公开(公告)号：US20180127266A1

公开(公告)日：2018-05-10

申请号：US15867563

申请日：2018-01-10

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC: B81B7/00

CPC classification number: B81B7/0048 ,  B81B7/0054 ,  B81B2207/012 ,  B81B2207/097 ,  B81B2207/99 ,  B81C1/00325 ,  B81C2203/0136 ,  B81C2203/0154 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49541 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

公开(公告)号：US20160035652A1

公开(公告)日：2016-02-04

申请号：US14814342

申请日：2015-07-30

Applicant: Texas Instruments Incorporated

Inventor： Genki Yano ,  Ayumu Kuroda

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49513 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/05624 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48482 ,  H01L2224/48499 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/01079 ,  H01L2924/01029 ,  H01L2224/29099 ,  H01L2924/00

Abstract: An integrated circuit assembly includes a die with a bond pad; a stud bump formed on the bond pad; and a ball bond formed on the stud bump.

Abstract translation: 集成电路组件包括具有接合焊盘的管芯; 形成在接合垫上的柱形凸块; 以及形成在螺柱凸起上的球接合。

公开(公告)号：US12040260B2

公开(公告)日：2024-07-16

申请号：US17139987

申请日：2020-12-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Makoto Shibuya ,  Ayumu Kuroda ,  Kengo Aoya

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49555 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/48245 ,  H01L2224/85205

Abstract: An electronic package includes an electronic component including terminals, a plurality of surface contacts, at least some of the surface contacts being electrically coupled to the terminals within the electronic package, a mold compound covering the electronic component and partially covering the surface contacts with a bottom surface exposed from the mold compound, and a plurality of wires extending from exposed surfaces of the surface contacts, each of the wires providing a solderable surface for mounting the electronic package at a standoff on an external board.

公开(公告)号：US20170197823A1

公开(公告)日：2017-07-13

申请号：US15134574

申请日：2016-04-21

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC: B81C1/00 ,  H01L21/02 ,  B81B7/00

CPC classification number: B81B7/0048 ,  B81B7/0054 ,  B81B2207/012 ,  B81B2207/097 ,  B81B2207/99 ,  B81C1/00325 ,  B81C2203/0136 ,  B81C2203/0154 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49541 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

公开(公告)号：US20220208660A1

公开(公告)日：2022-06-30

申请号：US17139987

申请日：2020-12-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Makoto Shibuya ,  Ayumu Kuroda ,  Kengo Aoya

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56

Abstract: An electronic package includes an electronic component including terminals, a plurality of surface contacts, at least some of the surface contacts being electrically coupled to the terminals within the electronic package, a mold compound covering the electronic component and partially covering the surface contacts with a bottom surface exposed from the mold compound, and a plurality of wires extending from exposed surfaces of the surface contacts, each of the wires providing a solderable surface for mounting the electronic package at a standoff on an external board.

公开(公告)号：US10233074B2

公开(公告)日：2019-03-19

申请号：US15867563

申请日：2018-01-10

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC: B81B7/00 ,  B81C1/00 ,  H01L23/31 ,  H01L23/495

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

公开(公告)号：US09896330B2

公开(公告)日：2018-02-20

申请号：US15134574

申请日：2016-04-21

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0048 ,  B81B7/0054 ,  B81B2207/012 ,  B81B2207/097 ,  B81B2207/99 ,  B81C1/00325 ,  B81C2203/0136 ,  B81C2203/0154 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49541 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

公开(公告)号：US11498831B2

公开(公告)日：2022-11-15

申请号：US16941138

申请日：2020-07-28

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC: B81B7/00 ,  B81C1/00 ,  H01L23/31 ,  H01L23/495

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

公开(公告)号：US10723616B2

公开(公告)日：2020-07-28

申请号：US16266227

申请日：2019-02-04

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC: B81B7/00 ,  B81B1/00 ,  H01L23/31 ,  B81C1/00 ,  H01L23/495

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

公开(公告)号：US20190169019A1

公开(公告)日：2019-06-06

申请号：US16266227

申请日：2019-02-04

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC: B81B7/00 ,  H01L23/31 ,  B81C1/00

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.