MULTILAYER CAPACITOR AND ELECTRONIC COMPONENT DEVICE

    公开(公告)号:US20180226191A1

    公开(公告)日:2018-08-09

    申请号:US15875617

    申请日:2018-01-19

    申请人: TDK CORPORATION

    摘要: A multilayer capacitor includes an element assembly, a first external electrode, a second external electrode, and a plurality of internal electrodes which are disposed at the inside of the element assembly. The plurality of internal electrodes include a first internal electrode that is electrically connected to the first external electrode, a second internal electrode that is electrically connected to the second external electrode, and a plurality of third internal electrodes. The plurality of third internal electrodes are electrically connected to each other by a first connection conductor and a second connection conductor, a first capacitance portion is constituted by the first internal electrode and the third internal electrodes, a second capacitance portion is constituted by the second internal electrode and the third internal electrodes, and the first capacitance portion and the second capacitance portion are electrically connected in series.

    MULTILAYER CERAMIC ELECTRONIC DEVICE WITH DIELECTRIC LAYERS AND INTERNAL ELECTRODE LAYERS

    公开(公告)号:US20200035414A1

    公开(公告)日:2020-01-30

    申请号:US16589884

    申请日:2019-10-01

    申请人: TDK Corporation

    摘要: A multilayer ceramic electronic device comprising: a ceramic element body, in which a plurality of dielectric layers and a plurality of internal electrode layers are alternately stacked, and at least a pair of external electrodes which are connected to the internal electrode layers on surfaces of the ceramic element body; a thickness of the dielectric layers is 0.4 μm or less, a width (W0) of the ceramic element body along a width-direction is 0.59 mm or less, a gap (Wgap) between an outer face of the ceramic element body and an end of the internal electrode layers along width-direction of the ceramic element body is 0.010 to 0.025 mm, and a ratio (Wgap/W0) of the gap with respect to the width is 0.025 or more.

    MULTILAYER CERAMIC ELECTRONIC DEVICE
    3.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC DEVICE 审中-公开
    多层陶瓷电子设备

    公开(公告)号:US20160293333A1

    公开(公告)日:2016-10-06

    申请号:US15087275

    申请日:2016-03-31

    申请人: TDK Corporation

    CPC分类号: H01G4/30 H01G4/12 H01G4/232

    摘要: Provided is a multilayer ceramic electronic device which is capable of preventing decrease of the specific permittivity and of showing less drop of capacitance, even when the dielectric grains constituting the dielectric layers become smaller for thinning of the dielectric layers, wherein Dg/Di≧1 is satisfied, in case that “Di” is an average grain size of the first dielectric grains constituting the dielectric layer in the capacitance region and “Dg” is an average grain size of the second dielectric grains in an exterior area.

    摘要翻译: 提供一种多层陶瓷电子器件,即使构成电介质层的电介质粒子变薄,电介质层变薄也能够防止比容阻率的降低和电容量的降低,其中Dg /Di≥1为 在“Di”是构成电容区域中的电介质层的第一电介质粒子的平均粒径的情况下,“Dg”是外部区域中的第二电介质粒子的平均粒径的情况。

    MULTILAYER CERAMIC ELECTRONIC DEVICE WITH DIELECTRIC LAYERS AND INTERNAL ELECTRODE LAYERS

    公开(公告)号:US20190259536A1

    公开(公告)日:2019-08-22

    申请号:US16397928

    申请日:2019-04-29

    申请人: TDK Corporation

    摘要: A multilayer ceramic electronic device comprising: a ceramic element body, in which it plurality of dielectric layers and a plurality of internal electrode layers are alternately stacked, and at least a pair of external electrodes which are connected to the internal electrode layers on surfaces of the ceramic element body: a thickness of the dielectric layers is 0.4 μm or less, a width (W0) of the ceramic element body along a width-direction is 0.59 mm or less, a gap (Wgap) between an outer face of the ceramic element body and an end of the internal electrode layers along width-direction of the ceramic element body is 0.010 to 0.025 mm, and a ratio (Wgap/W0) of the gap with respect to the width is 0.025 or more.

    ELECTRONIC COMPONENT DEVICE
    6.
    发明申请

    公开(公告)号:US20190096580A1

    公开(公告)日:2019-03-28

    申请号:US16136661

    申请日:2018-09-20

    申请人: TDK CORPORATION

    摘要: An electronic component device includes: an electronic component having: a base body having a pair of end surfaces facing each other and four side surfaces connecting the pair of end surfaces; and a pair of outer electrodes disposed on respective sides of the pair of end surfaces; metal terminals respectively electrically connected to the pair of outer electrodes; and joint portions joining and electrically connecting the outer electrodes to the metal terminals respectively, wherein the electronic component has a metal portion disposed on at least one surface of the four side surfaces, and the metal portion has a baked metal layer.

    MULTILAYER CERAMIC ELECTRONIC DEVICE
    8.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC DEVICE 审中-公开
    多层陶瓷电子设备

    公开(公告)号:US20160284473A1

    公开(公告)日:2016-09-29

    申请号:US15082814

    申请日:2016-03-28

    申请人: TDK Corporation

    摘要: A multilayer ceramic electronic device comprising: a ceramic element body, in which a plurality of dielectric layers and a plurality of internal electrode layers are alternately stacked, and at least a pair of external electrodes which are connected to the internal electrode layers on surfaces of the ceramic element body; a thickness of the dielectric layers is 0.4 μm or less, a width (W0) of the ceramic element body along a width-direction is 0.59 mm or less, a gap (Wgap) between an outer face of the ceramic element body and an end of the internal electrode layers along width-direction of the ceramic element body is 0.010 to 0.025 mm, and a ratio (Wgap/W0) of the gap with respect to the width is 0.025 or more.

    摘要翻译: 一种多层陶瓷电子器件,包括:陶瓷元件体,其中多个电介质层和多个内部电极层交替堆叠;以及至少一对外部电极,其连接到所述内部电极层的表面上 陶瓷元件体; 电介质层的厚度为0.4μm以下,陶瓷元件主体沿宽度方向的宽度(W0)为0.59mm以下,陶瓷元件主体的外表面与端部的间隙(Wgap) 的内部电极层的宽度方向为0.010〜0.025mm,间隙相对于宽度的比(Wgap / W0)为0.025以上。