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    DETACHABLE ADHESIVE STRIP
    1.
    发明申请
    DETACHABLE ADHESIVE STRIP 审中-公开
    可剥离粘合条

    公开(公告)号：US20150337177A1

    公开(公告)日：2015-11-26

    申请号：US14653498

    申请日：2013-12-05

    Applicant: TESA SE

    Inventor： Thorsten KRAWINKEL ,  Lesmona SCHERF ,  Anika PETERSEN ,  Thilo DOLLASE

    IPC: C09J7/02 ,  C09J153/02

    CPC classification number: C09J153/02 ,  C08K5/01 ,  C09J7/22 ,  C09J7/25 ,  C09J7/38 ,  C09J2201/128 ,  C09J2201/618 ,  C09J2205/102 ,  C09J2453/00 ,  C09J2475/006 ,  Y10T428/266 ,  Y10T428/2848 ,  Y10T428/2861

    Abstract: The invention relates to an adhesive film strip comprising at least two, particularly three, layers, which adhesive film strip can be detached without residues and nondestructively by expansive stretching substantially in the adhesion plane, with a carrier on which a first external adhesive compound layer is present on at least one side, wherein the adhesive compound layer consists of adhesive compound formed on the basis of vinyl aromatic block copolymers and adhesive resins, wherein at least 75% of the resin (relative to the overall resin content) is selected with a DACP (diacetone alcohol cloud point) of greater than −20° C., preferably greater than 0° C., and the carrier has at least one layer made from a polyurethane with an elongation at break of at least 100% and a restoring power of more than 50%. A nonpolar hydrocarbon resin or a polyterpene resin is particularly used as the tackifier for the adhesive compound(s).

    Abstract translation: 本发明涉及一种粘合膜条带，其包括至少两个特别是三个层，该粘合膜条可以基本上在粘合平面中通过膨胀拉伸而无残留物非破坏性地分离，其中第一外部粘合剂化合物层是 存在于至少一侧，其中所述粘合剂化合物层由基于乙烯基芳族嵌段共聚物和粘合剂树脂形成的粘合剂化合物组成，其中至少75％的树脂（相对于总的树脂含量）用DACP （双丙酮醇浊点）大于-20℃，优选大于0℃，并且载体具有至少一层由聚氨酯制成的断裂伸长率至少为100％的层和恢复力 超过50％。 非极性烃树脂或多萜烯树脂特别用作粘合剂化合物的增粘剂。

    PRESSURE-SENSITIVE ADHESIVE COMPOUND CONTAINING A CROSS-LINKED NANOPARTICLE NETWORK, METHOD OF PRODUCTION AND USE THEREOF
    3.
    发明申请
    PRESSURE-SENSITIVE ADHESIVE COMPOUND CONTAINING A CROSS-LINKED NANOPARTICLE NETWORK, METHOD OF PRODUCTION AND USE THEREOF 审中-公开
    包含交联纳米粒子网络的压敏粘合剂化合物，其生产方法和用途

    公开(公告)号：US20150322296A1

    公开(公告)日：2015-11-12

    申请号：US14648423

    申请日：2014-01-13

    Applicant: TESA SE

    Inventor： Klaus KEITE-TELGENBÜSCHER ,  Christian SCHUH ,  Bernd LÜHMANN ,  Thilo DOLLASE ,  Minyoung BAI ,  Thorsten KRAWINKEL

    IPC: C09J7/02 ,  C09J125/08 ,  C09J153/00

    Abstract: Pressure-sensitive adhesive compound comprising at least two components forming one phase each, from which an IPN with at least two phases is produced by a cross-linking build-up reaction, the first phase having at least a softening point temperature of less than 23° C., and the second phase, after the build up reaction, having a softening temperature of greater than 23° C., the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.

    Abstract translation: 包含至少两种形成一相的组分的压敏粘合剂化合物，通过交联起始反应从其产生具有至少两相的IPN，第一相具有至少软化点温度小于23℃ ℃，第二相在堆积反应后具有大于23℃的软化温度，两相在堆积反应后具有交联纳米颗粒网络的形态。

    PRESSURE-SENSITIVE ADHESIVE BASED ON ACRYLONITRILE BUTADIENE RUBBERS
    4.
    发明申请
    PRESSURE-SENSITIVE ADHESIVE BASED ON ACRYLONITRILE BUTADIENE RUBBERS 有权

    公开(公告)号：US20210317345A1

    公开(公告)日：2021-10-14

    申请号：US17226486

    申请日：2021-04-09

    Applicant: tesa SE

    Inventor： Yanjie REN ,  Sarah BAMBERG ,  Thorsten KRAWINKEL

    IPC: C09J109/02

    Abstract: Pressure-sensitive adhesives based on acrylonitrile-butadiene rubbers having good shock-resistance combined with easy removability of the adhesives from the substrate shall be provided. This is solved by a pressure-sensitive adhesive which comprises at least one acrylonitrile-butadiene rubber; and at least one tackifier resin, and is characterized in that the acrylonitrile content of the acrylonitrile rubber is less than 30 wt %; the pressure-sensitive adhesive comprises at least one rosin resin as tackifier resin; and the entirety of all tackifier resins has an acid number of 6-150. The pressure-sensitive adhesive can be used for bonding parts in mobile electronic devices.

    ADHESIVE TAPE FOR ENCAPSULATING ELECTRONIC CONSTRUCTIONS
    5.
    发明申请
    ADHESIVE TAPE FOR ENCAPSULATING ELECTRONIC CONSTRUCTIONS 审中-公开

    公开(公告)号：US20190161648A1

    公开(公告)日：2019-05-30

    申请号：US16321106

    申请日：2017-07-17

    Applicant: TESA SE

    Inventor： Christian SCHUH ,  Thorsten KRAWINKEL

    IPC: C09J7/29 ,  B32B27/14 ,  C08K3/36 ,  C08K3/38

    Abstract: The aim is to provide an adhesive tape that effectively protects an electronic construction from permeants, especially water, and that at the same time has good gap-filling qualities. To solve this problem an adhesive tape is proposed that has in the following order:—a carrier layer without barrier effect at least towards water and with a WVTR of at least 1 g/(m2*d) (38° C., 90% relative humidity, 50 μm layer thickness);—a layer comprising at least one getter material capable of sorbing at least water;—a water barrier ply; and—a layer of pressure-sensitive adhesive, where the carrier layer bears an outward-facing release layer and/or the layer of pressure-sensitive adhesive is lined with a release liner which has a release layer lying on the layer of pressure-sensitive adhesive.

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