公开(公告)号：US20220389285A1

公开(公告)日：2022-12-08

申请号：US17773685

申请日：2020-11-03

Applicant: TESA SE

Inventor： Thilo DOLLASE ,  Michael EGGER ,  Aranzazu ESCUDERO VALLEJO ,  Jessika GARGIULO

IPC: C09J7/38 ,  C09J11/08 ,  C09J9/00 ,  C09J109/06

Abstract: The present invention relates to a foamed pressure-sensitive adhesive compound on the basis of aromatic polyvinyl-polydiene block copolymers, in particular for double-sided self-adhesive strips, containing a) 39.8 wt. % to 51.8 wt. % of an elastomer component, b) 35.0 wt. % to 58.0 wt % of an adhesive resin component, c) 2.0 wt. % to 15.0 wt. % of a plasticizer component, d) 0.0 wt. % to 18.0 wt. % of further additives and e) microballoons, the microballoons being at least partly expanded.

公开(公告)号：US20220380641A1

公开(公告)日：2022-12-01

申请号：US17773680

申请日：2020-11-03

Applicant: TESA SE

Inventor： Thilo DOLLASE ,  Michael EGGER ,  Aranzazu ESCUDERO VALLEJO ,  Jessika GARGIULO

IPC: C09J153/02 ,  C09J7/38 ,  C09J193/04 ,  C08J9/32

Abstract: The invention relates to a foamed adhesive mass layer comprising a) 41.7 to 62.0 wt. % of an elastomer component, b) 37.7 to 58.0 wt. % of an adhesive resin component, c) 0 to 15 wt. % of a soft resin component, d) 0 to 18 wt. % further additives, and e) microballoons with a proportion of preferably 0.3 to 2.5 wt. %, preferably 0.5 to 2.0 wt. % and particularly preferably 0.7 to 1.7 wt. %, wherein the microballoons are at least partially expanded, wherein the elastomer component (a) consists of up to at least 90 wt. % polyvinyl aromatic compound polydine block copolymer, wherein the adhesive resin component (b) contains up to 4 to 100 wt. % of at least one type K1 if a rosin oligomer with a softening temperature (Ring & Ball, Test VI) of at least 90° C., and wherein the density (Text IX) of the foamed adhesive mass layer is at least 600 kg/m3 and max. 920 kg/m3.

公开(公告)号：US20200377766A1

公开(公告)日：2020-12-03

申请号：US16998508

申请日：2020-08-20

Applicant: TESA SE

Inventor： Thilo DOLLASE ,  Jessika GARGIULO ,  Marco KUPSKY ,  Bastian WEDEL

IPC: C09J7/38 ,  C08F220/32 ,  C09J133/06 ,  C08L33/06 ,  C09J7/22 ,  C09J5/06 ,  H01L51/52 ,  H01L51/56

Abstract: Single- or double-sided adhesive tapes and methods at least partly encapsulate an (opto)electronic structure. The tapes and method include a carrier and at least one layer of a curable adhesive composition having the following components: (A) 20% to 99.9% by weight (based on the entirety of the curable adhesive composition) of a (co)polymer functionalized with epoxy groups and having a weight-average molar mass of at least 5000 g/mol, based on more than 30% to 100% by weight, (based on the entirety of the parent monomers of the epoxy-functionalized (co)polymer) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group; and (B) 0.1% to 5% by weight (based on the entirety of the curable adhesive composition) of at least one curing agent configured to induce curing of the (co)polymer (A) with reaction of its epoxy groups by thermal means and/or by supply of UV radiation.

公开(公告)号：US20180194978A1

公开(公告)日：2018-07-12

申请号：US15736219

申请日：2016-05-27

Applicant: TESA SE

Inventor： Thilo DOLLASE ,  Thorsten KRAWINKEL ,  Klaus KEITE-TELGENBÜSCHER ,  Christian SCHUH ,  Jessika GARGIULO

IPC: C09J153/00 ,  C03C27/10 ,  C09J163/00 ,  C08J3/00 ,  C08L21/00 ,  C08L53/00 ,  C08L63/00 ,  H01L31/048 ,  H01L33/00

CPC classification number: C09J153/00 ,  C03C27/10 ,  C08J3/00 ,  C08L21/00 ,  C08L53/00 ,  C08L63/00 ,  C09J163/00 ,  H01L24/00 ,  H01L31/0481 ,  H01L33/00 ,  H01L33/56 ,  H01L51/5246 ,  H01L2924/0002 ,  Y02E10/50

Abstract: The invention relates to an adhesive composition, preferably pressure-sensitive adhesive composition, comprising a) at least one (co)polymer containing at least isobutylene and/or butylene as comonomer type and, optionally but preferably, at least one comonomer type that—when considered in hypothetical homopolymer form—has a softening point above 40° C., b) at least one type of at least partially hydrogenated adhesive resin, c) at least one type of reactive resin based on a cyclic ether with a softening point below 40° C., preferably below 20° C., d) at least one type of latently reactive thermally activatable initiator for initiating cationic curing.

公开(公告)号：US20240117223A1

公开(公告)日：2024-04-11

申请号：US18275940

申请日：2022-02-07

Applicant: tesa SE

Inventor： Judith GRUENAUER ,  Thilo DOLLASE ,  Bernd LUEHMANN ,  Jessika GARGIULO

IPC: C09J7/38 ,  C09J7/26 ,  C09J11/08 ,  C09J153/02

CPC classification number: C09J7/387 ,  C09J7/26 ,  C09J11/08 ,  C09J153/02 ,  C09J2301/302 ,  C09J2301/312 ,  C09J2301/408 ,  C09J2301/50

Abstract: The invention relates to polyvinal aromate-polydiene-block copolymer-based adhesive compounds that contain at least one type of a cationically curable reactive resin and that result, when cured, in improved thermal shear strength. The invention further relates to adhesive strips that contain at least one layer of such an adhesive compound, and a method of production.

公开(公告)号：US20190169470A1

公开(公告)日：2019-06-06

申请号：US16097779

申请日：2017-03-15

Applicant: TESA SE

Inventor： Thilo DOLLASE ,  Jessika GARGIULO ,  Marco KUPSKY ,  Bastian WEDEL

IPC: C09J7/38 ,  C08F220/32 ,  C09J7/22 ,  C09J5/06 ,  H01L51/52 ,  H01L51/56

Abstract: The present invention relates to a curable adhesive compound for encapsulating an electronic or optoelectronic arrangement against permeates, made of the following components: (A) 20 to 99.9 wt % (relative to the total amount of the curable adhesive compound) of a (co)polymer functionalized with epoxy groups and having a weight-average molar mass in the range of at least 5,000 g/mol, based on more than 30 to 100 wt %, preferably 50 to 100 wt %, (relative to the total amount of the monomers on which the epoxide-functionalized (co)polymer is based) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group, (B) 0.1 to 5 wt % (relative to the total amount of the curable adhesive compound) of at least one curing agent which can induce, thermally and/or by the application of UV radiation, the curing, in particular the cationic curing, of the (co)polymer (A) under reaction of its epoxy groups, (C) optionally 0 to 79.9 wt % of additional components.