
    发明申请

    公开(公告)号:US20190096580A1

    公开(公告)日:2019-03-28

    申请号:US16136661

    申请日:2018-09-20

    Abstract: An electronic component device includes: an electronic component having: a base body having a pair of end surfaces facing each other and four side surfaces connecting the pair of end surfaces; and a pair of outer electrodes disposed on respective sides of the pair of end surfaces; metal terminals respectively electrically connected to the pair of outer electrodes; and joint portions joining and electrically connecting the outer electrodes to the metal terminals respectively, wherein the electronic component has a metal portion disposed on at least one surface of the four side surfaces, and the metal portion has a baked metal layer.

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