Abstract:
A process for forming an integrated circuit with a dilution doped resistor with a resistance that may be tuned by partially blocking the implant used to dope the resistor. A process for forming an integrated circuit with a dilution doped polysilicon resistor by partially blocking the resistor dopant implant from a portion of the polysilicon resistor body.
Abstract:
In some examples, a package comprises a semiconductor die having a first surface and a second surface opposing the first surface, the semiconductor die including circuitry formed in the first surface. The package includes an acoustic waveguide in the semiconductor die, the acoustic waveguide including an array of capacitors. The array of capacitors includes a transducer portion and a diffraction grating portion. The transducer portion is configured to convert signals between electrical signals and acoustic waves, and the diffraction grating portion is configured to direct the acoustic waves toward and receive the acoustic waves from the second surface.
Abstract:
An oscillator assembly includes a scribe seal, an oscillator circuit, and a calibration circuit. The oscillator circuit includes an output. The calibration circuit is coupled to the oscillator circuit. The calibration circuit includes a reference frequency terminal, a conductor coupled to the reference frequency terminal, and an oscillator input terminal. The conductor extends to an edge of the oscillator circuit assembly and penetrates the scribe seal. The oscillator input terminal is coupled to the output of the oscillator circuit.
Abstract:
An oscillator assembly includes a scribe seal, an oscillator circuit, and a calibration circuit. The oscillator circuit includes an output. The calibration circuit is coupled to the oscillator circuit. The calibration circuit includes a reference frequency terminal, a conductor coupled to the reference frequency terminal, and an oscillator input terminal. The conductor extends to an edge of the oscillator circuit assembly and penetrates the scribe seal. The oscillator input terminal is coupled to the output of the oscillator circuit.
Abstract:
A process for forming an integrated circuit with a dilution doped resistor with a resistance that may be tuned by partially blocking the implant used to dope the resistor. A process for forming an integrated circuit with a dilution doped polysilicon resistor by partially blocking the resistor dopant implant from a portion of the polysilicon resistor body.
Abstract:
A method of placing a dummy fill layer on a substrate is disclosed (FIG. 2). The method includes identifying a sub-region of the substrate (210). A density of a layer in the sub-region is determined (212). A pattern of the dummy fill layer is selected to produce a predetermined density (216). The selected pattern is placed in the sub-region (208).
Abstract:
An integrated circuit containing a vertical interconnect that includes a region of interconnect metal continuously surrounding one or more dielectric pillars. The vertical interconnect electrically contacts a top surface of a lower conductive structure. An upper conductive structure contacts a top surface of the vertical interconnect. A process of forming an integrated circuit that includes forming a vertical interconnect that has a region of interconnect metal continuously surrounding one or more dielectric pillars. The vertical interconnect electrically contacts a top surface of a lower conductive structure, and an upper conductive structure contacts a top surface of the vertical interconnect.
Abstract:
Non-volatile latch circuits, such as in memory cells and flip-flops, that are constructed for reliability screening. The non-volatile latch circuits each include ferroelectric capacitors coupled to storage nodes, for example at the outputs of cross-coupled inverters. Separate plate lines are connected to the ferroelectric capacitors of the complementary storage nodes. A time-zero test of the latch stability margin is performed by setting a logic state at the storage nodes, then programming the state into the ferroelectric capacitors by polarization. After power-down, the plate lines are biased with a differential voltage relative to one another, and the latch is then powered up to attempt recall of the programmed state. The differential voltage disturbs the recall, and provides a measure of the cell margin and its later-life reliability.
Abstract:
An oscillator assembly includes a scribe seal, an oscillator circuit, and a calibration circuit. The oscillator circuit includes an output. The calibration circuit is coupled to the oscillator circuit. The calibration circuit includes a reference frequency terminal, a conductor coupled to the reference frequency terminal, and an oscillator input terminal. The conductor extends to an edge of the oscillator circuit assembly and penetrates the scribe seal. The oscillator input terminal is coupled to the output of the oscillator circuit.
Abstract:
Non-volatile latch circuits, such as in memory cells and flip-flops, that are constructed for reliability screening. The non-volatile latch circuits each include ferroelectric capacitors coupled to storage nodes, for example at the outputs of cross-coupled inverters. Separate plate lines are connected to the ferroelectric capacitors of the complementary storage nodes. A time-zero test of the latch stability margin is performed by setting a logic state at the storage nodes, then programming the state into the ferroelectric capacitors by polarization. After power-down, the plate lines are biased with a differential voltage relative to one another, and the latch is then powered up to attempt recall of the programmed state. The differential voltage disturbs the recall, and provides a measure of the cell margin and its later-life reliability.